INTEGRATED RF FRONT END SYSTEM
First Claim
Patent Images
1. An integrated front-end module comprising:
- a silicon substrate having a high-resistivity portion; and
a bipolar transistor featuring a silicon or silicon-germanium alloy base disposed on the substrate above the high-resistivity portion.
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Abstract
Systems and methods are disclosed for integrating functional components of front-end modules for wireless radios. Front-end modules disclosed may be dual-band front-end modules for use in 802.11ac-compliant devices. In certain embodiments, integration of front-end module components on a single die is achieved by implementing a high-resistivity layer or substrate directly underneath, adjacent to, and/or supporting SiGe BiCMOS technology elements.
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Citations
25 Claims
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1. An integrated front-end module comprising:
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a silicon substrate having a high-resistivity portion; and a bipolar transistor featuring a silicon or silicon-germanium alloy base disposed on the substrate above the high-resistivity portion. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of fabricating an integrated front-end module comprising:
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providing at least a portion of a high-resistivity bulk silicon substrate; and forming one or more transistors on the high-resistivity substrate. - View Dependent Claims (18)
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19. A semiconductor die comprising:
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a silicon substrate including a high-resistivity portion and being configured to receive a plurality of components; and RF front-end circuitry disposed on the substrate, the RF front-end circuitry including a bipolar transistor featuring a silicon or silicon-germanium alloy base disposed above the high-resistivity portion. - View Dependent Claims (20, 21)
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22. A radio-frequency (RF) module comprising:
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a packaging substrate configured to receive a plurality of components; a die mounted on the packaging substrate, the die having a high-resistivity substrate portion, a switch, a power amplifier including an SiGe bipolar transistor disposed above the high-resistivity substrate portion, and one or more passive devices; and a plurality of connectors configured to provide electrical connections between the die and the packaging substrate. - View Dependent Claims (23, 24)
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25. A radio-frequency (RF) device comprising:
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a baseband circuit assembly configured to process RF signals; RF front-end circuitry disposed on a substrate having a high-resistivity portion, the RF front-end circuitry including a switch, one or more passive devices, and a power amplifier including a bipolar transistor featuring a silicon or silicon-germanium allow base disposed above the high-resistivity portion; and an antenna in communication with at least a portion of the RF front-end circuitry to facilitate transmission and reception of the RF signals.
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Specification