IMAGE TRANSFER PROCESS EMPLOYING A HARD MASK LAYER

• US 20140024219A1
• Filed: 07/19/2012
• Published: 01/23/2014
• Est. Priority Date: 07/19/2012
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Jung, Ryan O., Kanakasabapathy, Sivananda K., Yin, Yunpeng
• Granted Patent: US 8,637,406 B1
• Time in Patent Office: Days
• US Class Current: 438/703
• CPC Class Codes: H01L 21/0337 characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment
• CPC Class Codes: H01L 21/0338 Process specially adapted to improve the resolution of the mask
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/32139 using masks
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]

Abstract

At least one mask layer formed over a substrate includes at least one of a dielectric material and a metallic material. By forming a first pattern in one of the at least one mask layer, a patterned mask layer including said first pattern is formed. An overlying structure including a second pattern that includes at least one blocking area is formed over said patterned mask layer. Portions of said patterned mask layer that do not underlie said blocking area are removed. The remaining portions of the patterned mask layer include a composite pattern that is an intersection of the first pattern and the second pattern. The patterned mask layer includes a dielectric material or a metallic material, and thus, enables high fidelity pattern transfer into an underlying material layer.

Claims

1. A method of patterning a structure comprising:

forming an underlying material layer on a substrate;

forming a stack of two mask layers comprising a dielectric material and a metallic material, respectively, over said underlying material layer;

forming a first pattern in one of said two mask layers, wherein a patterned mask layer including said first pattern is formed by remaining portions of said one of said two mask layers, while another of said two mask layers remains unpatterned;

forming an overlying structure including a second pattern over said patterned mask layer, wherein said second pattern includes at least one blocking area;

removing portions of said patterned mask layer that do not underlie said blocking area, wherein remaining portions of said patterned mask layer include a composite pattern that is an intersection of said first pattern and said second pattern;

applying a photoresist material directly on surfaces of said patterned mask layer and on surfaces of said another of said two mask layers that remains unpatterned;

patterning said photoresist material to form at least one photoresist block portion having an additional pattern directly on a topmost surface of said another of said two mask layers;

transferring a derived pattern including said composite pattern and a pattern of said at least one photoresist block portion as component patterns into said another of said two mask layers; and

transferring said derived pattern into said underlying material layer employing remaining portions of said another of said two mask layers as an etch mask.

2. The method of claim 1, further comprising:

forming a stack of a first organic planarizing layer (OPL) and a first antireflective coating (ARC) layer on said at least one mask layer; and

forming a patterned structure including said first pattern over said first ARC layer, wherein said forming of said first pattern in said one of said at least one mask layer comprises transferring said first pattern into said one of said at least one mask layer.

3. The method of claim 2, further comprising etching said first ARC layer and said first OPL employing said patterned structure as an etch mask, wherein a patterned first ARC layer and a patterned first OPL are formed.

4. The method of claim 3, wherein said transferring of said first pattern into said one of said at least one mask layer comprises etching said one of said at least one mask layer employing said patterned first ARC layer as an etch mask.

5. The method of claim 4, further comprising removing said patterned first OPL selective to said patterned mask layer prior to forming said overlying structure.

6. The method of claim 2, wherein said forming of said patterned structure comprises forming a set of spacer structures.

7. The method of claim 6, wherein said set of spacer structures is formed by:

forming mandrel structures over said first ARC layer;

depositing a conformal material layer over said mandrel structures; and

anisotropically etching said conformal material layer, wherein remaining disjoined portions of said conformal material layer are said set of spacer structures.

8. The method of claim 7, further comprising removing said mandrel structures selective to said set of spacer structures and said first ARC layer.

9. The method of claim 7, wherein said forming of said mandrel structures comprise:

depositing a mandrel material layer over said first ARC layer; and

patterning said mandrel material layer to form said mandrel structures.

10. The method of claim 2, wherein said patterned structure comprises a set of first photoresist material portions comprising a first photoresist material and a set of second photoresist material portions comprising a second photoresist material that is different from said first photoresist material.

11. The method of claim 2, wherein said forming of said overlying structure comprises forming a stack of a second OPL, a second ARC layer, and a photoresist layer over said patterned mask layer.

12. The method of claim 11, further comprising lithographically patterning said photoresist layer with said second pattern, wherein said second pattern includes at least one opening that is a complement of said at least one blocking area.

13. The method of claim 12, further comprising etching said second ARC layer and an upper portion of said second OPL employing said photoresist layer as an etch mask.

14. The method of claim 13, wherein said removing of said portions of said patterned mask layer that do not underlie said blocking area comprises etching said portions of said patterned mask layer from within an area of said at least one opening after said etching of said upper portion of said second OPL.

15. The method of claim 14, further comprising removing remaining portions of said second OPL selective to said remaining portions of said patterned mask layer.

18. The method of claim 1, wherein said transferring of said derived pattern into said underlying material layer comprises etching said underlying material layer employing a combination of said remaining portions of said patterned mask layer and said at least one photoresist block portion as an etch mask.

19. The method of claim 1, wherein said derived pattern is a union of said composite pattern and said additional pattern.

20. The method of claim 1, wherein said underlying material layer comprises a gate conductor layer.

21. The method of claim 1, further comprising removing said remaining portions of said patterned mask layer selective to said underlying material layer after said transferring of said derived pattern.

22. The method of claim 1, wherein said at lest one mask layer comprises a stack, from bottom to top, of a dielectric mask layer and a metallic mask layer.

23. The method of claim 1, wherein said at least one mask layer comprises a stack, from bottom to top, of a metallic mask layer and a dielectric material layer.

24. The method of claim 1, wherein said at least one mask layer consists of a dielectric mask layer.

25. The method of claim 1, wherein said at least one mask layer consists of a metallic mask layer.

26. The method of claim 1, further comprising removing said remaining portions of said patterned mask layer selective to remaining portions of said another of said two mask layers after said transferring of said derived pattern.

16-17. -17. (canceled)