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IMAGING MODULE, LENS-ATTACHED IMAGING MODULE, ENDOSCOPE, METHOD OF MANUFACTURING IMAGING MODULE, AND FLEXIBLE WIRING SUBSTRATE FORMATION APPARATUS

  • US 20140009593A1
  • Filed: 09/06/2013
  • Published: 01/09/2014
  • Est. Priority Date: 03/30/2012
  • Status: Active Grant
First Claim
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1. An imaging module comprising:

  • an electrical cable;

    a solid-state image sensing device comprising an imaging unit orthogonal to a direction of an axis of a front end of the electrical cable; and

    a flexible wiring substrate comprising;

    a device-mounted portion onto which the solid-state image sensing device is mounted;

    two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion;

    two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and

    terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device to the electrical cable.

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