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POWER PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

  • US 20140029201A1
  • Filed: 09/14/2012
  • Published: 01/30/2014
  • Est. Priority Date: 07/25/2012
  • Status: Abandoned Application
First Claim
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1. A power package module, comprising:

  • a lead frame;

    at least one first electronic component mounted on the lead frame; and

    an insulating member disposed on a first surface of the first electronic component and having a via electrode connected to the first electronic component,wherein the via electrode extends to the first surface.

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