IMPROVED SYSTEM FOR SUBSTRATE PROCESSING

• US 20130344629A1
• Filed: 03/02/2012
• Published: 12/26/2013
• Est. Priority Date: 03/02/2011
• Status: Abandoned Application

• Current Assignee: Rokko Systems Pte., Ltd. (KGA Capital Pte Ltd.)
• Original Assignee: Rokko Systems Pte., Ltd. (KGA Capital Pte Ltd.)
• Inventors: Baek, Seung Ho, Jung, Jong Jae, Kim, Tae Jin
• Application Number:
  US14/002,861
• Publication Number:
  US 20130344629A1
• Time in Patent Office: Days
• US Class Current: 438/16
• CPC Class Codes: B28D 5/029 with a plurality of cutting blades
• CPC Class Codes: H01L 21/67 Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302; apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto H01L24/74;
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67271 Sorting devices
• CPC Class Codes: H01L 21/67288 Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/67703 between different workstations
• CPC Class Codes: H01L 21/681 using optical controlling means
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: Y10T 83/8742 Tool pair positionable as a unit

Abstract

A method of processing IC units comprising the steps of: dicing said IC units from a substrate; delivering said IC units to a idle block; inspecting a face of said units as exposed during the dicing step using an inspection device whilst said units are on said idle block, then; engaging said units with a picker assembly; passing said units over a second inspection device to inspect an opposed face of said units.

Claims

1. A method of processing IC units comprising the steps of:

dicing said IC units from a substrate;

delivering said IC units to a idle block;

inspecting a face of said units as exposed during the dicing step using an inspection device whilst said units are on said idle block, then;

engaging said units with a picker assembly;

passing said units over a second inspection device to inspect an opposed face of said units.

2. A system for processing IC units comprising:

a dicing station for singulating said IC units from a substrate;

a idle block for receiving said IC units in an orientation as singulated;

an inspection device arranged to inspect said units on said idle block;

a picker assembly for engaging and delivering said units to a second inspection station;

and a second inspection device for inspecting an opposed face of said units.

3. A drying plate assembly for drying IC units comprising

a drying plate for receiving said IC units on a plate surface, said drying plate in heat transfer communication with a heating source for increasing the temperature of said plate;

an air vent for directing a flow of air onto said surface so as to dry said IC units;

wherein said drying plate includes conduits for receiving a flow of air from an air source, said conduits in communication with the air vent, said plate arranged to impart heat to said air whilst in the conduits so as to provide air of elevated temperature to said air vent.

4. The drying plate assembly according to claim 3, wherein said conduits selected to be of sufficient length to permit the air to reach a desired temperature.

5. The drying plate assembly according to claim 3, wherein said air vents arranged to move across the plate to ensure the air is directed across the plate surface.

6. A picker assembly for engaging a plurality of IC units, the assembly comprising:

a housing to which are mounted an array of pickers;

each picker arranged to move in reciprocal motion from a retracted position to an extended position;

a light source and corresponding target arranged adjacent to said array of pickers such that a beam from said light source to said target is directed perpendicular to a direction of said reciprocal motion;

wherein each of said pickers includes a corresponding lug mounted thereto, said lug arranged such that the corresponding picker in a retracted position places the lug distal from said beam and the corresponding picker in an extended position places said lug in a position to obstruct the beam.

7. The picker assembly according to claim 6, wherein the array of pickers is arranged in a line.

8. The picker assembly according to claim 6, wherein the array of pickers is a rectangular array, with a corresponding light source and target associated with each line of pickers within said array.

9. The picker assembly according to claim 6, wherein said light source and/or target are mounted to said housing.

10. The picker assembly according to claim 6, wherein the light source is a laser.

11. A unit picker for engaging an IC unit, comprising

a picker head having a recess in communication with a vacuum source for engaging said IC unit at an opening of said recess;

said picker head having a contact surface peripherally located about said recess;

said contact surface sized in a direction orthogonal to direction of reciprocal motion of the picker, so as to contact a peripheral edge of an inspection orifice;

wherein the picker head is in contact with said peripheral edge on insertion of the IC unit into the orifice.

12. The inspection station according to claim 11, wherein said support block includes inclined faces on a receiving void

13. An inspection chamber comprising

an inspection station arranged to inspect an IC unit, said inspection station including a light array for illuminating the IC unit;

a cover having a viewing portion so as to separate the inspection station from an operator;

wherein said light array includes a first polarizing film of a first orientation and the viewing portion of the cover having a second polarizing film, said polarizing films arranged so as to reduce the intensity of light received by the operator from the light array.

14. The inspection chamber according to claim 13, wherein said light array comprising four light sub-arrays arranged in a rectangular formation about an inspection space into which the IC unit is delivered.

15. The inspection chamber according to claim 13, wherein the first polarizing film is applied to a sub-array aligned to direct light towards said viewing portion.

16. The inspection chamber according to claim 13, further including a third and fourth film placed on opposed side sub-arrays, each having an orientation to reduce light intensity received by the operator from the sub-arrays.

17. A sorting system comprising

a plurality of net blocks, each net block arranged to receive a plurality of singulated IC units;

wherein said net blocks operate independently to cumulatively transport said plurality of singulated IC units to a sorting section.

18. The system according to claim 17 wherein there are two said net blocks.

19. The system according to claim 17 further including a plurality of good tray offloaders, said offloaders arranged to receive inspected singulated IC units from corresponding trays wherein the plurality of net blocks and plurality of good tray offloaders are separated by a plurality of unit pickers for transporting said units from the net blocks to the good tray offloaders via corresponding good unit trays.

20. A dicing saw array for the singulation of IC units from a substrate, the array comprising:

a plurality of pairs of dicing saws with each dicing saw within each pair spaced from the corresponding dicing saw;

the spacing of one pair of dicing saws being different from the spacing of the other pairs of dicing saws;

wherein the pairs of dicing saws are selectively exchangeable so as to switch between the pairs of dicing saws based upon a required spacing.

21. The dicing saw array according to claim 20 wherein the spacing of each pair corresponds to any one or a combination of:

substrate size, IC unit size, number of IC units within said substrate.

22. A dicing saw array for the singulation of IC units from a substrate, the array comprising

at least one pair of dicing saws, said dicing saws mounted to a rail in moveable engagement;

wherein the spacing of said dicing saws is adjustable through movement along said rail.

23. The dicing saw array according to claim 22 wherein the rail is a threaded rod and said moveable engagement of the dicing saws is in reverse threaded engagement, the threaded rod arranged such that rotation of the rod results in the simultaneous movement of the dicing saws along the rod in opposed directions.