METHODS FOR ADJUSTING ADHESION STRENGTH DURING SENSOR PROCESSING

• US 20140010962A1
• Filed: 07/09/2012
• Published: 01/09/2014
• Est. Priority Date: 07/09/2012
• Status: Active Grant

• Current Assignee: STMicroelectronics International N.V. (STMicroelectronics NV)
• Original Assignee: Stmicroelectronics Pte Limited (STMicroelectronics NV)
• Inventors: Yu, Ying, Loh, TienChoy, Kam, ShianYeu
• Granted Patent: US 8,999,446 B2
• Time in Patent Office: Days
• US Class Current: 427/302
• CPC Class Codes: C03C 15/00 Surface treatment of glass, not in the form of fibres or filaments, by etching etching or surface-brightening compositions, in general C09K13/00
• CPC Class Codes: C03C 17/32 with synthetic or natural resins C03C17/30 takes precedence
• CPC Class Codes: C03C 2204/08 Glass having a rough surface
• CPC Class Codes: G01N 2203/0091 Peeling or tearing
• CPC Class Codes: G01N 33/4875 Details of handling test elements, e.g. dispensing or storage, not specific to a particular test method test-elements per se B01L, automatic analysers G01N35/00, in-vivo analysis on the human body for medical diagnosis A61B

Abstract

The present disclosure is directed to systems and methods for adjusting adhesion strength between materials during semiconductor sensor processing. One or more embodiments are directed to using various surface treatments to a substrate to adjust adhesion strength between the substrate and a polymer. In one embodiment, the surface of the substrate is roughened to decrease the adhesive strength between the substrate and the polymer. In another embodiment, the surface of the substrate is smoothed to increase the adhesive strength between the substrate and the polymer.

Claims

1. A method comprising:

roughening a surface of a substrate;

applying a polymer to the surface of the substrate;

curing the polymer in a manner that causes the polymer to shrink; and

forming a sensor on the polymer.

2. The method of claim 1, wherein the polymer is polyimide.

3. The method of claim 2, wherein applying a polymer to the surface of the substrate comprises applying the polyimide at a center portion of the surface of the substrate and rotating the substrate.

4. The method of claim 1, wherein the substrate comprises glass.

5. The method of claim 4, wherein the glass is boro-aluminosilicate glass.

6. The method of claim 1, wherein roughening a surface of a substrate comprises etching the surface of the substrate.

7. The method of claim 6, wherein etching the surface of the substrate comprises etching the surface of the substrate with fluid.

8. The method of claim 7, wherein the fluid comprises at least one of sulfuric acid, deionized water, and hydrogen peroxide.

9. The method of claim 1, wherein forming the sensor comprises forming a flexible glucose sensor.

10. A method comprising:

etching a surface of a glass substrate to roughen the surface;

depositing polyimide to the roughened surface of the glass substrate, the polyimide having first dimensions;

curing the polyimide; and

shrinking the polyimide to second dimensions when cured.

11. The method of claim 10, wherein etching the surface of the substrate comprises a etching the surface of the substrate in a fluid.

12. The method of claim 11, wherein the fluid is sulfuric acid.

13. The method of claim 10, wherein curing the polyimide comprises baking the polyimide at a temperature above 300°

C.

14. The method of claim 10, wherein depositing polyimide to the roughened surface of the substrate comprises applying the polyimide at a center portion of the roughened surface and rotating the substrate.

15. The method of claim 10, wherein the glass substrate comprises boro-aluminosilicate.

16. The method of claim 10, further comprising forming a flexible sensor on the polyimide.

17. A method comprising:

treating a surface of a substrate;

applying polyimide to the surface of the substrate;

curing the polyimide thereby causing the polyimide to shrink; and

forming a sensor on an exposed surface of the polyimide.

18. The method of claim 17, wherein treating the surface of the substrate comprises roughening the surface of the substrate by etching the surface of the substrate.

19. The method of claim 17, wherein treating the surface of the substrate comprises polishing the surface of the substrate.

20. The method of claim 17, wherein the substrate is boro-aluminosilicate glass.