LIGHTING DEVICE

• US 20140001501A1
• Filed: 06/27/2013
• Published: 01/02/2014
• Est. Priority Date: 06/27/2012
• Status: Active Grant

• Current Assignee: LG Innotek Company Limited (LG Corporation)
• Original Assignee: LG Innotek Company Limited (LG Corporation)
• Inventors: PARK, Kwang Ho, PARK, Moo Ryong, KIM, Chul Hong, KIM, Ki Beom, KIM, Jin Hee, PARK, Hyung Min, CHAE, Hyun Hee
• Granted Patent: US 9,627,595 B2
• Time in Patent Office: Days
• US Class Current: 257/91
• CPC Class Codes: F21S 43/28135 Structures encapsulating the light source
• CPC Class Codes: F21V 13/08 the elements being filters or photoluminescent elements and reflectors
• CPC Class Codes: F21V 15/012 Housings with variable shape or dimensions, e.g. by means of elastically deformable materials or by movement of parts forming telescopic extensions of the housing body
• CPC Class Codes: F21V 3/02 characterised by the shape
• CPC Class Codes: F21V 3/04 characterised by materials, surface treatments or coatings
• CPC Class Codes: F21V 31/04 Provision of filling media
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; an indirect light emission unit which is formed in at least any one of one side and another side of the light source module and which reflects light irradiated from the light source; and a diffusion plate having an upper surface which is in contact with an upper part of the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto an outer side surface of the indirect light emission unit, whereby flexibility of the product itself can be secured, and durability and reliability thereof can be also improved.

Claims

1. A lighting device comprising:

a light source module comprising at least one light source on a printed circuit board, and a resin layer on the printed circuit board so that the light source is embedded;

an indirect light emission unit which is formed in at least any one of one side and another side of the light source module and which reflects light irradiated from the light source; and

a diffusion plate having an upper surface which is in contact with an upper part of the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto an outer side surface of the indirect light emission unit.

2. The lighting device according to claim 1, wherein the light source module further comprises a reflection unit between the printed circuit board and the resin layer and having a spacing part in an inner part thereof.

3. The lighting device according to claim 1, wherein the light source module further comprises an optical pattern layer on the resin layer having an optical pattern for dispersing light.

4. The lighting device according to claim 1, wherein the indirect light emission unit comprises:

a light reflection member in at least any one of the one side and the another side of the light source module; and

an indirect light-emission separated space formed between the light source module and the light reflection member.

5. The lighting device according to claim 1, wherein the resin layer is composed of an ultraviolet curing resin including an oligomer.

6. The lighting device according to claim 5, wherein the oligomer is composed in 40 to 55 wt. % and contains at least any one of urethane acrylate, epoxy acrylate, polyester acrylate, polyether acrylate, polybutadiene acrylate, and silicon acrylate.

7. The lighting device according to claim 2, wherein the reflection unit comprises:

a first reflection film adhered onto a surface of the printed circuit board; and

a second reflection film made of a transparent material and spaced apart from the first reflection film to form the spacing part.

8. The lighting device according to claim 7, wherein the reflection unit further comprises a separation member for separating the first reflection film from the second reflection film.

9. The lighting device according to claim 8, wherein the separation member is configured such that at least one or more unit separation members composed of an adhesive material which form a first separation part due to a void part formed in an inner part are disposed.

10. The lighting device according to claim 9, wherein the separation member is configured such that the plurality of unit separation members is disposed to be spaced apart from each other, and a second separation part is formed in spaces spaced apart from each other between the unit separation members.

11. The lighting device according to claim 2, wherein the light source module further comprises a reflection pattern formed on the reflection unit.

12. The lighting device according to claim 3, wherein the optical pattern layer comprises:

a first optical sheet formed an upper surface of the resin layer to disperse emitted light; and

a second optical sheet formed on the first optical sheet.

13. The lighting device according to claim 12, wherein the optical pattern layer further comprises an adhesive layer formed between the first optical sheet and the second optical sheet.

14. The lighting device according to claim 13, wherein a separated space, which surrounds a periphery portion of the optical pattern, is formed in the adhesive layer.

15. The lighting device according to claim 12, wherein the optical pattern is formed on an upper surface of the first optical sheet or a lower surface of the second optical sheet.

16. The lighting device according to claim 3, wherein the optical pattern is composed in an overlapping structure of a diffusion pattern including one or more materials selected from the group consisting of TiO₂, CaCO₃, BaSO₄, Al₂O₃, Silicon, and PS (Polystyrene), and a light shielding pattern including Al or a mixture of Al and TiO₂.

17. The lighting device according to claim 1, wherein the resin layer further comprises a diffusion material for diffusing light, which is composed of at least any one selected from the group consisting of silicon, silica, glass bubble, PMMA, urethane, Zn, Zr, Al₂O₃, and acryl.

18. The lighting device according to claim 1, wherein the light source is composed of a light source package that comprises:

a package body having a cavity;

a first lead frame including one end exposed to the cavity, and another end exposed to one surface of the package body by passing through the package body;

a second lead frame including one end exposed to one side of the one surface of the package body, another end exposed to another side of the one surface of the package body, and a middle portion exposed to the cavity; and

at least one light emitting chip disposed on a first semiconductor layer, an active layer, a second semiconductor layer and the first lead frame.

19. The lighting device according to claim 18, wherein the first lead frame comprises:

a first upper surface part exposed to the cavity; and

a first side surface part which is bent from a first side portion of the first upper surface part and which is exposed to the one surface of the package body.

20. The lighting device according to claim 19, wherein the second lead frame comprises:

a second upper surface part which is disposed around at least one side portion of the first upper surface part and which is exposed to the cavity of the package body; and

a second side surface part which is bent from the second upper surface part and which is exposed to the one side and the another side of the one surface of the package body.