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INTEGRATED INDUCTOR FOR INTEGRATED CIRCUIT DEVICES

  • US 20140027880A1
  • Filed: 12/29/2011
  • Published: 01/30/2014
  • Est. Priority Date: 12/29/2011
  • Status: Active Grant
First Claim
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1. A method, comprising:

  • forming a first turn of a first through-body-via-based inductor in a die having a back side and a front side of the die, the inductor first turn forming comprising;

    forming first and second conductive through-body-vias passing through the body of the die from the front side of the die to the back side of the die, said first and second through-body-vias each having a front side end at the front side of the die and said first and second through-body-vias each having a back side end at the back side of the die.

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