Numerically Controlled Workpiece Processing Apparatuses and Related Methods

• US 20140025191A1
• Filed: 09/27/2013
• Published: 01/23/2014
• Est. Priority Date: 03/30/2011
• Status: Active Grant

• Current Assignee: Trumpf Laser- und Systemtechnik GmbH (TRUMPF SE + Co. KG)
• Original Assignee: Trumpf Laser- und Systemtechnik GmbH (TRUMPF SE + Co. KG)
• Inventors: Wadehn, Wolf
• Granted Patent: US 9,766,612 B2
• Time in Patent Office: Days
• US Class Current: 700/166
• CPC Class Codes: B23K 26/048 by controlling the distance between laser head and workpiece
• CPC Class Codes: B23K 26/0876 in at least two axial directions
• CPC Class Codes: G05B 19/402 characterised by control arrangements for positioning, e.g. centring a tool relative to a hole in the workpiece, additional detection means to correct position G05B19/19 takes precedence
• CPC Class Codes: G05B 19/4083 Adapting programme, configuration
• CPC Class Codes: G05B 2219/37573 In-cycle, insitu, during machining workpiece is measured continuously

Abstract

A method of processing structurally identical workpieces using a numerically controlled workpiece processing apparatus includes processing a first workpiece according to a first desired tool path specified for a tool of the numerically controlled workpiece processing apparatus by closed-loop controlling a working distance between the tool and the workpiece to achieve a defined desired distance, such that when processing the first workpiece, the tool is moved along a distance-controlled actual tool path. The method further includes optimizing the first desired tool path for a second workpiece based on the distance-controlled actual tool path of the first workpiece to provide a second desired tool path and processing the second workpiece according to the second desired tool path.

Claims

1-13. -13. (canceled)

14. A method of processing structurally identical workpieces using a numerically controlled workpiece processing apparatus, comprising:

processing a first workpiece according to a first desired tool path specified for a tool of the numerically controlled workpiece processing apparatus by closed-loop controlling a working distance between the tool and the first workpiece to achieve a defined desired distance, such that when processing the first workpiece, the tool is moved along a distance-controlled actual tool path;

optimizing the first desired tool path for a second workpiece based on the distance-controlled actual tool path of the first workpiece to provide a second desired tool path; and

processing the second workpiece according to the second desired tool path.

15. The method according to claim 14, further comprising:

detecting axial positions of the tool along and/or about motion axes of the tool as the tool is moved along the distance-controlled actual tool path; and

determining the distance-controlled actual tool path based on the axial positions.

16. The method according to claim 14, wherein the second desired tool path is optimized such that the second desired tool path corresponds to the distance-controlled actual tool path along which the tool moved during processing of the first workpiece.

17. The method according to claim 14, wherein the first and second desired tool paths are optimized in a manner such that the first and second desired tool paths are encoded by a number and/or spatial sequence of path interpolation points that are based on an operationally optimized motion of the tool.

18. The method according to claim 14, wherein the first and second desired tool paths are optimized automatically via a numerical control (NC) device.

19. The method according to claim 14, further comprising:

determining a path deviation between the distance-controlled actual tool path and the first desired tool path; and

optimizing the first desired tool path.

20. The method according to claim 19, further comprising assessing a workpiece quality of the first workpiece based on the path deviation.

21. The method according to claim 19, further comprising determining a path deviation trend from a plurality of path deviations.

22. The method according to claim 21, further comprising graphically displaying the path deviation trend.

23. The method according to claim 14, further comprising graphically displaying a virtual workpiece image that is generated from computer-aided (CAD) design data related to the first workpiece and stored in a control system of the numerically controlled workpiece processing apparatus, and/or graphically displaying at least a portion of the first desired tool path and/or the distance-controlled actual tool path.

24. The method according to claim 14, wherein the working distance between the tool and the first workpiece is measured in a non-contacting manner.

25. The method according to claim 24, wherein the working distance between the tool and the first workpiece is measured optically or capacitively.

26. The method according to claim 14, further comprising assessing a workpiece quality of the first workpiece based on the distance-controlled actual tool path.

27. A workpiece processing apparatus, comprising:

a tool;

a distance measuring device associated with the tool and configured to measure a working distance between the tool and a workpiece; and

a numerical control (NC) device programmed to execute a method comprising;

processing a first workpiece according to a first desired tool path specified for the tool by closed-loop controlling the working distance between the tool and the first workpiece to achieve a defined desired distance, such that when processing the first workpiece, the tool is moved along a distance-controlled actual tool path;

optimizing the first desired tool path for a second workpiece based on the distance-controlled actual tool path of the first workpiece to provide a second desired tool path; and

processing the second workpiece according to the second desired tool path.

28. The workpiece processing apparatus according to claim 27, wherein the workpiece processing apparatus is a laser processing apparatus, and the tool is a laser tool.

29. The workpiece processing apparatus according to claim 27, wherein the NC device is configured to optimize the second desired tool path such that the second desired tool path corresponds to the distance-controlled actual tool path along which the tool moved during processing of the first workpiece.

30. The workpiece processing apparatus according to claim 27, wherein the NC device is configured to optimize the first and second desired tool paths in a manner such that the first and second desired tool paths are encoded by a number and/or spatial sequence of path interpolation points that are based on an operationally optimized motion of the tool.

31. The workpiece processing apparatus according to claim 27, wherein the NC device is configured to automatically optimize the first and second desired tool paths.

32. The workpiece processing apparatus according to claim 27, wherein the distance measuring device is a non-contact sensor.

33. The workpiece processing apparatus according to claim 32, wherein the distance measuring device is an optical or capacitive sensor.