AGGREGATION OF SEMICONDUCTOR DEVICES AND THE METHOD THEREOF
First Claim
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1. An aggregation of semiconductor devices, comprising:
- a first layer comprising a first surface and a second surface;
a second layer comprising a first region and a second region; and
a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark.
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Abstract
An aggregation of semiconductor devices, comprising: a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark.
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Citations
20 Claims
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1. An aggregation of semiconductor devices, comprising:
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a first layer comprising a first surface and a second surface; a second layer comprising a first region and a second region; and a plurality of semiconductor devices disposed between the first layer and the second region wherein a shape of the second region comprises a curve and a mark. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of manufacturing an aggregation of semiconductor devices comprising the steps:
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providing a first layer comprising an adhesive glue layer formed thereon; sequentially addressing and adhering a plurality of semiconductor devices to the adhesive glue layer; providing a second layer; and forming a second region by adhering the second layer to the first layer by the adhesive glue layer to cover the plurality of semiconductor devices, wherein the shape of the second region comprises a curve and a mark. - View Dependent Claims (19, 20)
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Specification