IMAGING MODULE, LENS-ATTACHED IMAGING MODULE, ENDOSCOPE, METHOD OF MANUFACTURING IMAGING MODULE, AND FLEXIBLE WIRING SUBSTRATE FORMATION APPARATUS
First Claim
1. An imaging module comprising:
- an electrical cable;
a solid-state image sensing device comprising an imaging unit orthogonal to a direction of an axis of a front end of the electrical cable; and
a flexible wiring substrate comprising;
a device-mounted portion onto which the solid-state image sensing device is mounted;
two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion;
two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and
terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device to the electrical cable.
1 Assignment
0 Petitions
Accused Products
Abstract
An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted; two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion; two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.
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Citations
28 Claims
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1. An imaging module comprising:
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an electrical cable; a solid-state image sensing device comprising an imaging unit orthogonal to a direction of an axis of a front end of the electrical cable; and a flexible wiring substrate comprising;
a device-mounted portion onto which the solid-state image sensing device is mounted;
two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion;
two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and
terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device to the electrical cable. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A method of manufacturing an imaging module, comprising:
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preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof; mounting a solid-state image sensing device onto a mount face of the device-mounted portion; bending portions which are located at both sides of the device-mounted portion, from the device-mounted portion, thereby forming two extended portions extending from the device-mounted portion to a back face side opposite to the mount face of the device-mounted portion and two connection end portions, the two connection end portions extending from the two extended portions, respectively; filling an inside region surrounded by the two extended portions and the device-mounted portion with resin, and adhesively fixing the two extended portions to each other; and connecting an electrical cable to a terminal provided at an external face side of each of the two connection end portions. - View Dependent Claims (18, 20)
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17. A method of manufacturing an imaging module, comprising:
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preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof; mounting a solid-state image sensing device onto a mount face of the device-mounted portion; connecting an electrical cable to a terminal provided at an external face side of each of two connection end portions of the flexible wiring substrate; bending portions which are located at both sides of the device-mounted portion, from the device-mounted portion, thereby forming two extended portions extending from the device-mounted portion to a back face side opposite to the mount face of the device-mounted portion and the two connection end portions, the two connection end portions extending from the two extended portions, respectively; and filling an inside region surrounded by the two extended portions and the device-mounted portion with resin, and adhesively fixing the two extended portions to each other. - View Dependent Claims (19, 21)
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22. A flexible wiring substrate formation apparatus comprising:
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a flexible-wiring-substrate mounting stage on which an elongated flexible wiring substrate is to be mounted; a pin-attached elevating stage comprising;
an elevating stage capable of moving up and down relative to the flexible-wiring-substrate mounting stage;
a pin protruding from the elevating stage; and
a flat mounted-portion contacting face with which a device-mounted portion comes into contact, the device-mounted portion being located at a center region of the flexible wiring substrate in a longitudinal direction thereof, the mounted-portion contacting face being formed around the pin; anda pair of movable pressing members provided on the flexible-wiring-substrate mounting stage, varying a separated distance therebetween by sliding motion along an upper surface of the flexible-wiring-substrate mounting stage, wherein the pin-attached elevating stage is movable between an initial position and a safety position due to elevation of the pin-attached elevating stage, an upper face of the pin-attached elevating stage substantially coincides with the upper surface of the flexible-wiring-substrate mounting stage at the initial position, the safety position is located under the initial position.
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23. A method of manufacturing an imaging module, comprising:
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preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof; mounting a solid-state image sensing device onto a mount face of the device-mounted portion; using a flexible wiring substrate formation apparatus, the flexible wiring substrate formation apparatus comprising;
a flexible-wiring-substrate mounting stage on which the flexible wiring substrate is to be mounted;
a pin-attached elevating stage comprising;
an elevating stage capable of moving up and down relative to the flexible-wiring-substrate mounting stage;
a pin protruding from the elevating stage; and
a flat mounted-portion contacting face with which a device-mounted portion comes into contact, the device-mounted portion being located at a center region of the flexible wiring substrate in a longitudinal direction thereof, the mounted-portion contacting face being formed around the pin; and
a pair of movable pressing members provided on the flexible-wiring-substrate mounting stage, varying a separated distance therebetween by sliding motion along an upper surface of the flexible-wiring-substrate mounting stage, the pin-attached elevating stage being movable between an initial position and a safety position due to elevation of the pin-attached elevating stage, an upper face of the pin-attached elevating stage substantially coinciding with the upper surface of the flexible-wiring-substrate mounting stage at the initial position, the safety position being located under the initial position;allowing the device-mounted portion of the flexible wiring substrate to come into contact with the mounted-portion contacting face provided at the pin of the pin-attached elevating stage positioned at the initial position, bending portions which are located at both sides of the device-mounted portion of the flexible wiring substrate, from the device-mounted portion, placing rear portions at a gap between the pair of movable pressing members in an opened state, the rear portions extending from the device-mounted portion to a rear side opposite to the mount face of the device-mounted portion; allowing the pair of movable pressing members to approach each other, and allowing a pair of the rear portions of the flexible wiring substrate to approach each other, thereby forming two extended portions and two connection end portions, the two connection end portions extending from the two extended portions, respectively; moving the pin-attached elevating stage downwardly from the initial position to the safety position, detaching the pin from a space surrounded by the device-mounted portion and the extended portions located at both sides of the device-mounted portion, filling the space with resin, and curing the resin; and connecting an electrical cable to a terminal provided at an external face side of each of the two connection end portions. - View Dependent Claims (25, 27)
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24. A method of manufacturing an imaging module, comprising:
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preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof; mounting a solid-state image sensing device onto a mount face of the device-mounted portion; connecting an electrical cable to a terminal provided at an external face side of each of two connection end portions of the flexible wiring substrate; using a flexible wiring substrate formation apparatus, the flexible wiring substrate formation apparatus comprising;
a flexible-wiring-substrate mounting stage on which the flexible wiring substrate is to be mounted;
a pin-attached elevating stage comprising;
an elevating stage capable of moving up and down relative to the flexible-wiring-substrate mounting stage;
a pin protruding from the elevating stage; and
a flat mounted-portion contacting face with which a device-mounted portion comes into contact, the device-mounted portion being located at a center region of the flexible wiring substrate in a longitudinal direction thereof, the mounted-portion contacting face being formed around the pin; and
a pair of movable pressing members provided on the flexible-wiring-substrate mounting stage, varying a separated distance therebetween by sliding motion along an upper surface of the flexible-wiring-substrate mounting stage, the pin-attached elevating stage being movable between an initial position and a safety position due to elevation of the pin-attached elevating stage, an upper face of the pin-attached elevating stage substantially coinciding with the upper surface of the flexible-wiring-substrate mounting stage at the initial position, the safety position being located under the initial position;allowing the device-mounted portion of the flexible wiring substrate to come into contact with the mounted-portion contacting face provided at the pin of the pin-attached elevating stage positioned at the initial position, bending portions which are located at both sides of the device-mounted portion of the flexible wiring substrate, from the device-mounted portion, placing rear portions at a gap between the pair of movable pressing members in an opened state, the rear portions extending from the device-mounted portion to a rear side opposite to the mount face of the device-mounted portion; allowing the pair of movable pressing members to approach each other, and allowing a pair of the rear portions of the flexible wiring substrate to approach each other, thereby forming two extended portions and the two connection end portions, the two connection end portions extending from the two extended portions, respectively; and moving the pin-attached elevating stage downwardly from the initial position to the safety position, detaching the pin from a space surrounded by the device-mounted portion and the extended portions located at both sides of the device-mounted portion, filling the space with resin, and curing the resin. - View Dependent Claims (26, 28)
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Specification