METHOD OF MANUFACTURING AN LED

• US 20140004636A1
• Filed: 06/13/2013
• Published: 01/02/2014
• Est. Priority Date: 06/28/2012
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: TAKAHASHI, Tomokazu, AKIZUKI, Shinya, SUGIMURA, Toshimasa, MATSUMURA, Takeshi, UENDA, Daisuke
• Application Number:
  US13/917,135
• Publication Number:
  US 20140004636A1
• Time in Patent Office: Days
• US Class Current: 438/29
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68336 involving stretching of the auxiliary support post dicing
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/60 Reflective elements

Abstract

A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.

Claims

1. A method of manufacturing an LED, the method comprising:

back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and

attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.

2. A method of manufacturing an LED according to claim 1, wherein the attaching a protective sheet comprises, prior to the back-grinding, attaching the protective sheet on an outer side of the light emitting element of the LED wafer.

3. A method of manufacturing an LED according to claim 2,

wherein the grinding the substrate in the back-grinding is carried out by attaching the protective sheet to a table via a pressure-sensitive adhesive wax to fix the LED wafer to the table, and

wherein the method further comprises, after the grinding the substrate, taking off the protective sheet to remove, from the LED wafer, the pressure-sensitive adhesive wax adhering on the LED wafer with the protective sheet, which has been released from the table.

4. A method of manufacturing an LED according to claim 1, wherein the attaching a protective sheet comprises, after the grinding the substrate in the back-grinding, attaching the protective sheet on an outer side of the substrate of the LED wafer.

5. A method of manufacturing an LED according to claim 1, further comprising, after the back-grinding, forming a reflective layer.