INTEGRATED LED BASED ILLUMINATION DEVICE

• US 20140003044A1
• Filed: 09/03/2013
• Published: 01/02/2014
• Est. Priority Date: 09/06/2012
• Status: Abandoned Application

• Current Assignee: Xicato, Inc.
• Original Assignee: Xicato, Inc.
• Inventors: Harbers, Gerard, Bierhuizen, Serge J. A., Eberle, Stefan, Kakuda, Tyler Robin
• Application Number:
  US14/017,201
• Publication Number:
  US 20140003044A1
• Time in Patent Office: Days
• US Class Current: 362/230
• CPC Class Codes: F21K 9/64 using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
• CPC Class Codes: F21V 13/04 the elements being reflectors and refractors for vehicle rear lights F21S43/40
• CPC Class Codes: F21V 19/0015 Fastening arrangements intended to retain light sources
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 3/12 the coatings comprising photoluminescent substances
• CPC Class Codes: F21V 31/005 Sealing arrangements therefor
• CPC Class Codes: F21V 7/0083 Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane combination of two or more reflectors F21V7/0025
• CPC Class Codes: F21Y 2105/10 comprising a two-dimensional array of point-like light-generating elements
• CPC Class Codes: F21Y 2113/13 comprising an assembly of point-like light sources
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0058 relating to optical field-shaping elements
• CPC Class Codes: H01L 2933/0075 relating to heat extraction or cooling elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

A light emitting diode (LED) based illumination device include a plurality of LEDS mounted to mounting board and includes a transmissive plate disposed above the LEDs. The transmissive plate includes an amount of wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs. A base reflector structure is coupled to the LED mounting board and the transmissive plate between at least two of the LEDs. In another configuration, a dam of reflective material surrounds the LEDs and is coupled to the LED mounting board and the transmissive plate, while a dam of thermally conductive material surrounds the dam of reflective material. In another configuration, the LED mounting board has a protrusion of thermally conductive material that surrounds the LEDs and is coupled to the transmissive plate, and has a void on the side opposite the protrusion.

Claims

1. An LED based illumination device comprising:

a plurality of LEDs mounted to an LED mounting board;

a first transmissive plate disposed above the plurality of LEDs, the first transmissive plate includes a first amount of a first wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs; and

a base reflector structure coupled to the LED mounting board between at least two of the plurality of LEDs and extending to the first transmissive plate over a contact area.

2. The LED based illumination device of claim 1, wherein the contact area between the base reflector structure and the first transmissive plate is shaped as a grid pattern between the plurality of LEDs.

3. The LED based illumination device of claim 1, wherein the contact area between the base reflector structure and the first transmissive plate is a matrix of contact points between the plurality of LEDs.

4. The LED based illumination device of claim 1, further comprising:

a plurality of total internal reflection (TIR) lens elements disposed between each of the plurality of LEDs and the first transmissive plate, wherein each of the TIR lens elements are disposed within the base reflector structure.

5. The LED based illumination device of claim 1, further comprising:

an encapsulant material disposed between the base reflector structure and the first transmissive plate over the plurality of LEDs.

6. The LED based illumination device of claim 1, further comprising:

a second transmissive plate disposed above the first transmissive plate, the second transmissive plate includes a second amount of a second wavelength converting material configured to change the wavelength of a second amount of light emitted by the plurality of LEDs.

7. The LED based illumination device of claim 1, wherein the first transmissive plate includes a second amount of a second wavelength converting material configured to change a wavelength of the amount of light emitted by the plurality of LEDs.

8. An LED based illumination device comprising:

a plurality of LEDs mounted to an LED mounting board;

a first transmissive plate disposed above the plurality of LEDs, the first transmissive plate includes a first amount of a first wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs;

a dam of reflective material surrounding the plurality of LEDs and coupled to the LED mounting board and the first transmissive plate; and

a dam of thermally conductive material surrounding the dam of reflective material, wherein the dam of thermally conductive material is coupled to the LED mounting board and the first transmissive plate.

9. The LED based illumination device of claim 8, wherein the dam of thermally conductive material is spaced apart from the dam of reflective material.

10. The LED based illumination device of claim 8, wherein the dam of thermally conductive material is in contact with the dam of reflective material.

11. The LED based illumination device of claim 8, wherein the dam of reflective material optically shields the dam of thermally conductive material from the amount of light emitted by the plurality of LEDs.

12. The LED based illumination device of claim 8, further comprising:

a plurality of total internal reflection (TIR) lens elements disposed between each of the plurality of LEDs and the first transmissive plate.

13. The LED based illumination device of claim 8, further comprising:

an encapsulant material disposed between the plurality of LEDs and the first transmissive plate.

14. The LED based illumination device of claim 8, further comprising:

a second transmissive plate disposed above the first transmissive plate, the second transmissive plate includes a second amount of a second wavelength converting material configured to change a wavelength of the amount of light emitted by the plurality of LEDs.

15. The LED based illumination device of claim 8, wherein the first transmissive plate includes a second amount of a second wavelength converting material configured to change a wavelength of the amount of light emitted by the plurality of LEDs.

16. An LED based illumination device comprising:

a plurality of LEDs;

an optically transmissive element disposed above the plurality of LEDs, the optically transmissive element includes a first amount of a first wavelength converting material configured to change a wavelength of an amount of light emitted by the plurality of LEDs; and

an LED mounting board, the plurality of LEDs mounted on a first side of the LED mounting board, the LED mounting board having a protrusion of thermally conductive material on the first side of the LED mounting board surrounding the plurality of LEDs, wherein the LED mounting board is coupled to the optically transmissive element at the protrusion, and wherein the LED mounting board includes a void on a second side of the LED mounting board opposite the protrusion.

17. The LED based illumination device of claim 16, wherein the protrusion is formed on the first side of the LED mounting board by forming the void on the second side of the LED mounting board.

18. The LED based illumination device of claim 16, wherein the optically transmissive element is a transmissive plate.

19. The LED based illumination device of claim 16, wherein the optically transmissive element is a shaped lens element.

20. The LED based illumination device of claim 16, further comprising:

an encapsulant material disposed between the plurality of LEDs and the optically transmissive element.