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Conformally Encapsulated Multi-Electrode Arrays With Seamless Insulation

  • US 20130345780A1
  • Filed: 03/11/2013
  • Published: 12/26/2013
  • Est. Priority Date: 06/19/2012
  • Status: Active Grant
First Claim
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1. A method of fabricating an electrode array, comprising:

  • suspending at least one thin-film electrically conductive trace beam(s) over a substrate, wherein the trace beam(s) is suspended by at least one support portion(s) thereof in contact with the substrate;

    encapsulating the trace beam(s) with an electrically insulating material; and

    removing the substrate to expose an electrically conductive surface of the support portion(s) of the encapsulated trace beam(s).

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