FIXING TECHNOLOGY FOR COMPONENT ATTACH

• US 20140000804A1
• Filed: 07/02/2012
• Published: 01/02/2014
• Est. Priority Date: 07/02/2012
• Status: Abandoned Application

• Current Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Original Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Inventors: Cheh, Cheng-hai, Looi, Han Kong
• Application Number:
  US13/539,994
• Publication Number:
  US 20140000804A1
• Time in Patent Office: Days
• US Class Current: 156/275.5
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/75263 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/75745 in the upper part of the bonding apparatus, e.g. in the bonding head
• CPC Class Codes: H01L 2224/82214 using a laser
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83874 Ultraviolet [UV] curing
• CPC Class Codes: H01L 24/75 Apparatus for connecting with bump connectors or layer connectors
• CPC Class Codes: H01L 24/83 using a layer connector

Abstract

A pick and place system with an integrated light source to partially cure a light-curable adhesives onto which components have been placed. After a light-curable adhesive in liquid or low viscosity form is applied to a location on a substrate, a pick-and-place head uses a vacuum introduced to its nozzle-like opening to pick a component and place it on to the light-curable adhesive. The pick-and-place head then transmit an appropriate light through the same nozzle-like opening to at least partially cure the adhesive. The component becomes, therefore, at least partially fixed to the substrate and will not shift as the substrate is moved.

Claims

1. An apparatus comprising:

a pick-and-place head;

an aperture extending through the pick-and-place head, the aperture having a first opening to receive a vacuum from a vacuum delivery source and a second opening acting as a nozzle through which the vacuum is applied outside the head for picking up parts;

a vacuum path through which the vacuum from the vacuum delivery source is introduced coupled to the first opening of the aperture;

an optical fiber coupled to a third opening of the aperture, the third opening of the aperture being in an optical path with the second opening acting as the nozzle; and

a light source coupled to the optical fiber and configured to transmit light out of the same nozzle as that the vacuum is applied to pick up parts.

2. The apparatus in claim 1, wherein the first opening is located between the second opening and the third opening;

3. The apparatus in claim 1, wherein the light source is an ultraviolet light source.

4. The apparatus in claim 1, wherein the light source is a visible light source.

5. The apparatus in claim 1, wherein a diameter of the second opening of the aperture is between 0.5 mm and 2.5 mm.

6. The apparatus in claim 2, wherein a diameter of the second opening of the aperture is 1 mm and 2 mm.

7. The apparatus in claim 1, wherein a distance between the third opening and the second opening of the aperture is 3 mm or less.

8. A method to at least partially fix a component to a substrate comprising:

applying a light-curable adhesive to at least a location on a substrate;

applying a vacuum through an aperture in a pick-and-place head to pick up a component;

moving the pick-and-place head with the component to be adjacent to the location of the light-curable adhesive on the substrate;

placing the component on the light-curable adhesive;

transmitting a light through the aperture in the pick-and-place head to illuminate at least some of the light-curable adhesive for a sufficient length of time to at least partially cure some of the light-curable adhesive; and

transferring the substrate to a new position with the component at least partially fixed thereto.

9. The method in claim 8, wherein the light-curable adhesive is a UV adhesive and the light transmitted through the aperture is a UV light.

10. The method in claim 8, further comprising transmitting the light through the aperture in the pick-and-place head to illuminate at least some of the light-curable adhesive for a sufficient length of time to fully cure the light curable adhesive.

11. The method in claim 8, further comprising:

after placing the component, releasing the vacuum to detach the component from the pick-and-place head; and

moving the pick-and-place head away from the component.

12. The method in claim 11, wherein moving the pick-and-place head is subsequent to transmitting a light.

13. The method in claim 11, wherein transmitting the light is subsequent to moving the pick-and-place head.

14. A system comprising:

a means for applying a light-curable adhesive to at least a location on a substrate;

a vacuum means for picking a component and moving the component to be adjacent to the location of the light-curable adhesive on the substrate;

a vacuum means for placing the component on the light-curable adhesive;

a means for transmitting a light to illuminate at least some of the light-curable adhesive for a sufficient length of time to at least partially cure some of the light-curable adhesive; and

a means for transferring the substrate to a new position with the component at least partially fixed thereto.

15. The system in claim 14, wherein the means for transmitting a light comprises:

a light source;

an optical fiber; and

an aperture having a third opening coupled to the optical fiber and a second opening being in an optical path with the third opening.

16. The system in claim 15, wherein a diameter of the optical fiber is 6 mm and a diameter of the second opening of the aperture is between 0.5 mm and 2.5 mm.

17. The system in claim 14, wherein the vacuum means for picking a component comprises:

a vacuum delivery source; and

a vacuum path coupled to a first opening of an aperture, the aperture having a second opening that acts as a nozzle through which a vacuum is applied.

18. The system in claim 17, wherein the means for transmitting a light comprises:

a light source; and

an optical fiber, the optical fiber coupled to a third opening of the aperture, the third opening being in an optical path with the second opening.

19. The system in claim 14, wherein the means for transmitting a light is configured to transmit the light subsequent to the placement of a component of the vacuum means for placing the component.