Apparatus And Method For Providing An Inerting Gas During Soldering

• US 20140027495A1
• Filed: 09/27/2013
• Published: 01/30/2014
• Est. Priority Date: 04/18/2012
• Status: Abandoned Application

• Current Assignee: Air Products and Chemicals Incorporated (Linde Plc)
• Original Assignee: Air Products and Chemicals Incorporated (Linde Plc)
• Inventors: Arslanian, Gregory Khosrov, Wu, Jerry, Wang, Victor
• Application Number:
  US14/039,552
• Publication Number:
  US 20140027495A1
• Time in Patent Office: Days
• US Class Current: 228/37
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 1/085 Wave soldering
• CPC Class Codes: B23K 1/203 Fluxing, i.e. applying flux onto surfaces
• CPC Class Codes: B23K 2101/42 Printed circuits
• CPC Class Codes: B23K 3/0653 with wave generating means, e.g. nozzles, jets, fountains
• CPC Class Codes: B23K 3/08 Auxiliary devices therefor cleaning pipes or tubes or systems of pipes or tubes, e.g. before soldering, B08B9/02
• CPC Class Codes: B23K 3/082 Flux dispensers; Apparatus for applying flux
• CPC Class Codes: H05K 2203/044 Solder dip coating, i.e. coating printed conductors, e.g. pads by dipping in molten solder or by wave soldering
• CPC Class Codes: H05K 2203/081 Blowing of gas, e.g. for cooling or for providing heat during solder reflowing
• CPC Class Codes: H05K 2203/086 Using an inert gas
• CPC Class Codes: H05K 3/3468 Applying molten solder

Abstract

Described herein is an apparatus and method for providing an inerting gas during the application of soldering to a work piece. In one aspect, there is provided an apparatus for providing an inerting gas into an atmosphere above a solder reservoir during soldering of a work piece comprising: a base comprising an interior volume in fluid communication with an inerting gas source, a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough, and one or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube, wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, and wherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube.

Claims

1. An apparatus for supplying inerting gas during soldering of a work piece comprising:

a base comprising an interior volume in fluid communication with an inerting gas source;

a tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough; and

one or more support legs comprising an interior volume in fluid communication with the interior volume of the base and the interior volume of the tube;

wherein the one or more support legs extend vertically upward from the base and elevate the tube above the surface of molten solder contained within a solder reservoir, and

wherein the inerting gas travels through the base, upward through the one or more support legs, into the interior volume of the tube, and out through the one or more perforations in the tube.

2. The apparatus of claim 1, further comprising a second tube having an interior volume and comprising one or more perforations for the flow of inerting gas therethrough, wherein the second tube resides within the interior volume of the base.

3. The apparatus of claim 1, wherein the inerting gas source is supplied to the base at a location equidistant from the ends of the base.

4. The apparatus of claim 1, wherein the apparatus comprises two support legs and the inerting gas source is supplied to the base at a location equidistant from the one or more support legs.

5. The apparatus of claim 1, wherein the perforations in the tube are located along the bottom of the tube such that inerting gas flows downward through the perforations in the tube onto the surface of the molten solder.

6. The apparatus of claim 5, wherein the perforations are arranged in a single line along the bottom center line of the tube.

7. The apparatus of claim 5, wherein the perforations are arranged in two lines spaced equidistant from the center bottom line of the tube, such that the lines are from about 30°

to about 90°

apart.

8. The apparatus of claim 5, wherein the perforations are arranged in three lines spaced along the bottom of the tube and equidistant from one another, such that the outermost rows are from about 60°

to about 120°

apart.

9. The apparatus of claim 1, wherein one or more of the base, one or more support legs, and tube are comprised of or coated with a non-stick material.

10. The apparatus of claim 1, wherein the flow of the inerting gas through the apparatus is from about 0.5 to about 8.0 m³ per hour.

11. The apparatus of claim 1, wherein at least a portion of the base is submerged below the surface of the molten solder.

12. The apparatus of claim 10, wherein at least a portion of the one or more support legs is submerged below the surface of the molten solder.