HIGH FREQUENCY BAND PASS FILTER WITH COUPLED SURFACE MOUNT TRANSITION

• US 20130342287A1
• Filed: 06/25/2013
• Published: 12/26/2013
• Est. Priority Date: 06/25/2012
• Status: Active Grant

• Current Assignee: Knowles Cazenovia, Inc. (Knowles Corporation)
• Original Assignee: Dielectric Laboratories, Inc.
• Inventors: RANDALL, Steven, BATES, David Allen
• Granted Patent: US 9,490,768 B2
• Time in Patent Office: Days
• US Class Current: 333/204
• CPC Class Codes: H01P 1/2002 Dielectric waveguide filters H01P1/212, H01P1/213, H01P1/215, H01P1/219 take precedence
• CPC Class Codes: H01P 1/20363 Linear resonators
• CPC Class Codes: H01P 11/007 Manufacturing frequency-selective devices resonators H01P11/008
• CPC Class Codes: H01P 5/028 between strip lines
• CPC Class Codes: H03H 3/00 Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
• CPC Class Codes: H03H 7/004 Capacitive coupling circuits not otherwise provided for
• CPC Class Codes: H03H 7/0161 Bandpass filters H03H7/12 takes precedence
• CPC Class Codes: H03H 7/38 Impedance-matching networks

Abstract

A high frequency band pass filter with a coupled surface mount transition is provided, including a filter substrate, circuit connection elements defining input and an output elements provided on a surface of the filter substrate, electronic filter components provided on the first surface of the filter substrate, and impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output elements. Signal connection structures are provided on an opposed surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements. The respective signal connection elements are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the opposed surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the input and the output elements.

Claims

1. A high frequency passive RF device with a coupled surface mount transition, wherein electromagnetic coupling between signal connection elements on one side of a device substrate and circuit connection elements on a vertically opposed side of the device substrate form an RF signal connection, and vertical conductive structures are excluded from input and output structures thereof.

2. The high frequency passive RF device according to claim 1, wherein the device is a band pass filter.

3. A high frequency band pass filter with a coupled surface mount transition, comprising:

a dielectric filter substrate having a first surface and an opposed second surface;

circuit connection elements defining an input element and an output element provided on the first surface of the filter substrate and spaced a distance d from respective terminal edges of the first surface of the filter substrate;

electronic filter components provided on the first surface of the filter substrate;

impedance matching structures provided on the first surface of the filter substrate and interposed between the input element and the electronic filter structures and between the output element and the electronic filter components; and

signal connection elements provided on the second surface of the filter substrate in locations that positionally correspond to respective positions of the input element and output element on the first surface of the filter substrate, the signal connection elements respectively separated from a ground plane on the second surface of the filter substrate by an electrically insulating isolation area, and being spaced a distance d₂ from respective terminal edges of the second surface of the filter substrate;

whereby the respective signal connection elements on the second surface of the filter substrate are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the first surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the circuit connection elements.

4. The high frequency band pass filter with a coupled surface mount transition according to claim 3, wherein the filter substrate comprises a ceramic material having a dielectric constant in a range of 9-25.

5. The high frequency band pass filter with a coupled surface mount transition according to claim 3, wherein the input and output elements have a width dimension in a range of 0.254 mm to 0.356 mm and a length dimension in a range of 0.254 mm to 0.356 mm.

6. The high frequency band pass filter with a coupled surface mount transition according to claim 3, wherein the signal connection elements have a width dimension in a range of 0.356 mm to 0.457 mm and a length dimension in a range of 0.304 mm to 0.406 mm.

7. The high frequency band pass filter with a coupled surface mount transition according to claim 3, wherein the distance d is in a range of 0.00 mm to 0.127 mm.

8. The high frequency band pass filter with a coupled surface mount transition according to claim 3, wherein the distance d₂ is in a range of 0.00 mm to 0.076 mm.

9. A package for a high frequency active RF device with a coupled surface mount transition, wherein electromagnetic coupling between RF signal connection elements on one side of an active device substrate and RF input and output structures on a vertically opposed side of the active device substrate form an RF signal connection, and vertical conductive structures are excluded from the active device in connection with the RF input and output structures.

10. A high frequency band pass filter with a coupled surface mount transition, comprising:

a filter substrate;

circuit connection elements defining an input element and an output element provided on a first surface of the filter substrate;

electronic filter components provided on the first surface of the filter substrate;

impedance matching structures provided on the first surface of the filter substrate between the electronic filter components and the respective input and output structures; and

signal connection elements provided on an opposed second surface of the filter substrate, in locations that positionally correspond to respective positions of the input and output elements on the first surface of the filter substrate;

whereby the respective signal connection elements on the second surface of the filter substrate are capacitively coupled, through a thickness direction of the filter substrate, to a respective one of the input and output elements on the first surface of the filter substrate without the presence of any vertical conductive structures within the filter substrate at the circuit connection elements.