HIGH DENSITY CONNECTOR STRUCTURE FOR TRANSMITTING HIGH FREQUENCY SIGNALS

• US 20140024257A1
• Filed: 02/07/2013
• Published: 01/23/2014
• Est. Priority Date: 07/20/2012
• Status: Active Grant

• Current Assignee: Speed Tech Corp.
• Original Assignee: Speed Tech Corp.
• Inventors: CHANG, Hua-Chun, CASTILLO, Josue, YOUNG, James Patrick, CHEN, Li-Sen, WONG, Steven
• Granted Patent: US 8,808,029 B2
• Time in Patent Office: Days
• US Class Current: 439/607.05
• CPC Class Codes: H01R 12/724 containing contact members forming a right angle
• CPC Class Codes: H01R 13/6585 Shielding material individually surrounding or interposed between mutually spaced contacts

Abstract

A high density connector structure for transmitting high frequency signals having a first sub-assembly, a second sub-assembly, a shield plate, and a shield shell is disclosed. The first sub-assembly has a plurality of first contacts held in a first insulator, and the second sub-assembly has a plurality of second contacts held in a second insulator. The shield plate is positioned between the first and second contacts. At least one resilient arm extends from said shield plate and contacts at least one of the first contacts of the first sub-assembly. The shield shell at least partially surrounds the periphery of the first and second sub-assemblies.

Claims

1. A high density connector structure for transmitting high frequency signals, comprising:

a first sub-assembly comprising a plurality of first contacts held in a first insulator;

a second sub-assembly comprising a plurality of second contacts held in a second insulator;

a shield plate disposed between the first and second contacts, wherein the shield plate is a metal sheet;

a shield shell at least partially surrounding a periphery of the first and second sub-assemblies; and

at least one resilient arm extended from the shield plate and electrically connected to at least one of the first contacts of the first sub-assembly.

2. The high density connector structure for transmitting high frequency signals of claim 1, wherein the first and second sub-assemblies are restrained in a third insulator.

3. The high density connector structure for transmitting high frequency signals of claim 2, wherein shield shell surrounds the periphery of the first and second sub-assemblies by partially surrounding the periphery of the third insulator.

4. The high density connector structure for transmitting high frequency signals of claim 1, wherein the shield plate has a plurality of the resilient arms, at least one of the resilient arms of the shield plate contact the least one first contact of the first sub-assembly, and plural of the plurality of the resilient arms contact plural of the plurality second contacts of the second sub-assembly.

5. The high density connector structure for transmitting high frequency signals of claim 1, wherein the first sub-assembly, the shield plate and the second sub-assembly interact with each other through an assembly structure.

6. The high density connector structure for transmitting high frequency signals of claim 5, wherein the assembly structure is a structure which generates a frictional force after the assembly of the first insulator and the second insulator.

7. The high density connector structure for transmitting high frequency signals of claim 5, wherein the assembly structure is plural of the plurality of the resilient arms of the shield plate.

8. The high density connector structure for transmitting high frequency signals of claim 1, wherein the first and second insulators jointly form a tongue-shaped plate, and the tongue-shaped plate extends towards a direction for mating with a mating connector.

9. The high density connector structure for transmitting high frequency signals of claim 8, wherein the first contacts and the second contacts are arranged on two opposite surfaces of the tongue-shaped plate.

10. The high density connector structure for transmitting high frequency signals of claim 1, wherein the plurality of resilient arms of the shield plate contact the plurality of first contacts.

11. The high density connector structure for transmitting high frequency signals of claim 1, wherein the first insulator has a plurality of through holes, so that the resilient arms of the shield plate pass through the first insulator and contact the first contacts.

12. The high density connector structure for transmitting high frequency signals of claim 1, wherein the first insulator of the first sub-assembly is directly formed on the surfaces of the first contacts through an insert molding method.

13. The high density connector structure for transmitting high frequency signals of claim 1, further comprising an assistant component arranged between the second contacts to ensure the distances between adjacent second contacts.

14. The high density connector structure for transmitting high frequency signals of claim 1, wherein the shield plate is electrically connected with the shield shell.

15. The high density connector structure for transmitting high frequency signals of claim 14, wherein the shield plate has at least a side limb, and the side limb contacts the shield shell.

16. The high density connector structure for transmitting high frequency signals of claim 1, wherein the second insulator of the second sub-assembly has a groove, and the first insulator of the first sub-assembly is at least partially assembled in the groove of the second sub-assembly.

17. The high density connector structure for transmitting high frequency signals of claim 1, wherein first insulator and the second insulator are integrated as a whole, so that the first insulator is formed as one part of the second insulator.

18. The high density connector structure for transmitting high frequency signals of claim 17, wherein the integrated first insulator and the second insulator have a guided groove, and the shield plate is assembled in the guided groove.