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TIGHTLY-COUPLED NEAR-FIELD COMMUNICATION-LINK CONNECTOR-REPLACEMENT CHIPS

  • US 20140038521A1
  • Filed: 10/07/2013
  • Published: 02/06/2014
  • Est. Priority Date: 12/23/2008
  • Status: Active Grant
First Claim
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1. An electronic product, comprising:

  • a first substrate with a first conduction path disposed thereon;

    a second substrate with a second conduction path disposed thereon;

    a first near-field transmitter disposed on the first substrate and connected to the first conduction path, the first near-field transmitter operable to transmit a first carrier signal at a first transmit carrier frequency; and

    a first near-field receiver disposed on the second substrate and connected to the second conduction path, the first near-field receiver operable to near-field couple with the first near-field transmitter at the first transmit carrier frequency;

    wherein the first substrate and the second substrate are spaced apart relative to each other such that the first near-field transmitter and the first near-field receiver are disposed within a near-field coupling distance of each other at the first transmitter carrier frequency, wherein the first transmitter carrier frequency is in the extremely high frequency (EHF) range, wherein the first near-field transmitter is operable to translate a data signal from the first conduction path to a modulated carrier and the first near-field receiver is operable to translate the modulated carrier to a baseband signal on the second conduction path.

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