MEMS Apparatus Disposed On Assembly Lid

• US 20140037115A1
• Filed: 07/29/2013
• Published: 02/06/2014
• Est. Priority Date: 08/01/2012
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Vos, Sandra F., Szczech, John B.
• Granted Patent: US 9,491,539 B2
• Time in Patent Office: Days
• US Class Current: 381/174
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 3/00 Circuits for transducers , loudspeakers or microphones
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182

Abstract

A Microelectromechanical system (MEMS) assembly includes a substrate, lid, MEMS device, and at least one wall. The substrate has electrical connection pads and the electrical connection pads are coupled to electrical conductors extending through the substrate. The MEMS device is attached to the lid. The at least one wall is coupled to the lid and the substrate and is formed separately from the lid and has an electrical conduit disposed therein. The electrical conduit is electrically coupled to the electrical conductors on the substrate. The electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

Claims

1. A Microelectromechanical system (MEMS) assembly comprising,

a base substrate having electrical connection pads, the electrical connection pads coupled to electrical conductors extending through the base substrate;

a lid;

a MEMS device, the MEMS device attached to the lid and mounted over an acoustic port;

at least one wall coupled to the lid and the base substrate, such that the wall contains vertical electrical connections, with at least one wall being formed separately from the lid and the wall having an electrical conduit disposed therein, the electrical conduit coupled electrically to the conductors on the base substrate,

such that the electrical conduit and electrical conductors form an electrical path between the MEMS device and the electrical connection pads.

2. The MEMS assembly of claim 1 further comprising an integrated circuit.

3. The MEMS assembly of claim 2 wherein the integrated circuit comprises an application specific integrated circuit (ASIC).

4. The MEMS assembly of claim 1 wherein the at least one wall portion forms at least one cavity and includes the electrical conduit comprises a vertically conducting path.

5. The MEMS assembly of claim 1 wherein the lid is generally flat.

6. The MEMS assembly of claim 1 wherein the lid contains multiple layers.

7. The MEMS assembly of claim 1 wherein the base substrate contains multiple layers.