Ball Grid Array (BGA) And Printed Circuit Board (PCB) Via Pattern To Reduce Differential Mode Crosstalk Between Transmit And Receive Differential Signal Pairs

• US 20140014404A1
• Filed: 07/13/2012
• Published: 01/16/2014
• Est. Priority Date: 07/13/2012
• Status: Active Grant

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Avago Technologies General IP (Singapore) PTE Limited (Broadcom, Inc.)
• Inventors: Hinton, Mark A., Quach, Minh V., Petaja, Regee
• Granted Patent: US 8,853,553 B2
• Time in Patent Office: Days
• US Class Current: 174/261
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/49822 Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 23/49838 Geometry or layout
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H05K 1/0222 for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence
• CPC Class Codes: H05K 1/0228 Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors balanced signal pairs H05K1/0245
• CPC Class Codes: H05K 1/0245 Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 2201/09227 Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10734 Ball grid array [BGA]; Bump grid array

Abstract

A ball grid array (BGA) and via pattern includes a printed circuit board (PCB) having a surface on which a plurality of regions are formed and a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

Claims

1. A ball grid array (BGA) and via pattern, comprising:

a printed circuit board (PCB) having a surface on which a plurality of regions are formed; and

a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

2. The ball grid array (BGA) and via pattern of claim 1, wherein a plurality of TX/RX clusters are separated by at least one ground region.

3. The ball grid array (BGA) and via pattern of claim 1, wherein each node of the differential signal pair is connected to a solder ball.

4. The ball grid array (BGA) and via pattern of claim 1, wherein each node of the differential signal pair comprises a via.

5. The ball grid array (BGA) and via pattern of claim 1, wherein each node of the receive differential signal pair being equidistant from each node of the transmit differential signal pair results in a net differential mode crosstalk of zero imparted to the receive differential signal pair.

6. A method for communicating using a ball grid array (BGA) and via pattern, comprising:

providing a printed circuit board (PCB) to have a surface on which a plurality of regions are formed; and

providing a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair.

7. The method of claim 6, further comprising separating a plurality of TX/RX clusters by at least one ground region.

8. The method of claim 6, further comprising connecting each node of the differential signal pair to a solder ball.

9. The method of claim 6, wherein each node of the differential signal pair comprises a via.

10. The method of claim 9, wherein each node of the receive differential signal pair being equidistant from each node of the transmit differential signal pair results in a net differential mode crosstalk of zero imparted to the receive differential signal pair.

11. A ball grid array (BGA) and via pattern for a printed circuit board (PCB), comprising:

a printed circuit board (PCB) having a surface on which a plurality of regions are formed; and

a transmit (TX) and receive (RX) cluster comprising a transmit differential signal pair and a receive differential signal pair formed using at least a portion of the plurality of regions on the surface of the PCB, the transmit differential signal pair and the receive differential signal pair comprising nodes arranged in a diagonal orientation in which each node of the receive differential signal pair is equidistant from each node of the transmit differential signal pair, wherein a plurality of TX/RX clusters are separated by at least one ground region.

12. The ball grid array (BGA) and via pattern for a printed circuit board (PCB) of claim 11, wherein each node of the differential signal pair is connected to a solder ball.

13. The ball grid array (BGA) and via pattern for a printed circuit board (PCB) of claim 11, wherein each node of the differential signal pair comprises a via.

14. The ball grid array (BGA) and via pattern for a printed circuit board (PCB) of claim 11, wherein each node of the receive differential signal pair being equidistant from each node of the transmit differential signal pair results in a net differential mode crosstalk of zero imparted to the receive differential signal pair.