LIGHT-EMITTING DIODE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

• US 20140034976A1
• Filed: 12/11/2012
• Published: 02/06/2014
• Est. Priority Date: 08/03/2012
• Status: Abandoned Application

• Current Assignee: Chi Mei Lighting Technology Corp. (InnoLux Corporation)
• Original Assignee: Chi Mei Lighting Technology Corp. (InnoLux Corporation)
• Inventors: Chu, Chang-Hsin, Lee, Hsueh Lin, Hsu, Chih Kuei, Chen, Yuan Tze, Wu, Hao-Ching
• Application Number:
  US13/711,268
• Publication Number:
  US 20140034976A1
• Time in Patent Office: Days
• US Class Current: 257/93
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting diode (LED) structure and a method for manufacturing the same. The LED structure includes an insulation substrate, a plurality of LED chips and a plurality of interconnection layers. Each LED chip includes an epitaxial layer and a dielectric layer stacked on a surface of the insulation substrate in sequence. Each LED chip is formed with a first conductivity type contact hole and a second conductivity type contact hole penetrating the dielectric layer, and a first isolation trench disposed in the epitaxial layer and between the second conductivity type contact hole of the LED chip and the first conductivity type contact hole of the neighboring LED chip. Each interconnection layer extends from the second conductivity type contact hole of each LED chip to the first conductivity type contact hole of the neighboring LED chip by passing over the first isolation trench to electrically connect the LED chips.

Claims

1. A light-emitting diode (LED) structure, comprising:

an insulating substrate;

a plurality of LED chips, wherein each of the LED chips comprises an epitaxial layer and a dielectric layer stacked in sequence on a surface of the insulating substrate, and each of the LED chips is provided with;

a first conductivity type contact hole and a second conductivity type contact hole that penetrate the dielectric layer; and

a first isolation trench, located in the epitaxial layer, and between the second conductivity type contact hole of the LED chip and the first conductivity type contact hole of the neighboring LED chip; and

a plurality of interconnection layers, wherein each of the interconnection layers extends from the second conductivity type contact hole of each of the LED chip, through the above of the first isolation trench, onto the first conductivity type contact hole of the neighboring LED chip, so as to electrically connect the LED chips.

2. The LED structure according to claim 1, wherein in each of the LED chips, a bottom of the first isolation trench exposes the surface of the insulating substrate.

3. The LED structure according to claim 1, wherein each of the epitaxial layers comprises an undoped semiconductor layer, a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer stacked in sequence on the surface of the insulating substrate, and a conductivity type of the first conductivity type semiconductor layer is different from that of the second conductivity type semiconductor layer.

4. The LED structure according to claim 3, wherein in each of the LED chips, a bottom of the first isolation trench exposes the undoped semiconductor layer.

5. The LED structure according to claim 3, wherein in each of the LED chips, a bottom of the first conductivity type contact hole exposes the first conductivity type semiconductor layer, and a bottom of the second conductivity type contact hole exposes the second conductivity type semiconductor layer.

6. The LED structure according to claim 3, wherein

each of the LED chips further comprises a transparent conductive layer located between the dielectric layer and the epitaxial layer;

a bottom of the first conductivity type contact hole exposes the first conductivity type semiconductor layer; and

a bottom of the second conductivity type contact hole exposes the transparent conductive layer.

7. The LED structure according to claim 6, wherein each of the LED chips further comprises at least one current blocking layer located between the bottom of the second conductivity type contact hole and the epitaxial layer.

8. The LED structure according to claim 3, wherein in each of the LED chips, the epitaxial layer has a groove, the first conductivity type contact hole exposes a part of a bottom of the groove, and the dielectric layer covers a sidewall of the groove.

9. The LED structure according to claim 1, wherein each of the LED chips further comprises an insulating layer, and the insulating layer is filled in the first isolation trench, so as to close an opening of the first isolation trench.

10. The LED structure according to claim 1, wherein each of the LED chips further comprises at least one insulating liner covering a sidewall of the first conductivity type contact hole.

11. The LED structure according to claim 1, wherein the insulating substrate is a pattern sapphire substrate (PSS).

12. A method for manufacturing a light-emitting diode (LED) structure, comprising:

providing an insulating substrate;

forming an epitaxial structure on a surface of the insulating substrate;

forming a plurality of first isolation trenches and a plurality of second isolation trenches in the epitaxial structure, so as to define a plurality of epitaxial layers of a plurality of LED chips, wherein the first isolation trenches are respectively adjacent to the second isolation trenches;

forming a plurality of dielectric layers respectively covering the epitaxial layers;

forming, in each of the LED chips, a first conductivity type contact hole and a second conductivity type contact hole that penetrate the dielectric layer, wherein the first isolation trench in each of the LED chips is located between the second conductivity type contact hole of the LED chip and the first conductivity type contact hole of the neighboring LED chip; and

forming a plurality of interconnection layers, wherein each of the interconnection layers extends from the second conductivity type contact hole of each of the LED chips, through the above of the first isolation trench, onto the first conductivity type contact hole of the neighboring LED chip, so as to electrically connect the LED chips.

13. The method for manufacturing an LED structure according to claim 12, wherein each of the epitaxial layers comprises an undoped semiconductor layer, a first conductivity type semiconductor layer, an active layer and a second conductivity type semiconductor layer stacked in sequence on the surface of the insulating substrate, and a conductivity type of the first conductivity type semiconductor layer is different from that of the second conductivity type semiconductor layer.

14. The method for manufacturing an LED structure according to claim 13, before the step of forming the dielectric layers, further comprising forming a plurality of first insulating layers and a plurality of second insulating layers being respectively filled in the first isolation trenches and the second isolation trenches.

15. The method for manufacturing an LED structure according to claim 14, wherein the step of forming the first insulating layers and the second insulating layers further comprises:

forming an insulating material coving the epitaxial structure and filled in the first isolation trenches and the second isolation trenches; and

performing an etch back step to remove a part of the insulating material.

16. The method for manufacturing an LED structure according to claim 15, after the step of forming the first insulating layers and the second insulating layers, further comprising:

forming a plurality of current blocking layers respectively located between the epitaxial layers and the second conductivity type contact holes; and

forming a plurality of transparent conductive layers respectively located between the dielectric layer and the epitaxial layer.

17. The method for manufacturing an LED structure according to claim 16, wherein in each of the LED chips, a bottom of the first conductivity type contact hole exposes the first conductivity type semiconductor layer, and a bottom of the second conductivity type contact hole exposes the transparent conductive layer.

18. The method for manufacturing an LED structure according to claim 13, wherein in each of the LED chips, a bottom of the first conductivity type contact hole exposes the first conductivity type semiconductor layer, and a bottom of the second conductivity type contact hole exposes the second conductivity type semiconductor layer.

19. The method for manufacturing an LED structure according to claim 13, before the step of forming the interconnection layers, further comprising forming a plurality of insulating liners respectively covering a plurality of sidewalls of the first conductivity type contact holes.

20. The method for manufacturing an LED structure according to claim 13, wherein the step of forming the first conductivity type contact hole in each of the LED chips comprises:

removing a part of the second conductivity type semiconductor layer, a part of the active layer and a part of the first conductivity type semiconductor layer, so as to form a groove in the epitaxial layer;

filling the dielectric layer in the groove; and

removing a part of the dielectric layer, so as to form the first conductivity type contact hole to expose a part of a bottom of the groove, wherein the dielectric layer covers a sidewall of the groove.