GROUNDED LID FOR MICRO-ELECTRONIC ASSEMBLIES

• US 20140016283A1
• Filed: 10/01/2013
• Published: 01/16/2014
• Est. Priority Date: 05/28/2010
• Status: Active Grant

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: International Business Machines Corporation
• Inventors: Beaumier, Martin, Gaynes, Michael A., Salvas, Eric, Blander, Alexandre, Gagnon, Pascale, Giguere, Eric, Tousignant, Luc
• Granted Patent: US 9,042,120 B2
• Time in Patent Office: Days
• US Class Current: 361/748
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 23/055 the leads having a passage through the base H01L23/057 takes precedence
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16251 Connecting to an item not being a semiconductor or solid-state body, e.g. cap-to-substrate
• CPC Class Codes: H05K 9/0009 with provisions to reduce EMI leakage through the joining parts
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing

Abstract

An apparatus for reducing EMI at the micro-electronic-component level includes a substrate having a ground conductor integrated therein. A micro-electronic component such as an integrated circuit is mounted to the substrate. An electrically conductive lid is mounted to the substrate, thereby forming a physical interface with the substrate. The electrically conductive lid substantially covers the micro-electronic component. A conductive link is provided to create an electrical connection between the electrically conductive lid and the ground conductor at the physical interface.

Claims

1-20. -20. (canceled)

21. An apparatus for reducing EMI at the micro-electronic-component level, the apparatus comprising:

a substrate having a ground conductor integrated therein;

a micro-electronic component mounted to the substrate;

an electrically conductive lid mounted to the substrate and thereby forming a physical interface with the substrate, the electrically conductive lid substantially covering the micro-electronic component;

a conductive link creating an electrical connection between the electrically conductive lid and the ground conductor at the physical interface, the conductive link comprising a first solder layer on the ground conductor, a second solder layer on the electrically conductive lid, and an electrically conductive adhesive between the first and second solder layers; and

one or more gaps in the electrically conductive adhesive.

22. The apparatus of claim 21, wherein the electrically conductive lid comprises a nickel-plated copper lid.

23. The apparatus of claim 21, wherein the electrically conductive adhesive is a resin-based adhesive filled with an electrically conductive material.

24. The apparatus of claim 21, wherein the electrically conductive adhesive forms a ring around the micro-electronic component.

26. The apparatus of claim 21, wherein the conductive link comprises a solder post extending through an aperture in the electrically conductive lid.

27. The apparatus of claim 21, wherein the conductive link comprises a solder layer extending between the electrically conductive lid and the ground conductor.

28. The apparatus of claim 21, wherein multiple openings are provided in the substrate to expose the ground conductor.

29. The apparatus of claim 21, wherein a single opening in the form of a ring is provided in the substrate to expose the ground conductor.

30. The apparatus of claim 21, wherein the one or more gaps in the electrically conductive adhesive allow gases to escape from inside the micro-electronic assembly.

31. The apparatus of claim 21, wherein the one or more gaps in the electrically conductive adhesive allow enable an internal compartment of the micro-electronic assembly to be vented to the outside environment.

25. (canceled)