MULTI-COMPOUND MOLDING
0 Assignments
0 Petitions
Accused Products
Abstract
In certain embodiments, a semiconductor package includes a leadframe, a light emitter die disposed on the leadframe, and a light detector die disposed on the leadframe adjacent to the light emitter die. In some embodiments, a first transparent molding compound is disposed over the light emitter die and a second transparent molding compound is disposed over the light detector die. The first and second transparent molding compound may be disposed such that a space between them forms a cavity between the die and above the leadframe. In other embodiments a transparent molding compound is disposed simultaneously over the light emitter and light detector die and a subsequent material removal process forms a cavity within the compound between the die. In both embodiments, an opaque molding compound is disposed in the cavity between the die, and is configured to block optical cross-talk between the light emitter and light detector die.
-
Citations
42 Claims
-
1-22. -22. (canceled)
-
23. A semiconductor package comprising:
-
a leadframe; a first die disposed on the leadframe; a second die disposed on the leadframe adjacent to the first die; a transparent material disposed over the first and second die; a first cavity in the transparent material, disposed between the first die and the second die and above the leadframe; at least one edge cavity in the transparent material, disposed on an edge of the package and above the leadframe; and an opaque material disposed within the first cavity and the edge cavity. - View Dependent Claims (24, 25, 26, 27, 28)
-
-
29. A semiconductor package comprising:
-
a leadframe; a first die disposed on the leadframe; a second die disposed on the leadframe adjacent to the first die; a transparent material disposed over the first and second die; a first cavity disposed within the transparent material between the first die and the second die and above the leadframe; wherein the first cavity has at least one sloped wall; and an opaque material disposed in the first cavity. - View Dependent Claims (30, 31, 32, 33)
-
-
34. A method of forming a semiconductor package, the method comprising:
-
providing a leadframe; placing a first die on the leadframe; placing a second die on the leadframe, wherein the first and second die are placed adjacent to each other; disposing a transparent material over the first and second die; forming a first cavity between the first die and the second die and above the leadframe; forming at least one street cavity in the transparent material, disposed on a street and above the leadframe; and disposing an opaque material within the first cavity and the street cavity. - View Dependent Claims (35, 36, 37, 38, 39)
-
-
40. A method of forming a semiconductor package, the method comprising:
-
providing a leadframe; placing a first die on the leadframe; placing a second die on the leadframe, wherein the first and second die are placed adjacent to each other; disposing a transparent material over the first and second die; forming a first cavity having at least one sloped wall between the first die and the second die and above the leadframe; disposing an opaque material within the first cavity. - View Dependent Claims (41, 42)
-
Specification