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STACKED MEMORY DEVICE WITH METADATA MANGEMENT

  • US 20140040698A1
  • Filed: 08/06/2012
  • Published: 02/06/2014
  • Est. Priority Date: 08/06/2012
  • Status: Active Grant
First Claim
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1. An integrated circuit (IC) package comprising:

  • memory cell circuitry; and

    a set of one or more logic layers electrically coupled to the memory cell circuitry, the set of one or more logic layers comprising a metadata manager and a memory interface, the memory interface coupled to the metadata manager and coupleable to a device external to the IC package, and the metadata manager to manage metadata stored at the IC package and which is associated with operational data stored at the memory cell circuitry for the device.

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