Kinematic Holding System For A Placement Head Of A Placement Apparatus

• US 20140030052A1
• Filed: 07/23/2013
• Published: 01/30/2014
• Est. Priority Date: 07/24/2012
• Status: Active Grant

• Current Assignee: Besi Switzerland Ag
• Original Assignee: Besi Switzerland Ag
• Inventors: Kostner, Hannes, Lackner, Dietmar, Speer, Florian, Widauer, Martin
• Granted Patent: US 9,364,953 B2
• Time in Patent Office: Days
• US Class Current: 414/749.6
• CPC Class Codes: B25J 17/0208 Compliance devices
• CPC Class Codes: H05K 13/0404 Pick-and-place heads or apparatus, e.g. with jaws
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools

Abstract

A kinematic holding system for a placement head of a placement apparatus comprises a placement head alignment device which comprises at least one length-variable holding member arranged at a distance from a joint between a placement head support and the placement head. This holding member determines the pivoting position of the placement head relative to the placement head support. The length of the holding member is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error (tilt) of the placement head caused by the deformation of the placement head guide device is compensated.

Claims

1. Kinematic holding system for a placement head of a placement apparatus for mounting electronic or optical components on substrates, comprising

a placement head guide device comprising a placement head support for holding the placement head, and

a placement head alignment device for adjusting the alignment of the placement head relative to the placement head support, wherein the placement head alignment device comprises a joint via which the placement head is supported in an inclination-adjustable way on the placement head support, and wherein the placement head alignment device comprises at least one length-variable holding member which is arranged at a distance from the joint between the placement head support and the placement head and which determines the pivoting position of the placement head relative to the placement head support and whose length is changeable during the placement operation depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error of the placement head caused by the deformation of the placement head guide device is compensated.

2. Holding system according to claim 1, wherein the length-variable holding member has a longitudinal axis which is arranged parallel or transversely to the longitudinal axis of the placement head.

3. Holding system according to claim 1, wherein the placement head is pivotably mounted by means of a placement head console on the placement head support, and wherein the length-variable holding member is supported on the placement head console.

4. Holding system according to claim 1, wherein the placement head alignment device comprises a plurality of joint rods which are connected via joints both to the placement head and also the placement head support, and which hold the placement head in a predetermined variable position relative to the placement head support, wherein the relative position of the joint rods is variable by means of the length-variable holding member in such a way that the deformation-induced axis error of the placement head is compensated.

5. Holding system according to claim 1, wherein the length-variable holding member consists of a passive element in form of a spring, which is arranged in such a way between the placement head support and the placement head that the pressing force is transferred by the placement head support to the placement head via the joint on the one hand and via the spring on the other hand, wherein the reaction force produced by the pressing force produces a change in length of the spring.

6. Holding system according to claim 1, wherein the length-variable holding member consists of a travel-controlled or force-controlled actuator.

7. Holding system according to claim 6, wherein the actuator comprises an electric direct drive, a voice coil or a piezo drive.

8. Holding system according to claim 6, wherein the actuator acts on the axial position of the placement head via a lever arrangement or a gear.

9. Holding system according to claim 1, wherein the placement head alignment device comprises a motion blocking device for blocking the relative movements of the placement head relative to the placement head support.

10. Holding system according to claim 6, wherein the actuator is formed as lockable actuator.

11. Holding system according to claim 1, wherein the placement head is suspended in its upper or bottom end region in pendulum fashion on the placement head support, and is supported in the Z direction by means of a joint which has at least one rotary degree of freedom, and that at least one length-variable holding member is provided beneath or above the joint for adjusting the inclination of the placement head relative to the placement head support.

12. Holding system according to claim 11, wherein the joint is arranged as a single-axis joint, ball-and-socket joint or a universal joint.

13. Holding system according to claim 1, wherein a plurality of length-variable holding members is provided, which are arranged in such a way that they act from different directions on the placement head, so that the placement head can be pivoted multi-dimensionally in space.

14. A kinematic holding system for a placement head of a placement apparatus for mounting electronic or optical components on substrates, comprising

a placement head guide device which comprises a placement head support for holding the placement head, and

a placement head alignment device for adjusting the alignment of the placement head relative to the placement head support, wherein the placement head alignment device comprises a joint via which the placement head is supported in an inclination-adjustable way on the placement head support,

wherein the placement head alignment device comprises at least one solid joint element with at least one first solid joint arm which is rigidly connected to the placement head support, and comprises at least one second solid joint which is rigidly connected to the placement head and elastically connected to the first solid joint arm by means of a solid joint, wherein the second solid joint arm is elastically deformable in relation to the first solid joint arm depending on a deformation of the placement head guide device caused by the pressing force of the placement head against the substrate in such a way that an axis error of the placement head caused by the deformation of the placement head guide device is compensated.

15. Holding system according to claim 14, wherein the placement head alignment device comprises two parallel first joint arms which are arranged on opposite sides of the placement head, are laterally spaced from said placement head, and are connected to each other on an end side by means of a transverse arm, and comprises a second joint arm which is arranged centrally between the two first joint arms and is also connected to the transverse arm.

16. Holding system according to claim 14, wherein a rotational axis of the joint is arranged relative to a deformation rotational axis, about which the deformation of the placement head guide device occurs in reaction to the pressing force, in such a way that straight lines through the rotational axis of the joint and through the deformation rotational axis are in the unloaded and loaded state of the placement head in an angular range of between −

45° and

+45°

with respect to the horizontal plane in which the deformation rotational axis is disposed.

17. Holding system according to claim 16, wherein the rotational axis of the joint is disposed beneath the deformation rotational axis in the unloaded state of the placement head and above said deformation rotational axis under full placement force.