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APPARATUS AND METHODS FOR MICROWAVE PROCESSING OF SEMICONDUCTOR SUBSTRATES

  • US 20140038431A1
  • Filed: 03/29/2012
  • Published: 02/06/2014
  • Est. Priority Date: 04/25/2011
  • Status: Active Grant
First Claim
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1. A chamber for processing a semiconductor substrate, comprising:

  • a thermal energy source disposed in the chamber;

    a microwave energy source disposed in the chamber; and

    a substrate support disposed between the thermal energy source and the microwave energy source.

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