LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME

• US 20140021506A1
• Filed: 07/18/2013
• Published: 01/23/2014
• Est. Priority Date: 07/19/2012
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: YAMADA, Motokazu
• Granted Patent: US 9,412,918 B2
• Time in Patent Office: Days
• US Class Current: 257/99
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/52 Encapsulations
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light emitting device includes a support member, a light emitting element, and an underfill material. The support member includes an insulating member and positive and negative electrically conductive wirings arranged on the insulating member. The electrically conductive wirings are insulated and separated from each other by an insulating region arranged between the positive and negative electrically conductive wirings. The insulating separation region includes a first region disposed on an outer side with respect to the light emitting element and a second region disposed directly under the light emitting element. The first region includes an underfill arranging portion in which an interval between the electrically conductive wirings is wider than in the second region. The underfill material is arranged to extend from the underfill arranging portion to the second region in a space formed between the support member and the light emitting element.

Claims

1. A light emitting device comprising:

a support member including an insulating member and a pair of positive and negative electrically conductive wirings arranged on the insulating member;

a light emitting element including a pair of positive and negative electrodes respectively connected to the positive and negative electrically conductive wirings through electrically conductive members respectively; and

an underfill material arranged in a space formed between the support member and the light emitting element, wherein

the positive and negative electrically conductive wirings are insulated and separated from each other by an insulating separation region arranged between the positive and negative electrically conductive wirings, the insulating separation region including a first region disposed on an outer side with respect to the light emitting element and a second region disposed directly under the light emitting element, the first region including an underfill arranging portion in which an interval between the positive and negative electrically conductive wirings is wider than in the second region, and

the underfill material is arranged to extend from the underfill arranging portion to the second region.

2. The light emitting device according to claim 1, wherein

the positive and negative electrically conductive wirings are covered with a resist except for portions where the electrically conductive members are arranged.

3. The light emitting device according to claim 1, wherein

a half or greater portion of side surfaces of the light emitting element is not covered with the underfill material.

4. The light emitting device according to claim 1, wherein

the positive and negative electrically conductive wirings include a solder coating on surfaces thereof.

5. A method of manufacturing a light emitting device comprising:

preparing a support member including an insulating member and a pair of positive and negative electrically conductive wirings arranged on the insulating member by forming an insulating separation region, in which the positive and negative electrically conductive wirings are insulated and separated from each other by a part of the insulating member arranged between the positive and negative electrically conductive wirings, the insulating separation region including a first region located on an outer side of a mounting position of a light emitting element and a second region located on an inner side of the mounting position of the light emitting element with the first region including an underfill arranging portion in which an interval between the positive and negative electrically conductive wirings is wider than in the second region;

mounting the light emitting element on the mounting position by connecting positive and negative electrodes of the light emitting element to the positive and negative electrically conductive wirings of the support member, respectively, with electrically conductive members;

arranging an underfill material in a space formed between the support member and the light emitting element by supplying the underfill material to the underfill arranging portion by dripping so that the underfill material flows from the first region into the second region to fill a space directly under the light emitting element; and

curing the underfill material after the arranging of the underfill material.

6. The method of manufacturing a light emitting device according to claim 5, further comprising

covering the positive and negative electrically conductive wirings by a resist except for portions for arranging the electrically conductive members.

7. The method of manufacturing a light emitting device according to claim 5, wherein

the arranging of the underfill material includes disposing the underfill material on a lower side of side surfaces of the light emitting element.

8. The method of manufacturing a light emitting device according to claim 5, further comprising

disposing a solder coating on respective surfaces of the positive and negative electrically conductive wirings.

9. The method of manufacturing a light emitting device according to claim 5, wherein

the light emitting element has a rectangular shape, and a direction of flow of the underfill material from the first region to the second region is approximately parallel to sides of the rectangular shape of the light emitting element.

10. The method of manufacturing a light emitting device according to claim 5, wherein

each of the positive and negative electrically conductive wirings includes a protruded portion having a width approximately the same as a width of the light emitting element and the underfill arranging portion is formed adjacent to the protruded portions.