IMAGING MODULE, LENS-ATTACHED IMAGING MODULE, ENDOSCOPE, METHOD OF MANUFACTURING IMAGING MODULE, AND FLEXIBLE WIRING SUBSTRATE FORMATION APPARATUS

• US 20140009593A1
• Filed: 09/06/2013
• Published: 01/09/2014
• Est. Priority Date: 03/30/2012
• Status: Active Grant

• Current Assignee: Fujikura Limited
• Original Assignee: Fujikura Limited
• Inventors: SEGI, Takeshi, YAMAGAMI, Katsuya, NAKATATE, Kenichi, MATSUDA, Yusuke
• Granted Patent: US 9,814,371 B2
• Time in Patent Office: Days
• US Class Current: 348/76
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/005 Flexible endoscopes
• CPC Class Codes: A61B 1/04 combined with photographic or television appliances
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: G02B 23/2484 Arrangements in relation to a camera or imaging device processing or control of video signals generated by an endoscope H04N23/60, H04N23/70
• CPC Class Codes: H01L 2224/1134 Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/1146 Plating
• CPC Class Codes: H01L 2224/13101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/532 Conductor

Abstract

An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a flexible wiring substrate including: a device-mounted portion onto which the solid-state image sensing device is mounted; two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion; two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device and the electrical cable.

Claims

1. An imaging module comprising:

an electrical cable;

a solid-state image sensing device comprising an imaging unit orthogonal to a direction of an axis of a front end of the electrical cable; and

a flexible wiring substrate comprising;

a device-mounted portion onto which the solid-state image sensing device is mounted;

two extended portions which bend at both sides of the device-mounted portion and extend from the device-mounted portion so as to come close to each other with increasing distance from the device-mounted portion;

two connection end portions extending from the two extended portions along the direction of the axis of the front end of the electrical cable on an opposite side of the device-mounted portion; and

terminals which are provided on the two connection end portions and connected to the electrical cable, the flexible wiring substrate electrically connecting the solid-state image sensing device to the electrical cable.

2. The imaging module according to claim 1, wherein

the device-mounted portion, the extended portions, and the connection end portions are provided only on one face of the flexible wiring substrate.

3. The imaging module according to claim 1, wherein

the solid-state image sensing device comprises:

a top face on which the imaging unit is provided;

a back face electrically connected to the device-mounted portion of the flexible wiring substrate; and

wiring formed on the top face; and

wiring formed on the back face, and

the wirings formed on the top face and on the back face are electrically connected through a through-hole interconnection which is formed and penetrated though the solid-state image sensing device.

4. The imaging module according to claim 1, wherein

a width of each of the two extended portions is smaller than a width of the connection end portions extending from the extended portions.

5. The imaging module according to claim 1, wherein

the flexible wiring substrate is located at both sides of the device-mounted portion of the flexible wiring substrate and comprises a bend portion protruding from a projection range of the solid-state image sensing device in the device-mounted portion.

6. The imaging module according to claim 5, wherein

an insulation protection material does not coat the bend portion of the flexible wiring substrate so that wiring is exposed.

7. The imaging module according to claim 5, wherein

a cut-off portion is formed at the bend portion of the flexible wiring substrate.

8. The imaging module according to claim 1, further comprising an insulating tube collectively accommodating the two connection end portions of the flexible wiring substrate and covering at least part of a connection portion between the flexible wiring substrate and the electrical cable.

9. The imaging module according to claim 1, further comprising an insulating tube externally fitted onto each of the two connection end portions of the flexible wiring substrate, covering at least part of a connection portion between the flexible wiring substrate and the electrical cable.

10. The imaging module according to claim 8, wherein

the insulating tube is configured to include a half-divided structure in which a pair of tube divided bodies are connected to and integrated with each other.

11. The imaging module according to claim 9, wherein

the insulating tube is configured to include a half-divided structure in which a pair of tube divided bodies are connected to and integrated with each other.

12. The imaging module according to claim 1, wherein

at least part of an internal space formed by the device-mounted portion and the two extended portions are filled with resin and at least a part of the two extended portions is thereby fixed.

13. The imaging module according to claim 12, wherein

the two connection end portions are fixed to each other, and

the flexible wiring substrate has a flexible portion located between a portion at which the two extended portions are fixed and a portion at which the two connection end portions are fixed.

14. A lens-attached imaging module comprising a front-end imaging unit comprising:

a flexible wiring substrate and a solid-state image sensing device which constitute the imaging module according to claim 1;

a lens unit fixed to the solid-state image sensing device; and

a sleeve-shaped metal frame member accommodating the flexible wiring substrate, the solid-state image sensing device, and the lens unit.

15. An endoscope comprising:

an insertion portion; and

the lens-attached imaging module according to claim 14, housed in the insertion portion.

16. A method of manufacturing an imaging module, comprising:

preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof;

mounting a solid-state image sensing device onto a mount face of the device-mounted portion;

bending portions which are located at both sides of the device-mounted portion, from the device-mounted portion, thereby forming two extended portions extending from the device-mounted portion to a back face side opposite to the mount face of the device-mounted portion and two connection end portions, the two connection end portions extending from the two extended portions, respectively;

filling an inside region surrounded by the two extended portions and the device-mounted portion with resin, and adhesively fixing the two extended portions to each other; and

connecting an electrical cable to a terminal provided at an external face side of each of the two connection end portions.

18. The method of manufacturing an imaging module according to claim 16, wherein

after the inside region surrounded by the two extended portions and the device-mounted portion is filled with the resin, the two extended portions are adhesively fixed to each other.

20. The method of manufacturing an imaging module according to claim 16, wherein

before the inside region surrounded by the two extended portions and the device-mounted portion is filled with the resin, the two extended portions are adhesively fixed to each other.

17. A method of manufacturing an imaging module, comprising:

preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof;

mounting a solid-state image sensing device onto a mount face of the device-mounted portion;

connecting an electrical cable to a terminal provided at an external face side of each of two connection end portions of the flexible wiring substrate;

bending portions which are located at both sides of the device-mounted portion, from the device-mounted portion, thereby forming two extended portions extending from the device-mounted portion to a back face side opposite to the mount face of the device-mounted portion and the two connection end portions, the two connection end portions extending from the two extended portions, respectively; and

filling an inside region surrounded by the two extended portions and the device-mounted portion with resin, and adhesively fixing the two extended portions to each other.

19. The method of manufacturing an imaging module according to claim 17, wherein

after the inside region surrounded by the two extended portions and the device-mounted portion is filled with the resin, the two extended portions are adhesively fixed to each other.

21. The method of manufacturing an imaging module according to claim 17, wherein

before the inside region surrounded by the two extended portions and the device-mounted portion is filled with the resin, the two extended portions are adhesively fixed to each other.

22. A flexible wiring substrate formation apparatus comprising:

a flexible-wiring-substrate mounting stage on which an elongated flexible wiring substrate is to be mounted;

a pin-attached elevating stage comprising;

an elevating stage capable of moving up and down relative to the flexible-wiring-substrate mounting stage;

a pin protruding from the elevating stage; and

a flat mounted-portion contacting face with which a device-mounted portion comes into contact, the device-mounted portion being located at a center region of the flexible wiring substrate in a longitudinal direction thereof, the mounted-portion contacting face being formed around the pin; and

a pair of movable pressing members provided on the flexible-wiring-substrate mounting stage, varying a separated distance therebetween by sliding motion along an upper surface of the flexible-wiring-substrate mounting stage, wherein

the pin-attached elevating stage is movable between an initial position and a safety position due to elevation of the pin-attached elevating stage, an upper face of the pin-attached elevating stage substantially coincides with the upper surface of the flexible-wiring-substrate mounting stage at the initial position, the safety position is located under the initial position.

23. A method of manufacturing an imaging module, comprising:

preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof;

mounting a solid-state image sensing device onto a mount face of the device-mounted portion;

using a flexible wiring substrate formation apparatus, the flexible wiring substrate formation apparatus comprising;

a flexible-wiring-substrate mounting stage on which the flexible wiring substrate is to be mounted;

a pin-attached elevating stage comprising;

an elevating stage capable of moving up and down relative to the flexible-wiring-substrate mounting stage;

a pin protruding from the elevating stage; and

a flat mounted-portion contacting face with which a device-mounted portion comes into contact, the device-mounted portion being located at a center region of the flexible wiring substrate in a longitudinal direction thereof, the mounted-portion contacting face being formed around the pin; and

a pair of movable pressing members provided on the flexible-wiring-substrate mounting stage, varying a separated distance therebetween by sliding motion along an upper surface of the flexible-wiring-substrate mounting stage, the pin-attached elevating stage being movable between an initial position and a safety position due to elevation of the pin-attached elevating stage, an upper face of the pin-attached elevating stage substantially coinciding with the upper surface of the flexible-wiring-substrate mounting stage at the initial position, the safety position being located under the initial position;

allowing the device-mounted portion of the flexible wiring substrate to come into contact with the mounted-portion contacting face provided at the pin of the pin-attached elevating stage positioned at the initial position, bending portions which are located at both sides of the device-mounted portion of the flexible wiring substrate, from the device-mounted portion, placing rear portions at a gap between the pair of movable pressing members in an opened state, the rear portions extending from the device-mounted portion to a rear side opposite to the mount face of the device-mounted portion;

allowing the pair of movable pressing members to approach each other, and allowing a pair of the rear portions of the flexible wiring substrate to approach each other, thereby forming two extended portions and two connection end portions, the two connection end portions extending from the two extended portions, respectively;

moving the pin-attached elevating stage downwardly from the initial position to the safety position, detaching the pin from a space surrounded by the device-mounted portion and the extended portions located at both sides of the device-mounted portion, filling the space with resin, and curing the resin; and

connecting an electrical cable to a terminal provided at an external face side of each of the two connection end portions.

25. The method of manufacturing an imaging module according to claim 23, wherein

after the space is filled with the resin, the two extended portions are adhesively fixed to each other.

27. The method of manufacturing an imaging module according to claim 23, wherein

before the space is filled with the resin, the two extended portions are adhesively fixed to each other.

24. A method of manufacturing an imaging module, comprising:

preparing an elongated flexible wiring substrate having a device-mounted portion located at a center region in a longitudinal direction thereof;

mounting a solid-state image sensing device onto a mount face of the device-mounted portion;

connecting an electrical cable to a terminal provided at an external face side of each of two connection end portions of the flexible wiring substrate;

using a flexible wiring substrate formation apparatus, the flexible wiring substrate formation apparatus comprising;

a flexible-wiring-substrate mounting stage on which the flexible wiring substrate is to be mounted;

a pin-attached elevating stage comprising;

an elevating stage capable of moving up and down relative to the flexible-wiring-substrate mounting stage;

a pin protruding from the elevating stage; and

a flat mounted-portion contacting face with which a device-mounted portion comes into contact, the device-mounted portion being located at a center region of the flexible wiring substrate in a longitudinal direction thereof, the mounted-portion contacting face being formed around the pin; and

a pair of movable pressing members provided on the flexible-wiring-substrate mounting stage, varying a separated distance therebetween by sliding motion along an upper surface of the flexible-wiring-substrate mounting stage, the pin-attached elevating stage being movable between an initial position and a safety position due to elevation of the pin-attached elevating stage, an upper face of the pin-attached elevating stage substantially coinciding with the upper surface of the flexible-wiring-substrate mounting stage at the initial position, the safety position being located under the initial position;

allowing the device-mounted portion of the flexible wiring substrate to come into contact with the mounted-portion contacting face provided at the pin of the pin-attached elevating stage positioned at the initial position, bending portions which are located at both sides of the device-mounted portion of the flexible wiring substrate, from the device-mounted portion, placing rear portions at a gap between the pair of movable pressing members in an opened state, the rear portions extending from the device-mounted portion to a rear side opposite to the mount face of the device-mounted portion;

allowing the pair of movable pressing members to approach each other, and allowing a pair of the rear portions of the flexible wiring substrate to approach each other, thereby forming two extended portions and the two connection end portions, the two connection end portions extending from the two extended portions, respectively; and

moving the pin-attached elevating stage downwardly from the initial position to the safety position, detaching the pin from a space surrounded by the device-mounted portion and the extended portions located at both sides of the device-mounted portion, filling the space with resin, and curing the resin.

26. The method of manufacturing an imaging module according to claim 24, wherein

after the space is filled with the resin, the two extended portions are adhesively fixed to each other.

28. The method of manufacturing an imaging module according to claim 24, wherein

before the space is filled with the resin, the two extended portions are adhesively fixed to each other.