POWER PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
First Claim
Patent Images
1. A power package module, comprising:
- a lead frame;
at least one first electronic component mounted on the lead frame; and
an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component,wherein the via electrode extends to the first surface.
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Abstract
There is provided a power package module, including: a lead frame; at least one first electronic component mounted on the lead frame; and an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component.
85 Citations
23 Claims
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1. A power package module, comprising:
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a lead frame; at least one first electronic component mounted on the lead frame; and an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component, wherein the via electrode extends to the first surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A power package module, comprising:
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a heat dissipating member; at least one first electronic component mounted on the heat dissipating member; an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component; and a lead frame connected to the insulating member, wherein the via electrode extends to the first surface. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19)
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20. A manufacturing method of a power package module, the manufacturing method comprising:
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mounting at least one electronic component on a lead frame; disposing a circuit pattern connected to the lead frame and an insulating member provided with a through hole on a first surface of the electronic component; and forming a via electrode connecting the electronic component and the circuit pattern by filling the through hole with a conductive material. - View Dependent Claims (21)
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22. A manufacturing method of a power package module, comprising:
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mounting a heat dissipating member on a lead frame; mounting at least one electronic component on the heat dissipating member; disposing an insulating member provided with a pattern groove and a through hole on a first surface of the electronic component; and forming a connection circuit connecting the electronic component and the lead frame by filling the pattern groove and the through hole with a conductive material. - View Dependent Claims (23)
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Specification