Housing And Method To Control Solder Creep On Housing
First Claim
Patent Images
1. An acoustic device, the device comprising:
- a substrate;
a substrate cover disposed on the substrate;
a plurality of electrical and acoustic components disposed on the substrate and under the substrate cover;
wherein the substrate cover is constructed of a base metal and wherein the substrate cover comprises a partially plating, the partial plating arrange so as to prevent solder creep along a surface of the substrate cover.
1 Assignment
0 Petitions
Accused Products
Abstract
An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.
-
Citations
18 Claims
-
1. An acoustic device, the device comprising:
-
a substrate; a substrate cover disposed on the substrate; a plurality of electrical and acoustic components disposed on the substrate and under the substrate cover; wherein the substrate cover is constructed of a base metal and wherein the substrate cover comprises a partially plating, the partial plating arrange so as to prevent solder creep along a surface of the substrate cover. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
-
10. A cover for an acoustic device, the cover comprising:
-
a base metal portion; and a plating disposed partially over the base metal portion, the plating arranged so as to prevent solder creep along a surface of the cover; wherein the cover is configured for attachment to the substrate of an acoustic device. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
-
Specification