COIL COMPONENT
First Claim
1. A coil component comprising:
- a substrate;
a planar spiral conductor that is formed on a surface of the substrate by electrolytic plating;
a lead conductor that is formed on the surface of the substrate and connected to an outer peripheral end of the planar spiral conductor;
a dummy lead conductor that is formed on the surface of the substrate and between an outermost turn of the planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane;
an external electrode that is formed in parallel with the surface of the substrate; and
a bump electrode that is formed on a surface of the lead conductor by electrolytic plating and connects the lead conductor with the external electrode, whereinthe external electrode has an area greater than that of the bump electrode.
1 Assignment
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Accused Products
Abstract
A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.
117 Citations
16 Claims
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1. A coil component comprising:
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a substrate; a planar spiral conductor that is formed on a surface of the substrate by electrolytic plating; a lead conductor that is formed on the surface of the substrate and connected to an outer peripheral end of the planar spiral conductor; a dummy lead conductor that is formed on the surface of the substrate and between an outermost turn of the planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane; an external electrode that is formed in parallel with the surface of the substrate; and a bump electrode that is formed on a surface of the lead conductor by electrolytic plating and connects the lead conductor with the external electrode, wherein the external electrode has an area greater than that of the bump electrode. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A coil component comprising:
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a substrate having top and bottom surfaces; a first planar spiral conductor that is formed on the top surface of the substrate by electrolytic plating; a second planar spiral conductor that is formed on the bottom surface of the substrate by electrolytic plating; a first through-hole conductor that penetrates the substrate to connect an inner peripheral end of the first planar spiral conductor with an inner peripheral end of the second planar spiral conductor; a first dummy lead conductor that is formed on the top surface of the substrate and between an outermost turn of the first planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane; a second dummy lead conductor that is formed on the bottom surface of the substrate and between an outermost turn of the second planar spiral conductor and an end of the substrate, and free from an electrical connection with another conductor at least within the same plane; a first lead conductor that is formed on the top surface of the substrate and vertically overlapped with the second dummy lead conductor, and is connected to an outer peripheral end of the first planar spiral conductor; a second lead conductor that is formed on the bottom surface of the substrate and vertically overlapped with the first dummy lead conductor, and is connected to an outer peripheral end of the second planar spiral conductor; a second through-hole conductor that penetrates the substrate to connect the first dummy lead conductor with the second lead conductor; first and second external electrodes that are formed in parallel with the top surface of the substrate; a first bump electrode that is formed on a surface of the first lead conductor by electrolytic plating and connects the first lead conductor with the first external electrode; and a second bump electrode that is formed on a surface of the first dummy lead conductor by electrolytic plating and connects the first dummy lead conductor with the second external electrode, wherein the first external electrode has an area greater than that of the first bump electrode, and the second external electrode has an area greater than that of the second bump electrode. - View Dependent Claims (9, 10, 11, 12)
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13. A coil component comprising:
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a substrate; first and second spiral conductors that are formed on one and the other of main surfaces of the substrate, respectively; a first terminal electrode that is formed on the one main surface and connected to an outer peripheral end of the first spiral conductor; a second terminal electrode that is formed on the other main surface and connected to an outer peripheral end of the second spiral conductor; a first through-hole conductor that penetrates the substrate to connect inner peripheral ends of the first and second spiral conductors each other; a first dummy terminal electrode that is formed on the one main surface and vertically overlapped with the second terminal electrode; a second dummy terminal electrode that is formed on the other main surface and vertically overlapped with the first terminal electrode; a second through-hole conductor that penetrates the substrate to connect the first dummy terminal electrode with the second terminal electrode; a first metal magnetic powder-containing resin layer that is formed on the one main surface and covers the first spiral conductor, the first terminal electrode, and the first dummy terminal electrode; a second metal magnetic powder-containing resin layer that is formed on the other main surface and covers the second spiral conductor, the second terminal electrode, and the second dummy terminal electrode; a first lead electrode that penetrates the first metal magnetic powder-containing resin layer and is connected to a top surface of the first terminal electrode; and a second lead electrode that penetrates the first metal magnetic powder-containing resin layer and is connected to a top surface of the first dummy terminal electrode, wherein outer side surfaces of the first and second terminal electrodes, the first and second dummy terminal electrodes, and the first and second lead electrodes are each exposed without being covered with the first and second metal magnetic powder-containing resin layers, and side surfaces of the substrate lying on the same planes as the outer side surfaces of the first and second terminal electrodes are exposed without being covered with the first and second metal magnetic powder-containing resin layers. - View Dependent Claims (14, 15, 16)
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Specification