THERMAL MANAGEMENT OF TIGHTLY INTEGRATED SEMICONDUCTOR DEVICE, SYSTEM AND/OR PACKAGE
First Claim
Patent Images
1. A semiconductor package comprising:
- a first die;
a second die adjacent to the first die, the second die capable of heating the first die;
a leakage sensor configured to measure a leakage current of the first die; and
a thermal management unit coupled to the leakage sensor, the thermalmanagement unit configured to control a temperature of the first die based on theleakage current of the first die.
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Abstract
Some implementations provide a semiconductor package that includes a first die and a second die adjacent to the first die. The second die is capable of heating the first die. The semiconductor package also includes a leakage sensor configured to measure a leakage current of the first die. The semiconductor package also includes a thermal management unit coupled to the leakage sensor. The thermal management unit configured to control a temperature of the first die based, on the leakage current of the first die.
51 Citations
55 Claims
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1. A semiconductor package comprising:
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a first die; a second die adjacent to the first die, the second die capable of heating the first die; a leakage sensor configured to measure a leakage current of the first die; and
a thermal management unit coupled to the leakage sensor, the thermalmanagement unit configured to control a temperature of the first die based on the leakage current of the first die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 15, 16)
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14. The semiconductor package of claim i, wherein the first die and the second die are coupled to each other by through substrate vias (TSVs).
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17. An apparatus comprising:
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a first die; a second die adjacent to the first die, the second die capable of heating the first die; means for measuring a leakage current of the first die; and
means for controlling a temperature of the first die based on the leakage current of the first die, - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for manufacturing a semiconductor package encapsulating several dice, the method comprising:
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positioning a first die on a packaging substrate; positioning a second die adjacent to the first die, the second die capable of heating the first die; positioning a leakage sensor within the package, the leakage sensor configured, to measure a leakage current of the first die; and positioning a thermal management unit within the package, the thermal management unit coupled to the leakage sensor, the thermal management unit configured to control a temperature of the first die based on the leakage current of the first die. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36)
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37. A semiconductor package comprising:
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a first die comprising a plurality of through substrate vias (TSVs); a second die coupled to the plurality of TSVs, the second die capable of heating the first die via the plurality of TSVs; a sensor configured to measure a property of the first die; and
.a thermal management unit coupled to the sensor, the thermal management unit configured to control a temperature of the first die based on the property of the first die. - View Dependent Claims (38, 39, 40, 41)
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42. A method for manufacturing a semiconductor package, the method comprising;
- positioning a first die on a packaging substrate, the first die comprising a
plurality of through substrate vias (TSVs); positioning a second die adjacent to the first die, the second die capable of heating the first die, the first die and the second die coupled to each other via the plurality of TSVs; positioning a sensor within the package, the sensor configured to measure a property of the first die; and positioning a thermal management unit within the package, the thermal management unit coupled to the sensor, the thermal management unit configured to control a temperature of the first die based on the property of the first die. - View Dependent Claims (43)
- positioning a first die on a packaging substrate, the first die comprising a
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44. A method, for managing temperature in a package comprising a first die and a second die, comprising:
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measuring a property of a first die, the first die coupled to the second die via a plurality of through substrate vias (TSVs); and controlling the temperature of the first die by reducing activity of the second die based on the measured property of the first die. - View Dependent Claims (45, 46)
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47. A computer readable storage medium comprising one or more instructions for managing temperature in a semiconductor package comprising a first die and a second die, which when executed by at least one processor, causes the at least one processor to:
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measure a property of a first die, the first die coupled to the second die via a plurality of through substrate vias (TSVs); and control the temperature of the first die by reducing activity of the second die based on the measured property of the first die. - View Dependent Claims (48, 49)
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50. A method, for managing temperature in a semiconductor package comprising a first die and a second die, comprising:
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measuring a leakage current of a first die; and controlling the temperature of the first die by reducing activity of the second die based on the leakage current of the first die. - View Dependent Claims (51, 52)
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53. A computer readable storage medium comprising one or more instructions for managing temperature in a semiconductor package comprising a first die and a second, die, which when executed by at least one processor, causes the at least one processor to:
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measure a leakage current of a first die; and control the temperature of the first die by reducing activity of the second die based on the leakage current of the first die. - View Dependent Claims (54, 55)
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Specification