Housing And Method To Control Solder Creep On Housing

• US 20140037124A1
• Filed: 07/24/2013
• Published: 02/06/2014
• Est. Priority Date: 07/27/2012
• Status: Active Grant

• Current Assignee: Knowles Electronics Llc (Knowles Corporation)
• Original Assignee: Knowles Electronics Llc (Knowles Corporation)
• Inventors: Friel, Kurt B., Lim, Tony K.
• Granted Patent: US 9,402,118 B2
• Time in Patent Office: Days
• US Class Current: 381/386
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16151 Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/02 Casings; Cabinets ; Supports therefor; Mountings therein H04R1/28 takes precedence ; attachments for microphones H04R1/08; mounting of transducers in earpieces H04R1/1075
• CPC Class Codes: H04R 1/083 Special constructions of mouthpieces
• CPC Class Codes: H04R 2201/003 Mems transducers or their use
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 3/3426 characterised by the leads
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

An acoustic device includes a substrate, a substrate cover, and a plurality of electrical and acoustic components. The substrate cover is disposed on the substrate and the plurality of electrical and acoustic components are disposed on the substrate and under the substrate cover. The substrate cover is constructed of a base metal and the substrate cover comprises a partially plating. The partial plating is arranged so as to prevent solder creep along a surface of the substrate cover.

Claims

1. An acoustic device, the device comprising:

a substrate;

a substrate cover disposed on the substrate;

a plurality of electrical and acoustic components disposed on the substrate and under the substrate cover;

wherein the substrate cover is constructed of a base metal and wherein the substrate cover comprises a partially plating, the partial plating arrange so as to prevent solder creep along a surface of the substrate cover.

2. The acoustic device of claim 1 wherein the base metal is brass.

3. The acoustic device of claim 1 wherein the partial plating is gold.

4. The acoustic device of claim 1 wherein the base metal is stainless steel.

5. The acoustic device of claim 1 wherein the partial plating is effective to prevent solder creep to a predetermined height of the substrate cover.

6. The acoustic device of claim 1 wherein the partial plating comprises approximately ¼

to ⅓

of the area of the cover.

7. The acoustic device of claim 1 wherein the partial plating is nickel.

8. The acoustic device of claim 1 wherein the surface of the substrate cover comprises an inner surface of the substrate cover.

9. The acoustic device of claim 1 wherein the surface of the substrate cover comprises an outer surface of the substrate cover.

10. A cover for an acoustic device, the cover comprising:

a base metal portion; and

a plating disposed partially over the base metal portion, the plating arranged so as to prevent solder creep along a surface of the cover;

wherein the cover is configured for attachment to the substrate of an acoustic device.

11. The cover of claim 10 wherein the base metal is brass.

12. The cover of claim 10 wherein the plating is gold.

13. The cover of claim 10 wherein the base metal is stainless steel.

14. The cover of claim 10 wherein the plating is effective to prevent solder creep to a predetermined height of the cover.

15. The cover of claim 10 wherein the plating comprises approximately ¼

to ⅓

of the area of the cover.

16. The cover of claim 10 wherein the partial plating is nickel.

17. The cover of claim 10 wherein the surface of the cover comprises an inner surface of the cover.

18. The cover of claim 10 wherein the surface of the cover comprises an outer surface of the cover.