3DIMENSION IMAGE SENSOR AND SYSTEM INCLUDING THE SAME

• US 20140015932A1
• Filed: 07/12/2013
• Published: 01/16/2014
• Est. Priority Date: 07/13/2012
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: PARK, Yoon Dong, YUN, Jung Bin, KIM, Won Joo, PARK, Doo Cheol, LEE, Kwang Min
• Application Number:
  US13/940,419
• Publication Number:
  US 20140015932A1
• Time in Patent Office: Days
• US Class Current: 348/46
• CPC Class Codes: H01L 27/14621 Colour filter arrangements
• CPC Class Codes: H01L 27/1464 Back illuminated imager structures
• CPC Class Codes: H04N 13/257 Colour aspects

Abstract

A 3D image sensor includes a first color filter configured to pass wavelengths of a first region of visible light and wavelengths of infrared light; a second color filter configured to pass wavelengths of a second region of visible light and the wavelengths of infrared light; and an infrared sensor configured to detect the wavelengths of infrared light passed through the first color filter.

Claims

1. A 3D image sensor comprising:

a first color filter configured to pass wavelengths of a first region of visible light and wavelengths of infrared light;

a second color filter configured to pass wavelengths of a second region of visible light and the wavelengths of infrared light; and

an infrared sensor configured to detect the wavelengths of infrared light passed through the first color filter.

2. The 3D image sensor of claim 1, further comprising:

a near-infrared pass filter located between the first color filter and the infrared sensor.

3. The 3D image sensor of claim 1, further comprising:

an infrared filter configured to pass the wavelengths of infrared light, wherein the infrared filter is located between the first color filter and the second color filter.

4. The 3D image sensor of claim 3, wherein the size of the first color filter and the size of the infrared filter are the same.

5. The 3D image sensor of claim 3, further comprising:

an optical detector configured to generate photoelectrons in response to the wavelengths of infrared light passed through the infrared filter, and the 3D image sensor is configured to compensate color information generated by the first color filter using the photoelectrons generated in response to the wavelengths of light passed through the infrared filter.

6. The 3D image sensor of claim 1, wherein the size of the infrared sensor is larger than the size of the first color filter.

7. A 3D image sensing system comprising:

a dual band pass filter configured to pass wavelengths of visible light and wavelengths of infrared light; and

a pixel array including a color pixel region configured to generate color information by passing the wavelengths of visible light.

8. The 3D image sensing system of claim 7, wherein the pixel array further includes an infrared sensor configured to detect the wavelengths of infrared light.

9. The 3D image sensing system of claim 8, wherein the pixel array includes a near-infrared filter configured to pass the wavelengths of infrared light such that the wavelengths of infrared light passed by the near-infrared filter are incident on the infrared sensor.

10. The 3D image sensing system of claim 9, wherein the pixel array includes a color filter configured to pass the wavelengths of infrared light and the wavelengths of visible light.

11. The 3D image sensing system of claim 10, wherein the size of the infrared sensor is larger than the size of the color filter.

12. The 3D image sensing system of claim 7, wherein the pixel array includes an infrared filter configured to pass the wavelengths of infrared light.

13. The 3D image sensing system of claim 12, wherein the size of the color filter and the size of the infrared filter are the same.

14. The 3D image sensing system of claim 12, wherein the pixel array includes an optical detector configured to generate photoelectrons in response to the wavelengths of infrared light passed through the infrared filter.

15. The 3D image sensing system of claim 7, wherein the 3D image sensing system is a portable electronic device.

16. A 3D image sensor comprising:

a first color filter configured to pass wavelengths of light within a first wavelength range of visible light and configured to pass wavelengths of infrared light;

a first color sensor configured to generate photoelectrons in response to the wavelengths of light of the first wavelength range of visible light; and

an infrared sensor located below the first color sensor and configured to generate photoelectrons in response to the wavelengths of infrared light.

17. The 3D image sensor of claim 16, further comprising:

a first infrared filter located in between the first color sensor and the infrared sensor, the first infrared filter being configured to filter out wavelengths of visible light and pass wavelengths of infrared light.

18. The 3D image sensor of claim 17, further comprising:

a second infrared filter configured to filter out wavelengths of visible light and pass wavelengths of infrared light, wherein the second infrared filter is located adjacent to the first color filter and above the first infrared filter.

19. The 3D image sensor of claim 18, further comprising:

an optical detector configured to generate photoelectrons in response to the wavelengths of infrared light passed through the second infrared filter, wherein the 3D image sensor is configured to compensate color information generated by the first color sensor based on the photoelectrons generated by the optical detector.

20. The 3D image sensor of claim 16, further comprising:

a second color filter configured to pass wavelengths of light within a second wavelength range of visible light and configured to pass wavelengths of infrared light, the first wavelength range being different from the second wavelength range; and

a second color sensor configured to generate photoelectrons in response to the wavelengths of light of the first wavelength range of visible light.