DYNAMIC TEMPERATURE CALIBRATION

• US 20140025330A1
• Filed: 07/11/2013
• Published: 01/23/2014
• Est. Priority Date: 07/11/2012
• Status: Abandoned Application

• Current Assignee: mCube, Inc.
• Original Assignee: mCube, Inc.
• Inventors: Bhandari, Sanjay
• Application Number:
  US13/940,199
• Publication Number:
  US 20140025330A1
• Time in Patent Office: Days
• US Class Current: 702/99
• CPC Class Codes: G01P 21/00 Testing or calibrating of apparatus or devices covered by the preceding groups

Abstract

A hand-held processor system for processing data from an integrated MEMS (Micro-Electro-Mechanical-Systems) device disposed within a hand-held computer system and methods therefor. The Dynamic Temperature Correction (DTC) process computes offset values to calibrate MEMS sensors using a single set of data measurements at an orientation without dynamic perturbation and one or more temperature data measurements, and without requiring advance knowledge of orientation of the device. Arbitrary output biases, which are known to be dominant on a single axis, can be corrected to ensure consistent performance. The DTC process provides a simple method to effectively calibrate a MEMS sensor without requiring extensive system resources. This process can be enhanced by additional estimations of sensor offsets using the set of data measurements or by use of rule-based empirical gain factors.

Claims

1. A micro-processor, on-chip logic, or software implemented method for processing data from an integrated MEMS device having an inertial sensor and a temperature sensor disposed within a hand-held computer system programmed to perform the method, the method comprising:

sensing, by the inertial sensor disposed within the computer system, one or more calibration data measurements;

sensing, by the temperature sensor disposed within the computer system, one or more temperature data measurements; and

determining, with a processor disposed within the computer system, computed offset data for the MEMS sensor through a dynamic temperature correction (DTC) process using the calibration data measurements and the temperature data measurements.

2. The method of claim 1 wherein the sensing of the one or more calibration data measurements comprises sensing X, Y, and Z axis sensor data in one or more static orientations for a predetermined time period;

and

wherein the sensing of the one or more temperature data measurements comprises sensing a first temperature measurement and a second temperature measurement.

3. The method of claim 2 wherein the DTC process includes determining Temperature Coefficient of Offset (TCO) values for the X, Y, and Z axis of the sensor with a Dynamic Offset Correction (DOC) process using the first and second temperature measurements and the one or more data calibration measurements;

wherein the DOC process includes determining a first calibration offset value related to the first temperature measurement and a second calibration offset value related to the second temperature measurement.

4. The method of claim 3 wherein the determining of the TCO values for the X, Y, and Z axis of the sensor is calculated as:

T_Cx=(X<sub>off—

T1</sub>−

X_{off T2})/(T₁−

T₂), where T₁ is the first temperature measurement, T₂ is the second temperature measurement, X<sub>off—

T1</sub> is the first calibration measurement, and X<sub>off—

T2</sub> is the second calibration measurement.

5. The method of claim 1 wherein the DTC process includes determining Temperature Coefficient of Offset (TCO) values using a Dynamic Offset Correction (DOC) process using the one or more temperature data measurements and the one or more calibration data measurements.

6. The method of claim 1 wherein the DTC process is configured as a background DTC process that constantly runs until predetermined calibration conditions are met;

wherein the predetermined calibration conditions include time period conditions, stationary conditions, temperature conditions, geometric diversity conditions, or data limit conditions.

7. The method of claim 6 wherein the conditions of time period, stationary conditions, temperature conditions, geometric diversity conditions, or data limit conditions are modified over time to improve accuracy after an initial period of convergence or completion using less stringent conditions.

8. A micro-processor, on-chip logic, or software implemented method for processing data from a MEMS (Micro-Electro-Mechanical-Systems) sensor and a temperature sensor disposed within a hand-held computer system programmed to perform the method, the method comprising:

sensing, by the MEMS sensor disposed within the computer system, a single calibration data measurement point;

sensing, by the temperature sensor disposed within the computer system, one or more temperature data measurement points; and

determining, with a processor disposed within the computer system, computed offset data for the MEMS sensor through a Single Point Dynamic Temperature Correction (SPDTC) process using the single calibration data measurement point and the one or more temperature data measurement points.

9. The method of claim 8 wherein the sensing of the single calibration data measurement point comprises sensing a set of X, Y, and Z axis sensor data in one static orientation for a predetermined time period.

10. The method of claim 8 wherein the SPDTC process includes determining Temperature Coefficient of Offset (TCO) values using the one or more temperature data measurements and the single calibration data measurements.

11. The method of claim 10 further comprising applying the TCO values to a single axis of the MEMS sensor assumed to have the worst errors.

12. The method of claim 11 wherein the SPDTC process comprises:

determining rule-based empirical gain factors using the single calibration data measurement point and a priori error statistic of an axis of the component; and

applying the rule-based empirical gain factors to the computed offset data and applying the computed offset data to the X, Y, or Z axis of the MEMS sensor.

13. The method of claim 8 wherein the SPDTC process is configured as a background DTC process that constantly runs until predetermined calibration conditions are met;

wherein the predetermined calibration conditions include time period conditions, stationary conditions, or data limit conditions.

14. The method of claim 13 wherein time period conditions, stationary conditions, or data limit conditions are modified over time to improve accuracy after an initial period of convergence or completion using less stringent conditions.

15. The method of claim 8 wherein the DTC process includes determining self-test based actuation and measurement information.

16. A hand-held inertial sensor system for processing data from an integrated MEMS (Micro-Electro-Mechanical-Systems) device disposed within the hand-held inertial sensor system, the system comprising:

a housing;

a tangible memory for storing a plurality of executable instructions;

an integrated MEMS device disposed within the housing, the integrated MEMS device including a MEMS sensor;

a temperature sensor disposed within the housing; and

a processor disposed within the housing and coupled to the tangible memory and the integrated MEMS device and the temperature sensor, wherein the processor is programmed to perform a plurality of functions by the plurality of executable instructions;

wherein the plurality of executable instructions comprises;

executable code that programs the processor to sense, by the MEMS sensor disposed within the computer system, one or more calibration data measurements;

executable code that programs the processor to sense, by the temperature sensor disposed within the computer system, one or more temperature data measurements; and

executable code that programs the processor to determine, with the processor disposed within the computer system, computed offset data for the MEMS sensor through a Dynamic Temperature Correction (DTC) process using the one or more calibration data measurements and the one or more temperature data measurements.

17. The system of claim 16 wherein the executable code that programs the processor to sense the one or more calibration data measurements comprises:

executable code that programs the processor to sense, by the MEMS sensor, a set of X, Y, and Z axis sensor data in one static orientation for a predetermined time period.

18. The system of claim 16 wherein the executable code that programs the processor to determine the computed offset data using the DTC process comprises:

executable code that programs the processor to determine Temperature Coefficient of Offset (TCO) values using a Dynamic Offset Correction (DOC) process using the one or more temperature data measurements and the one or more calibration data measurements.

19. The system of claim 16 wherein the DOC process comprises a Single Point Dynamic Temperature Correction (SPDTC) process and the determining of the computed offset data using the DTC process includes determining the computed offset data using the SPDTC process;

wherein the sensing of the one or more calibration data measurements comprises sensing a single calibration data measurement; and

wherein the executable code that programs the processor to determine the computed offset data using the SPDTC process comprises;

executable code that programs the processor to determine Temperature Coefficient of Offset (TCO) values using a the one or more temperature data measurements and the single calibration data measurement.

20. The system of claim 19 wherein the plurality of executable instructions comprises:

executable code that programs the processor to apply the computed offset data to a single axis of the MEMS sensor assumed to have the worst errors.

21. The system of claim 20 wherein the executable code that programs the processor to determine the computed offset data using the SPDTC process comprises:

executable code that programs the processor to determine rule-based empirical gain factors using the single calibration data measurement point; and

executable code that programs the processor to apply the rule-based empirical factors to the computed offset data and applying the computed offset data to the X, Y, or Z axis of the MEMS sensor.

22. The system of claim 16 wherein the plurality of executable instructions comprise:

executable code that programs the processor to initiate the DTC process in response to a user, developer, or manufacturer command;

executable code that programs the processor to run the DTC process constantly as a background DTC process until time period conditions, stationary conditions, or data limit conditions are met, or

executable code that programs the processor to initiate the DTC process.

23. The system of claim 16 wherein the plurality of executable instructions comprises executable code that programs the processor to determine self-test based actuation and measurement information.