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INTEGRATED RF FRONT END SYSTEM

  • US 20140002187A1
  • Filed: 06/28/2012
  • Published: 01/02/2014
  • Est. Priority Date: 06/28/2012
  • Status: Active Grant
First Claim
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1. An integrated front-end module comprising:

  • a silicon substrate having a high-resistivity portion; and

    a bipolar transistor featuring a silicon or silicon-germanium alloy base disposed on the substrate above the high-resistivity portion.

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