LIGHT EMITTING DIODE STRUCTURE AND MANUFACTURING METHOD THEREOF
First Claim
1. A light-emitting diode (LED) structure, comprising:
- a semiconductor substrate;
a first type semiconductor layer formed on the semiconductor substrate;
a light-emitting layer formed on partial surface of the first type semiconductor layer;
a second type semiconductor layer corresponding to a top surface of the light-emitting layer and formed on the light-emitting layer;
an electrode contact layer formed on the second type semiconductor layer, wherein the electrode contact layer has a first opening exposing partial surface of the second type semiconductor layer;
a positive electrode corresponding to the first opening and formed on the exposed surface of the second type semiconductor layer; and
a negative electrode formed on the surface of the first type semiconductor layer not covered by the light-emitting layer.
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Accused Products
Abstract
A light-emitting diode structure and a manufacturing method thereof are provided. The structure includes a semiconductor substrate, a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer, an electrode contact layer, a positive electrode and a negative electrode. A stacking layer consisting of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the electrode contact layer is formed on the semiconductor substrate, and a first opening penetrates the electrode contact layer and exposes a part of the second type semiconductor layer. The positive electrode is formed in the first opening. A part of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the electrode contact layer is removed to form a platform structure. The negative electrode is formed on the exposed surface of the first type semiconductor layer.
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Citations
25 Claims
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1. A light-emitting diode (LED) structure, comprising:
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a semiconductor substrate; a first type semiconductor layer formed on the semiconductor substrate; a light-emitting layer formed on partial surface of the first type semiconductor layer; a second type semiconductor layer corresponding to a top surface of the light-emitting layer and formed on the light-emitting layer; an electrode contact layer formed on the second type semiconductor layer, wherein the electrode contact layer has a first opening exposing partial surface of the second type semiconductor layer; a positive electrode corresponding to the first opening and formed on the exposed surface of the second type semiconductor layer; and a negative electrode formed on the surface of the first type semiconductor layer not covered by the light-emitting layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A manufacturing method of an LED structure, the method comprises steps of:
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providing a semiconductor substrate; forming a stacking layer formed by a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer and an electrode contact layer in sequence on the semiconductor substrate, wherein the stacking layer has a first opening which penetrates the electrode contact layer and exposes a part of the second type semiconductor layer; inserting a metal plug in the first opening and forming a positive electrode on the exposed surface of the second type semiconductor layer; patterning the stacking layer, removing a part of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer and the electrode contact layer to form a platform structure in a light-emitting area, and exposing partial surface of the first type semiconductor layer in a non-light-emitting area; and forming a negative electrode on the exposed surface of the first type semiconductor layer. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A manufacturing method of an LED structure, the method comprises steps of:
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providing a semiconductor substrate; forming a stacking layer formed by a first type semiconductor layer, a light-emitting layer, a second type semiconductor layer, an electrode contact layer and a transparent electrode layer in sequence on the semiconductor substrate, wherein the stacking layer has a second opening which penetrates the transparent electrode layer and the electrode contact layer and exposes partial surface of the second type semiconductor layer; inserting a metal plug in the second opening and forming a positive electrode on the exposed surface of the second type semiconductor layer; patterning the stacking layer, removing a part of the first type semiconductor layer, the light-emitting layer, the second type semiconductor layer, the transparent electrode layer and the electrode contact layer to form a platform structure in a light-emitting area, and exposing partial surface of the first type semiconductor layer in a non-light-emitting area; and forming a negative electrode on the exposed surface of the first type semiconductor layer. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25)
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Specification