Inverter, Sealing Air Duct and Heat Dissipation System

• US 20130343110A1
• Filed: 08/28/2013
• Published: 12/26/2013
• Est. Priority Date: 10/18/2011
• Status: Active Grant

• Current Assignee: Huawei Digital Power Technologies Company Limited (Huawei Investment & Holding Co., Ltd.)
• Original Assignee: Huawei Technologies Co., Ltd. (Huawei Investment & Holding Co., Ltd.)
• Inventors: Liu, Xiaohu
• Granted Patent: US 9,167,729 B2
• Time in Patent Office: Days
• US Class Current: 363/141
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence
• CPC Class Codes: H05K 7/20909 Forced ventilation, e.g. on heat dissipaters coupled to components
• CPC Class Codes: H05K 7/20918 the components being isolated from air flow, e.g. hollow heat sinks, wind tunnels or funnels

Abstract

An inverter, a sealing air duct, and a heat dissipation system are disclosed. The inverter includes: an enclosure having a first cavity and a second cavity that are isolated from each other and sealed; a magnetic conversion circuit including magnetic elements that is arranged in the first cavity; a power conversion circuit including power tubes that is arranged in the second cavity; a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity; a sealing air duct arranged outside the second cavity, where the columnar pipeline is sealed at two ends, the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and the bottom surface includes an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.

Claims

1. An inverter, comprising:

an enclosure having a first cavity and a second cavity that are isolated from each other and sealed;

a magnetic conversion circuit comprising magnetic elements that is arranged in the first cavity;

a power conversion circuit comprising power tubes that is arranged in the second cavity;

a heatsink arranged at the bottom of the enclosure and located outside the first cavity and the second cavity;

a sealing air duct arranged outside the second cavity,

wherein the sealing air duct comprises at least one columnar pipeline formed by a heat dissipation surface and a bottom surface,

wherein the at least one columnar pipeline is sealed at two ends,

wherein the bottom surface is formed by a side wall of the second cavity or a substrate of the heatsink, and

wherein a bottom surface comprises an air inlet and an air outlet to communicate with the second cavity and the at least one columnar pipeline.

2. The inverter according to claim 1, wherein the heatsink comprises:

a first heatsink located outside the first cavity; and

a second heatsink located outside the second cavity,

wherein radiation fins of the first heatsink are isolated from radiation fins of the second heatsink.

3. The inverter according to claim 2, wherein the magnetic conversion circuit is set to a substrate tightly adhering to the first heatsink, and wherein the power conversion circuit is set to a substrate tightly adhering to the second heatsink.

4. The inverter according to claim 1, further comprising:

a first fan arranged inside the second cavity; and

/or

a second fan arranged outside the enclosure.

5. The inverter according to claim 1, further comprising a heat shield, wherein the heat shield is made of thermal insulation materials and is placed above the magnetic conversion circuit.

6. The inverter according to claim 1, wherein the first cavity is located above, on the left side, on the right side, or in the middle of the second cavity.

7. The inverter according to claim 2, wherein the sealing air duct is located on a lateral wall of the second cavity, or wherein the sealing air duct is arranged on the substrate of the second heatsink and is located on the left side, in the middle, or on the right side of the second heatsink.

8. The inverter according to claim 1, wherein the cross-section of the heat dissipation surface comprises a boss shape, a sawtooth shape, or a ripple wave shape.

9. The inverter according to claim 1, wherein the heat dissipation surface is formed at least in part by an alumina plate.

10. The inverter according to claim 2, wherein the heat dissipation surface is sealingly connected to a lateral wall of the second cavity or the substrate of the second heatsink.

11. The inverter according to claim 1, wherein the sealing air duct is sealed using at least one of a metal mechanical part sealing mode and a plastic parts sealing mode.

12. The inverter according to claim 1, wherein the magnetic elements comprise a boost inductor or an inverter inductor, and wherein the power tubes comprise a boost power tube or an inverter power tube.

13. A sealing air duct arranged outside a sealed cavity, comprising:

at least one columnar pipeline formed by a heat dissipation surface and a bottom surface,

wherein the at least one columnar pipeline is sealed at two ends,

wherein the bottom surface is formed by a wall of the sealed cavity, and

wherein the bottom surface comprises an air inlet and an air outlet to communicate with the cavity and the at least one columnar pipeline.

14. The sealing air duct according to claim 13, wherein the cross-section of the heat dissipation surface comprises a boss shape, a sawtooth shape, or a ripple wave shape.

15. The sealing air duct according to claim 13, wherein the heat dissipation surface is formed at least in part by an alumina plate.

16. The sealing air duct according to claim 13, wherein the heat dissipation surface is sealingly connected to the wall of the sealed cavity.

17. The sealing air duct according to claim 13, wherein the sealing air duct is sealed using at least one of a metal mechanical part sealing mode and a plastic parts sealing mode.

18. A heat dissipation system, comprising:

a heatsink arranged at a bottom of a sealed cavity and located outside the sealed cavity; and

a sealing air duct arranged outside the sealed cavity,

wherein the sealing air duct comprises at least one columnar pipeline formed by a heat dissipation surface and a bottom surface,

wherein the at least one columnar pipeline is sealed at two ends,

wherein the bottom surface is formed by a wall of the sealed cavity, and

wherein the bottom surface comprises an air inlet and an air outlet to communicate with the cavity and the at least one columnar pipeline.

19. The heat dissipation system according to claim 18, further comprising:

a first fan arranged inside the sealed cavity; and

/or

a second fan arranged outside the sealed cavity.

20. The heat dissipation system according to claim 18, wherein the sealing air duct is located on a lateral wall of the sealed cavity, or wherein the sealing air duct is arranged at the bottom of the sealed cavity and is arranged on the left side, in the middle, or on the right side of the heatsink.