CONTROL OF UNIFORMITY IN A SURFACE WAVE PLASMA SOURCE
First Claim
1. A surface wave plasma source (SWPS), comprising:
- an electromagnetic (EM) wave launcher configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface located adjacent said plasma, said EM wave launcher comprising a slot antenna having a plurality of slots formed therethrough configured to couple said EM energy from a first region above said slot antenna to a second region below said slot antenna;
a dielectric window positioned in said second region and having a lower surface of said dielectric window including said plasma surface;
an attenuation assembly disposed between said slot antenna and said plasma surface, wherein said attenuation assembly includes a first fluid channel substantially aligned with a first arrangement of slots in said plurality of slots and configured to receive a first flow of a first fluid at a first fluid temperature; and
a power coupling system coupled to said EM wave launcher and configured to provide said EM energy to said EM wave launcher for forming said plasma.
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Accused Products
Abstract
A surface wave plasma source (SWPS) is disclosed, having an electromagnetic (EM) wave launcher including a slot antenna configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface of the SWPS adjacent the plasma. The SWPS also includes a dielectric window positioned below the slot antenna, having a lower surface and the plasma surface. The SWPS further includes an attenuation assembly disposed between the slot antenna and the plasma surface. The attenuation assembly includes a first fluid channel substantially aligned with a first arrangement of slots in the slot antenna, and is configured to receive a first flow of a first fluid at a first fluid temperature. The SWPS finally includes a power coupling system coupled to the EM wave launcher and configured to provide EM energy to the EM wave launcher for forming the plasma.
222 Citations
20 Claims
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1. A surface wave plasma source (SWPS), comprising:
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an electromagnetic (EM) wave launcher configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface located adjacent said plasma, said EM wave launcher comprising a slot antenna having a plurality of slots formed therethrough configured to couple said EM energy from a first region above said slot antenna to a second region below said slot antenna; a dielectric window positioned in said second region and having a lower surface of said dielectric window including said plasma surface; an attenuation assembly disposed between said slot antenna and said plasma surface, wherein said attenuation assembly includes a first fluid channel substantially aligned with a first arrangement of slots in said plurality of slots and configured to receive a first flow of a first fluid at a first fluid temperature; and a power coupling system coupled to said EM wave launcher and configured to provide said EM energy to said EM wave launcher for forming said plasma. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for controlling plasma properties in a surface wave plasma source (SWPS), comprising:
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providing an electromagnetic (EM) wave launcher configured to couple EM energy in a desired EM wave mode to a plasma by generating a surface wave on a plasma surface located adjacent said plasma, said EM wave launcher comprising a slot antenna having a plurality of slots formed therethrough configured to couple said EM energy from a first region above said slot antenna to a second region below said slot antenna; positioning a dielectric window in said second region and having a lower surface of said dielectric window including said plasma surface, disposing an attenuation assembly between said slot antenna and said plasma surface, wherein said attenuation assembly includes a first fluid channel substantially aligned with a first arrangement of slots in said plurality of slots and configured to receive a first flow of a first fluid at a first fluid temperature; coupling a power coupling system to said EM wave launcher configured to provide said EM energy to said EM wave launcher for forming said plasma; and controlling a plasma property of said plasma by adjusting a dielectric property of said attenuation assembly, wherein said adjusting is of said first fluid temperature. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification