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PHOTONIC SEMICONDUCTOR DEVICES IN LLC ASSEMBLY WITH CONTROLLED MOLDING BOUNDARY AND METHOD FOR FORMING SAME

  • US 20140008778A1
  • Filed: 07/10/2013
  • Published: 01/09/2014
  • Est. Priority Date: 10/01/2009
  • Status: Active Grant
First Claim
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1. A laminate leadless carrier package comprising:

  • a photonic semiconductor chip;

    a substrate supporting said photonic semiconductor chip, said substrate comprising a plurality of conductive and dielectric layers laminated together including a bottom conductive layer, a top conductive layer, and a dielectric layer between said top and bottom conductive layers;

    a plurality of conductive slotted vias providing electrical connections between said top conductive layer and said bottom conductive layer;

    a wire bond pad disposed on said top surface of said substrate;

    a wire bond coupled to said photonic semiconductor chip and said wire bond pad; and

    an encapsulation covering said photonic semiconductor chip, said wire bond, and at least a portion of said top surface of said substrate, wherein said encapsulation is a molding compound, and said molding compound is pulled back from at least one of said slotted vias,wherein said laminate leadless carrier package is arranged to be mounted in a side-looker configuration on a printed circuit board, said active area of said photonic semiconductor chip is perpendicular to said printed circuit board, and said slotted vias are arranged to be in electrical contact with said printed circuit board.

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