Display Device and Method for Manufacturing Display Device

• US 20140014960A1
• Filed: 07/10/2013
• Published: 01/16/2014
• Est. Priority Date: 07/12/2012
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, HIRAKATA, Yoshiharu, YOSHIZUMI, Kensuke
• Granted Patent: US 9,082,678 B2
• Time in Patent Office: Days
• US Class Current: 257/59
• CPC Class Codes: G02F 1/133325 Assembling processes
• CPC Class Codes: G02F 1/13338 Input devices, e.g. touch panels
• CPC Class Codes: G02F 1/13606 having means for reducing parasitic capacitance
• CPC Class Codes: G02F 1/1368 in which the switching element is a three-electrode device G02F1/136277 takes precedence
• CPC Class Codes: G02F 2202/28 Adhesive materials or arrangements
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0412 Digitisers structurally integrated in a display
• CPC Class Codes: G06F 3/044 by capacitive means
• CPC Class Codes: G06F 3/0443 using a single layer of sensing electrodes
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/82 to produce devices, e.g. integrated circuits, each consisting of a plurality of components
• CPC Class Codes: H01L 2221/68363 used in a transfer process involving transfer directly from an origin substrate to a target substrate without use of an intermediate handle substrate
• CPC Class Codes: H01L 2221/68386 Separation by peeling
• CPC Class Codes: H01L 27/1218 with a particular composition or structure of the substrate
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
• CPC Class Codes: H10K 2102/311 Flexible OLED
• CPC Class Codes: H10K 2102/351 Thickness
• CPC Class Codes: H10K 50/8426 : Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 59/12 : Active-matrix OLED [AMOLED] displays
• CPC Class Codes: H10K 59/38 : comprising colour filters or colour changing media [CCM]
• CPC Class Codes: H10K 59/40 : OLEDs integrated with touch screens
• CPC Class Codes: H10K 59/60 : OLEDs integrated with inorganic light-sensitive elements, e.g. with inorganic solar cells or inorganic photodiodes
• CPC Class Codes: H10K 59/8722 : Peripheral sealing arrangements, e.g. adhesives, sealants
• CPC Class Codes: H10K 71/80 : using temporary substrates

Abstract

The thickness of a display device including a touch sensor is reduced. Alternatively, the thickness of a display device having high display quality is reduced. Alternatively, a method for manufacturing a display device with high mass productivity is provided. Alternatively, a display device having high reliability is provided. Stacked substrates in each of which a sufficiently thin substrate and a relatively thick support substrate are stacked are used as substrates. One surface of the thin substrate of one of the stacked substrates is provided with a layer including a touch sensor, and one surface of the thin substrate of the other stacked substrate is provided with a layer including a display element. After the two stacked substrates are attacked to each other so that the touch sensor and the display element face each other, the support substrate and the thin substrate of each stacked substrate are separated from each other.

Claims

1. A display device comprising:

a first substrate;

a first layer over the first substrate, the first layer including a light-emitting element;

a first conductive layer over the first substrate;

a second substrate over the first conductive layer, the second substrate being provided with a second layer including a touch sensor; and

a second conductive layer under the second substrate, the second conductive layer being electrically connected to the touch sensor,

wherein the first substrate and the second substrate are attached to each other with an adhesive layer so that the first layer and the second layer are interposed between the first substrate and the second substrate,

wherein the first conductive layer is electrically connected to the second conductive layer through a conductive connector, and

wherein each of the first substrate and the second substrate is a glass substrate.

2. The display device according to claim 1, further comprising a third layer including a color filter overlapping with the second layer.

3. The display device according to claim 1,

wherein the adhesive layer is provided between the conductive connector and the light-emitting element,

wherein the adhesive layer is provided so as to surround the light-emitting element, and

wherein the first conductive layer and the second conductive layer are electrically connected to each other outside a region surrounded by the adhesive layer.

4. The display device according to claim 1, wherein the adhesive layer contains a glass material.

5. The display device according to claim 1,

wherein the first layer further comprises a transistor being electrically connected to the light-emitting element, and

wherein the transistor comprises an oxide semiconductor in a channel formation region.

6. The display device according to claim 1, further comprising:

a first connection terminal over the first substrate, the first connection terminal being electrically connected to the first layer;

a second connection terminal over the first substrate, the second connection terminal being electrically connected to the first conductive layer;

a flexible printed circuit being electrically connected to each of the first connection terminal and the second connection terminal; and

a reinforcing material being in contact with the flexible printed circuit and the second substrate,

wherein each of the first connection terminal and the second connection terminal does not overlap with the second substrate.

7. The display device according to claim 1, wherein each of the first substrate and the second substrate has a thickness of 10 μ

m to 200 μ

m.

8. A module comprising the display device according to claim 1.

9. An electronic device comprising the display device according to claim 1.

10. A method for manufacturing a display device, comprising the steps of:

attaching a first substrate which is fixed over a first support substrate and provided with a first layer including a touch sensor over the first substrate and a second substrate which is fixed over a second support substrate and provided with a second layer over the second substrate to each other with a first adhesive layer so that the first layer and the second layer are interposed between the first substrate and the second substrate;

separating the first substrate and the first support substrate from each other; and

separating the second substrate and the second support substrate from each other,

wherein the first layer includes a first conductive layer, and the second layer includes a second conductive layer, and

wherein the first conductive layer is electrically connected to the second conductive layer through a conductive connector between the first conductive layer and the second conductive layer after the attaching step.

11. The method for manufacturing a display device according to claim 10, further comprising the steps of:

attaching the second substrate which is fixed over the second support substrate and provided with the second layer including a light-emitting element over the second substrate and a third substrate which is fixed over a third support substrate and provided with a third layer including a color filter over the third substrate to each other with a second adhesive layer so that the second layer and the third layer are interposed between the second substrate and the third substrate; and

separating the third substrate and the third support substrate from each other before the attaching step of the first substrate and the second substrate,

wherein the attaching step of the second substrate and the third substrate is performed before the attaching step of the first substrate and the second substrate, and

wherein the first substrate is fixed to the second substrate with the third substrate and the third layer interposed therebetween in the attaching step of the first substrate and the second substrate.

12. The method for manufacturing a display device according to claim 10, further comprising the steps of:

attaching the second substrate which is fixed over the second support substrate and provided with the second layer including a color filter over the second substrate and a third substrate which is fixed over a third support substrate and provided with a third layer including a light-emitting element over the third substrate to each other with a second adhesive layer so that the second layer and the third layer are interposed between the second substrate and the third substrate; and

separating the third substrate and the third support substrate from each other before the attaching step of the first substrate and the second substrate,

wherein the attaching step of the second substrate and the third substrate is performed before the attaching step of the first substrate and the second substrate, and

wherein the first substrate is fixed to the second substrate with the third substrate and the third layer interposed therebetween in the attaching step of the first substrate and the second substrate.

13. The method for manufacturing a display device according to claim 10,

wherein the first layer is a stack of the touch sensor and a third layer including a color filter layer, and

wherein the second layer includes a light-emitting element.

14. The method for manufacturing a display device according to claim 10,

wherein a surface of the first substrate, which is fixed to the first support substrate, has a roughness of 2 nm or less.

15. The method for manufacturing a display device according to claim 10,

wherein the first substrate is a glass substrate having a thickness of 10 μ

m to 200 μ

m, and

wherein the glass substrate is fixed to the first support substrate with a resin containing an organic compound or a silicon compound.

16. The method for manufacturing a display device according to claim 10, wherein the first substrate is a glass substrate having a thickness of 10 μ

m to 200 μ

m,

wherein the second substrate is a glass substrate having a thickness of 10 μ

m to 200 μ

m,

wherein the first support substrate is thicker than the first substrate, and

wherein the second support substrate is thicker than the second substrate.

17. The method for manufacturing a display device according to claim 10,

wherein the first substrate and the second substrate are directly attached to each other with the first adhesive layer by the attaching step of the first substrate and the second substrate.

18. A method for manufacturing a display device, comprising the steps of:

attaching a first substrate which is fixed over a first support substrate and provided with a first layer including a touch sensor over the first substrate and a second substrate which is fixed over a second support substrate and provided with a second layer over the second substrate to each other with a first adhesive layer so that the first layer and the second layer are interposed between the first substrate and the second substrate;

separating the first substrate and the first support substrate from each other; and

separating the second substrate and the second support substrate from each other.

19. The method for manufacturing a display device according to claim 18,

wherein a surface of the first substrate, which is fixed to the first support substrate, has a roughness of 2 nm or less.

20. The method for manufacturing a display device according to claim 18,

wherein the first substrate is a glass substrate having a thickness of 10 μ

m to 200 μ

m, and

wherein the glass substrate is fixed to the first support substrate with a resin containing an organic compound or a silicon compound.

21. The method for manufacturing a display device according to claim 18,

wherein the first substrate is a glass substrate having a thickness of 10 μ

m to 200 μ

m,

wherein the second substrate is a glass substrate having a thickness of 10 μ

m to 200 μ

m,

wherein the first support substrate is thicker than the first substrate, and

wherein the second support substrate is thicker than the second substrate.

22. The method for manufacturing a display device according to claim 18,

wherein the first substrate and the second substrate are directly attached to each other with the first adhesive layer by the attaching step of the first substrate and the second substrate.