Microphone Assembly

• US 20140037120A1
• Filed: 07/29/2013
• Published: 02/06/2014
• Est. Priority Date: 08/01/2012
• Status: Abandoned Application

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Lim, Tony K., Vos, Sandra F., Wang, Qing
• Application Number:
  US13/953,209
• Publication Number:
  US 20140037120A1
• Time in Patent Office: Days
• US Class Current: 381/355
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 1/06 Arranging circuit leads; Relieving strain on circuit leads
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 23/00 Transducers other than those covered by groups H04R9/00 - H04R21/00 diaphragms for transducers of the distributed-mode type H04R7/045

Abstract

A Microelectromechanical system (MEMS) assembly includes a cover, a substrate, at least one wall disposed and between and attached to the cover and the substrate, a MEMS device disposed at the cover and an integrated circuit disposed at the substrate. The integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls. Alternatively, the MEMS device may be disposed on the substrate and the integrated circuit disposed on the base.

Claims

1. A Microelectromechanical system (MEMS) assembly comprising:

a cover;

a substrate;

at least one wall disposed and between and attached to the cover and the substrate;

a MEMS device disposed at the cover;

an integrated circuit disposed at the substrate;

such that the integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls.

2. The MEMS assembly of claim 1 wherein the MEMS device couples to the conduits via electrical conductors at the cover.

3. The MEMS assembly of claim 1 wherein the integrated circuit couples to the conduits via electrical conductors at the substrate.

4. The MEMS assembly of claim 1 wherein the substrate comprises a printed circuit board.

5. The MEMS assembly of claim 1 wherein the cover is constructed of a material comprising a metal or a ceramic.

6. A Microelectromechanical system (MEMS) assembly comprising:

a cover;

a substrate;

at least one wall disposed and between and attached to the cover and the substrate;

a MEMS device disposed at the substrate;

an integrated circuit disposed at the cover;

such that the integrated circuit and the MEMS device are disposed one over the other and electrically connected together at least in part by conduits that extend through the walls.

7. The MEMS assembly of claim 6 wherein the integrated circuit couples to the conduits via electrical conductors at the cover.

8. The MEMS assembly of claim 6 wherein the MEMS device couples to the conduits via electrical conductors at the substrate.

9. The MEMS assembly of claim 6 wherein the substrate comprises a printed circuit board.

10. The MEMS assembly of claim 6 wherein the cover is constructed of a material comprising a metal or a ceramic.