RECTIFIER MODULE FOR POWER CONVERSION CIRCUITS

• US 20140029319A1
• Filed: 06/04/2013
• Published: 01/30/2014
• Est. Priority Date: 07/27/2012
• Status: Active Grant

• Current Assignee: Illinois Tool Works Inc.
• Original Assignee: Illinois Tool Works Inc.
• Inventors: Jochman, Nathan J.
• Granted Patent: US 9,380,717 B2
• Time in Patent Office: Days
• US Class Current: 363/67
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 23/3675 characterised by the shape of the housing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H02M 7/003 Constructional details, e.g. physical layout, assembly, wiring or busbar connections
• CPC Class Codes: H02M 7/06 using discharge tubes without control electrode or semiconductor devices without control electrode
• CPC Class Codes: H05K 5/0091 Housing specially adapted for small components for resistors H01C; for capacitors H01G; for integrated circuits H01L23/00
• CPC Class Codes: H05K 5/0213 Venting apertures; Constructional details thereof
• CPC Class Codes: H05K 5/0247 Electrical details of casings, e.g. terminals, passages for cables or wiring
• CPC Class Codes: H05K 5/04 Metal casings
• CPC Class Codes: H05K 7/1432 specially adapted for power drive units or power converters
• CPC Class Codes: H05K 7/14322 wherein the control and power circuits of a power converter are arranged within the same casing
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A rectifier module comprises a conductive housing made of injection molded aluminum or aluminum alloy. Diodes are inserted into recesses formed in the housing. The housing is placed at an alternating input potential during operation, and transmits alternating current input power to the diode modules for conversion to direct current power. Multiple recesses may be provided for high and low side diodes, of which there may be one or many. Multiple such modules may be provided for converting multiple phases of input power to direct current power.

Claims

1. A rectifier module for power conversion circuits, comprising:

a conductive housing having a plurality of recesses, the conductive housing configured to be placed at an alternating input potential in operation; and

at least one high side diode and at least one low side diode, the high and low side diodes being disposed in the recesses and receiving input power through the conductive housing and outputting rectified power in operation.

2. The rectifier module of claim 1, wherein the conductive housing is made of aluminum or an aluminum alloy.

3. The rectifier module of claim 2, wherein the conductive housing is made by injection molding of the aluminum or aluminum alloy.

4. The rectifier module of claim 1, wherein the conductive housing comprises integral heat dissipation fins.

5. The rectifier module of claim 4, wherein the fins extend from a side of the conductive housing opposite a side in which the recesses are formed.

6. The rectifier module of claim 1, wherein the conductive housing comprises multiple high side recesses for multiple high side diodes and multiple low side recesses for low side diodes.

7. The rectifier module of claim 1, wherein the conductive housing comprises a flange extending around at least a part of the conductive housing for securing the rectifier module to a support structure in operation.

8. The rectifier module of claim 1, wherein the diodes are press fit into the recesses to ensure electrical contact between an external conductive surface of the diodes and an interior conductive surface of the recesses.

9. A power conversion circuit, comprising:

a non-conductive support structure supporting power conversion circuitry; and

at least one rectifier module comprising a conductive housing having a plurality of recesses, the conductive housing configured to be placed at an alternating input potential in operation, and at least one high side diode and at least one low side diode, the high and low side diodes being disposed in the recesses and receiving input power through the conductive housing and outputting rectified power in operation.

10. The power conversion circuit of claim 9, wherein the conductive housing comprises a flange extending around at least a portion of the conductive housing, and wherein the support structure receives the flange to hold the rectifier module in place.

11. The power conversion circuit of claim 9, comprising three self-similar rectifier modules for converting three-phase input power to direct current power applied to a direct current bus.

12. The power conversion circuit of claim 9, wherein the conductive housing is made of aluminum or an aluminum alloy.

13. The power conversion circuit of claim 12, wherein the conductive housing is made by injection molding of the aluminum or aluminum alloy.

14. The power conversion circuit of claim 9, wherein the conductive housing comprises integral heat dissipation fins.

15. The power conversion circuit of claim 14, wherein the fins extend from a side of the conductive housing opposite a side in which the recesses are formed.

16. The power conversion circuit of claim 9, wherein the conductive housing comprises multiple high side recesses for multiple high side diodes and multiple low side recesses for low side diodes.

17. A housing for a rectifier module, comprising:

a conductive housing having a plurality of recesses for receiving diodes, the conductive housing configured to be placed at an alternating input potential in operation and to transmit input power to the diodes via interior surfaces of the recesses.

18. The housing of claim 17, wherein the conductive housing is made of aluminum or an aluminum alloy.

19. The housing of claim 18, wherein the conductive housing is made by injection molding of the aluminum or aluminum alloy.

20. The housing of claim 17, wherein the conductive housing comprises integral heat dissipation fins.