HEAT EMISSION DEVICE FOR JUNCTION BOX PRINTED CIRCUIT BOARD

• US 20140009889A1
• Filed: 11/08/2012
• Published: 01/09/2014
• Est. Priority Date: 07/04/2012
• Status: Active Grant

• Current Assignee: Hyundai Motor Company (Hyundai Motor Group), Kia Motors Corporation (Kia Corp.), YURA Corporation
• Original Assignee: Hyundai Motor Company (Hyundai Motor Group), Kia Motors Corporation (Kia Corp.), YURA Corporation
• Inventors: Lee, Young Jong, Lee, Jong Won, Kang, Byung Kwan
• Granted Patent: US 9,078,378 B2
• Time in Patent Office: Days
• US Class Current: 361/704
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
• CPC Class Codes: H05K 7/20854 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20863 takes precedence

Abstract

The present disclosure provides a heat emission/radiation device for a junction box printed circuit board (PCB), which allows a next-generation intelligent junction box PCB to be manufactured in a dual-layer structure that maximizes heat emission effects. In other words, the present invention provides a heat emission device for a junction box PCB, in which a PCB having an IPS semiconductor device mounted thereon is mounted as a dual-layer structure by folding, such that the PCB may be easily installed in a small space of a vehicle, and a heat absorption and emission path for effectively emitting heat generated by the PCB mounted as the dual-layer structure is formed.

Claims

1. A heat emission device for a junction box printed circuit board (PCB), comprising:

a metallic case;

a lower PCB mounted on the metallic case;

a metallic board mounted on the lower PCB and configured to transfer heat; and

an upper PCB configured to conduct electricity with the lower PCB

2. The heat emission device of claim 1, wherein the metallic board comprises four sides and a bottom plate including a plurality of slots, wherein each slot is configured to accept one or more heat transfer bosses, which contact the lower PCB so as to transfer heat.

3. The heat emission device of claim 2, wherein the plurality of slots comprise a slide protruding end integrally associated with the lower perimeter of the inner walls of each slot.

4. The heat emission device of claim 3, wherein the one or more heat transfer bosses comprise a slide groove configured to mate with the slide protruding end of each slot.

5. The heat emission device of claim 2, wherein a fastening screw groove is formed on a top surface of each transfer boss, and a washer is applied to the fastening screw groove to allow a fastening screw to be inserted into and engaged with the fastening screw groove.

6. The heat emission device of claim 5, wherein the washer contacts an upper surface of the bottom plate.

7. The heat emission device of claim 2, wherein a plurality of heat emission ribs are formed on one ore more of the four sides of the metallic board.

8. The heat emission device of claim 7, wherein the plurality of heat emission ribs are spaced at equal intervals along each side of the metallic board.

9. The heat emission device of claim 8, wherein the plurality of heat emission ribs are about 2 mm wide and about 1.6 mm thick.

10. The heat emission device of claim 7, wherein the plurality of heat emission ribs are oriented to span the height of each side of the metallic board.

11. The heat emission device of claim 1, wherein the metallic board further comprises one or more assembly holes for coupling the metallic board with the metallic case.

12. The heat emission device of claim 11, wherein the one or more assembly holes are located at one or more corresponding corners of the metallic board.

13. The heat emission device of claim 2, wherein a thermal grease is applied to a lower end of the one or more heat transfer bosses to improve heat transfer between the lower PCB and the one or more heat transfer bosses.

14. The heat emission device of claim 2, wherein the metallic board further comprises one or more mounting clips to mount the upper PCB.

15. The heat emission device of claim 8, wherein one or more of the plurality of heat emission ribs may be longer than the height of one or more sides of the metallic board.

16. The heat emission device of claim 2, wherein the one or more heat transfer bosses are movable within the plurality of slots.

17. The heat emission device of claim 16, wherein the one or more heat transfer bosses are positioned in the plurality of slots so as to be proximate to one or more sources of heat generation located on the lower PCB.

18. The heat emission device of claim 1, wherein the upper PCB comprises a film insulator and a metallic pattern.

19. The heat emission device of claim 1, wherein the upper PCB is folded.