PHOSPHOR LAYER-COVERED LED, PRODUCING METHOD THEREOF, AND LED DEVICE
First Claim
1. A method for producing a phosphor layer-covered LED comprising:
- a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray;
an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer;
a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer;
a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and
an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for producing a phosphor layer-covered LED includes the steps of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray; attaching an LED to the support board via the pressure-sensitive adhesive layer; disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer; cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.
-
Citations
7 Claims
-
1. A method for producing a phosphor layer-covered LED comprising:
-
a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray; an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer; a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer; a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer. - View Dependent Claims (2, 3, 4, 5)
-
-
6. A phosphor layer-covered LED obtained by a method for producing a phosphor layer-covered LED comprising:
-
a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray; an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer; a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer; a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.
-
-
7. An LED device comprising:
-
a board and a phosphor layer-covered LED mounted on the board, wherein the phosphor layer-covered LED is obtained by a method for producing a phosphor layer-covered LED comprising; a preparing step of preparing a support sheet including a hard support board and a pressure-sensitive adhesive layer laminated at one surface in a thickness direction of the support board and having a pressure-sensitive adhesive force capable of being reduced by application of an active energy ray; an LED attaching step of attaching an LED to the support board via the pressure-sensitive adhesive layer; a covering step of disposing a phosphor layer at the one surface in the thickness direction of the support board so as to cover the LED with the phosphor layer; a cutting step of, after the covering step, cutting the phosphor layer corresponding to the LED to produce a phosphor layer-covered LED including the LED and the phosphor layer covering the LED; and an LED peeling step of, after the cutting step, peeling the phosphor layer-covered LED from the pressure-sensitive adhesive layer by applying an active energy ray at least from one side in the thickness direction to the pressure-sensitive adhesive layer.
-
Specification