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PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

  • US 20140020940A1
  • Filed: 07/10/2013
  • Published: 01/23/2014
  • Est. Priority Date: 07/18/2012
  • Status: Active Grant
First Claim
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1. A printed wiring board, comprising:

  • a core substrate;

    a first buildup layer formed on a first surface of the core substrate and comprising an insulation layer and a conductive layer;

    a second buildup layer formed on a second surface of the core substrate on an opposite side with respect to the first buildup layer and comprising an insulation layer and a conductive layer; and

    an inductor device positioned in the second buildup layer and comprising a resin insulation layer and a coil layer formed on the resin insulation layer,wherein the second buildup layer has a cavity in which the inductor device is accommodated.

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