STORAGE SYSTEM HAVING A HEATSINK

• US 20140036435A1
• Filed: 03/13/2013
• Published: 02/06/2014
• Est. Priority Date: 08/03/2012
• Status: Abandoned Application

• Current Assignee: MOSAID Technologies Inc. (f/k/a Conversant Intellectual Property Management)
• Original Assignee: Mosaid Technologies Incorporated (MOSAID Technologies Inc. (f/k/a Conversant Intellectual Property Management))
• Inventors: KIM, Jin-Ki
• Application Number:
  US13/800,897
• Publication Number:
  US 20140036435A1
• Time in Patent Office: Days
• US Class Current: 361/679.33
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops

Abstract

A storage system sized to fit within a standard magnetic hard disk drive (HDD) form factor. The storage system includes a solid state disk (SSD) and a cooling means thermally coupled to the body of the SSD. The components of the SSD occupy a smaller volume of space than magnetic HDD'"'"'s. In particular, while the SSD has width and length dimensions matching those of the HDD form factor, the SSD has a height dimension that is less than the HDD form factor. Accordingly, the volume of space between the HDD form factor height and the SSD height is beneficially occupied by the cooling means. The storage system can be then be used as a direct replacement for HDD as it can fit within HDD bays configured for the standardized HDD form factor.

Claims

1. A storage system for a computing device, the storage system comprising:

a solid state drive (SSD);

having a length and a width corresponding to a pre-defined sized hard disk drive (HDD) form factor; and

a cooling device thermally coupled to the SSD, the SSD in combination with the cooling device being dimensioned to fit within the pre-defined sized hard disk drive (HDD) form factor.

2. The storage system of claim 1, wherein the form factor of the SSD in combination with the cooling device is defined by orthogonal dimensions a, b and c, that are less than or equal to the pre-defined sized HDD form factor orthogonal dimensions x, y and z, respectively.

3. The storage system of claim 1, wherein the SSD includes

a printed circuit board (PCB);

a host interface connector connected to the PCB;

a buffer memory mounted to the PCB;

a controller mounted to the PCB; and

at least one memory storage device mounted to the PCB.

4. The storage system of claim 3, wherein the SSD and the cooling device are integrated with each other as a single unit.

5. The storage system of claim 4, further comprising a thermal transfer medium contacting the at least one memory device and an inner surface of the SSD, the thermal transfer medium cooperating with the cooling device for transferring heat away from the at least one memory device.

6. The storage system of claim 3, wherein the SSD includes a base for supporting the PCB.

7. The storage system of claim 6, wherein the SSD includes at least two sidewalls extending substantially perpendicularly from the base and a cover connected to the sidewalls, the base, the sidewalls and the cover forming a case for housing the PCB.

8. The storage system of claim 7, further comprising a thermal transfer medium contacting the at least one memory device and the cover of the SSD, the thermal transfer medium cooperating with the cooling device for transferring heat away from the at least one memory device.

9. The storage system of claim 7, wherein the cooling device is fastened to the cover of the SSD.

10. The storage system of claim 9, further including a thermal transfer medium between the cover and the cooling device.

11. The storage system of claim 10, wherein the thermal transfer medium comprises thermal tape or thermal grease.

12. The storage system of claim 6, wherein the SSD includes at least two sidewalls extending substantially perpendicularly from the base to form an open cavity for containing the PCB.

13. The storage system of claim 12, wherein the cooling device is fastened to the at least two sidewalls of the SSD to cover the open cavity.

14. The storage system of claim 13, further comprising a thermal transfer medium contacting the at least one memory device and the cooling device, the thermal transfer medium cooperating with the cooling device for transferring heat away from the at least one memory device.

15. The storage system of claim 1, wherein the cooling device includes a heat sink.

16. The storage system of claim 15, wherein the cooling device further comprises a fan mounted to the heat sink.

17. The storage system of claim 15, wherein the heat sink includes a plate of thermally conductive material and a plurality of fins extending from the plate, for dissipating heat away from the SSD.

18. The storage system of claim 1, wherein the pre-defined sized HDD form factor is a 3.5 inch form factor.

19. The storage system of claim 1, wherein the pre-defined sized HDD form factor is a 2.5 inch form factor.

20. The storage system of claim 1, wherein the pre-defined sized HDD has an industry standard form factor which fits a standard sized compartment in a computing device.