DEVICES AND METHODS HAVING CAPACITANCE SENSE STRUCTURE FORMED OVER HOUSING SURFACE

• US 20140002112A1
• Filed: 08/23/2013
• Published: 01/02/2014
• Est. Priority Date: 12/29/2011
• Status: Abandoned Application

• Current Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Original Assignee: Cypress Semiconductor Corporation (Infineon Technologies AG)
• Inventors: Bollesen, Michael, Wright, David G.
• Application Number:
  US13/975,197
• Publication Number:
  US 20140002112A1
• Time in Patent Office: Days
• US Class Current: 324/658
• CPC Class Codes: G01D 5/24 by varying capacitance
• CPC Class Codes: G06F 1/1643 the display being associated to a digitizer, e.g. laptops that can be used as penpads details related to the relative motion of the display enclosure with respect to the body enclosure, e.g. to move between laptop and tablet PC configuration G06F1/1615
• CPC Class Codes: G06F 1/169 the I/O peripheral being an integrated pointing device, e.g. trackball in the palm rest area, mini-joystick integrated between keyboard keys, touch pads or touch stripes G06F1/1643 takes precedence; constructional details of pointing devices G06F3/033
• CPC Class Codes: G06F 2203/0339 Touch strips, e.g. orthogonal touch strips to control cursor movement or scrolling; single touch strip to adjust parameter or to implement a row of soft keys
• CPC Class Codes: G06F 3/03547 Touch pads, in which fingers can move on a surface
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A device can include a molded housing having at least a first surface, and configured to contain electronic components; a capacitance sense structure attached to the first surface; and a capacitance sensing circuit comprising at least one integrated circuit device electrically coupled to the capacitance sense structure.

Claims

1. A device, comprising:

a molded housing having at least a first surface, and configured to contain electronic components;

a capacitance sense structure attached to the first surface; and

a capacitance sensing circuit comprising at least one integrated circuit device electrically coupled to the capacitance sense structure.

2. The device of claim 1, wherein:

the first surface is an inside surface of the housing opposite to an exterior surface of the housing.

3. The device of claim 2, further including:

a user indication formed on the exterior surface opposite to the capacitance sense structure.

4. The device of claim 1, wherein:

the capacitance sense structure comprises at least a first conductive pattern.

5. The device of claim 4, wherein:

the first conductive pattern is attached to the surface by any selected from the group of;

attachment by an intervening layer;

direct attachment to the first surface;

embedding into the first surface;

formation within a housing wall; and

mechanical attachment to the first surface.

6. The device of claim 4, wherein:

the capacitance sense structure further includes a second conductive pattern separated from the first conductive pattern by an insulating material.

7. The device of claim 1, wherein:

the at least one integrated circuit device is electrically coupled to the first conductive pattern by vertical conductive connections that extend from the first surface.

8. A device, comprising:

a molded housing having a housing wall with a capacitance sense area;

a conductive capacitance sense pattern formed on the housing wall at the capacitance area; and

at least one integrated circuit device, including a capacitance sensing circuit, which is electrically connected to the conductive capacitance sense pattern.

9. The device of claim 8, wherein:

the capacitance sense area is an external surface of the housing wall; and

the conductive capacitance sense pattern is formed on an internal surface of the housing wall.

10. The device of claim 8, wherein:

the conductive capacitance sense pattern is selected from the group of;

a printed conductive ink, a deposited conductive material, and a pre-patterned conductive layer.

11. The device of claim 8, wherein:

the at least one integrated circuit device is electrically connected to the conducive capacitance sense pattern by a circuit board.

12. The device of claim 8, wherein:

the at least one integrated circuit device is directly mounted on the housing wall.

13. The device of claim 8, wherein:

the device is selected from the group of;

a computing device with a keyboard, and the capacitance sense area comprises a palm rest area adjacent to the keyboard;

an electronic display, and the capacitance sense area comprises an area peripheral to the electronic display;

a human interface device for a computing system; and

a touch input for an electrical system.

14. A method, comprising:

forming a first capacitance sense conductive pattern on a first surface of an electronic device housing; and

electrically connecting at least one integrated circuit device to the first capacitance sense conductive pattern;

wherein

the at least one integrated circuit device comprises at least a portion of a capacitance sensing circuit.

15. The method of claim 14, wherein:

forming the first capacitance sensing conductive pattern on the first surface includes any selected from the group of;

mechanically attaching the first capacitance sensing conductive pattern to the housing surface;

patterning a conductive layer formed on the first surface to create the first capacitance sensing conductive pattern;

embedding the first capacitance sensing conductive pattern in the first surface;

enclosing the first capacitance sensing conductive pattern in a wall of the device housing; and

printing the first capacitance sensing conductive pattern on the first surface.

16. The method of claim 14, further including:

the housing includes a second surface opposite to the first surface; and

forming a user indication on a second surface opposite to the first capacitance sense conductive pattern.

17. The method of claim 16, wherein:

forming the user indication on the second surface includes any selected from the group of;

printing the user indication on the second surface;

etching the second surface;

forming variations in a texture of the second surface;

changing a color of the second surface;

attaching a decal to the second surface; and

providing illumination at the second surface.

18. The method of claim 14, wherein:

forming a second capacitance sense conductive pattern on the first capacitance sensing conductive pattern; and

electrically connecting the at least one integrated circuit device to the second capacitance sense conductive pattern.

19. The method of claim 18, wherein:

forming the second capacitance sensing conductive pattern includes forming an insulating layer over the first second capacitance sensing conductive pattern, and forming the second capacitance sensing conductive pattern over the insulating layer.

20. The method of claim 18, wherein:

forming the first capacitance sensing conductive pattern includes forming first electrodes disposed in a first direction;

forming the second capacitance sensing conductive pattern includes forming second electrodes disposed in a second direction different than the first direction.