PHOSPHOR LAYER-COVERED LED, PRODUCING METHOD THEREOF, AND LED DEVICE

• US 20140009060A1
• Filed: 06/10/2013
• Published: 01/09/2014
• Est. Priority Date: 06/29/2012
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: KIMURA, Ryuichi, KATAYAMA, Hiroyuki, EBE, Yuki, ONISHI, Hidenori, FUKE, Kazuhiro
• Application Number:
  US13/914,116
• Publication Number:
  US 20140009060A1
• Time in Patent Office: Days
• US Class Current: 313/498
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H05B 33/10 Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Abstract

A method for producing a phosphor layer-covered LED includes the steps of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray; attaching an LED to the support board via the pressure-sensitive adhesive layer; disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer; cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.

Claims

1. A method for producing a phosphor layer-covered LED comprising:

a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray;

an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer;

a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer;

a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and

an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.

2. The method for producing a phosphor layer-covered LED according to claim 1, wherein

the phosphor layer is formed of a phosphor sheet.

3. The method for producing a phosphor layer-covered LED according to claim 1, wherein

in the covering step, the LED is covered with the phosphor layer that is in a B-stage state and thereafter, the phosphor layer is cured to be brought into a C-stage state.

4. The method for producing a phosphor layer-covered LED according to claim 1, wherein

the phosphor layer includes

a cover portion that covers the LED and

a reflector portion that contains a light reflecting component and is formed so as to surround the cover portion.

5. The method for producing a phosphor layer-covered LED according to claim 1, wherein

in the preparing step, the support sheet is prepared so that a reference mark, which serves as a reference of cutting in the cutting step, is provided in advance.

6. A phosphor layer-covered LED obtained by a method for producing a phosphor layer-covered LED comprising:

a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray;

an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer;

a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer;

a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and

an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.

7. An LED device comprising:

a board and

a phosphor layer-covered LED mounted on the board, wherein

the phosphor layer-covered LED is obtained by a method for producing a phosphor layer-covered LED comprising;

a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray;

an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer;

a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer;

a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and

an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.