METHOD FOR MAKING A TWO-LAYER CAPACITIVE TOUCH SENSOR PANEL

• US 20140041904A1
• Filed: 02/10/2012
• Published: 02/13/2014
• Est. Priority Date: 02/11/2011
• Status: Abandoned Application

• Current Assignee: M-Solv Ltd.
• Original Assignee: M-Solv Ltd.
• Inventors: Pedder, James
• Application Number:
  US13/984,554
• Publication Number:
  US 20140041904A1
• Time in Patent Office: Days
• US Class Current: 174/251
• CPC Class Codes: G06F 2203/04103 Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: H05K 1/0298 Multilayer circuits
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602

Abstract

A method of fabricating a two-layer capacitive touch sensor panel comprising the following steps: a) depositing a first transparent electrically conductive layer on a transparent cover sheet; b) forming a pattern in the transparent electrically conductive layer to create a first set of discrete electrode structures; c) depositing a transparent dielectric layer over the discrete electrode structures; d) depositing a second transparent electrically conductive layer onto the transparent dielectric layer; e) forming a pattern in the transparent electrically conductive layer to create further discrete electrode structures by laser ablation, this pattern either not penetrating or penetrating only part way through the dielectric layer so as to avoid damaging the first set of discrete electrode structures; f) forming electrical connections or vias between the two transparent electrically conductive layers through the dielectric layer; and g) forming electrical connections between the transparent electrically conductive layer(s) and an electrical track or busbar formed at the periphery of the panel.) The method provides a maskless, chemical free way to fabricate a two-layer “cover integrated” sensor. A two-layer capacitive touch sensor panel fabricated by this method is also described

Claims

1. A method of fabricating a two-layer capacitive touch sensor panel comprising the following steps:

a) depositing a first transparent electrically conductive layer on a transparent cover sheet;

b) forming a first pattern in the first transparent electrically conductive layer to create a first set of discrete electrode structures therein;

c) depositing a transparent dielectric layer over the first discrete electrode structure of the first transparent electrically conductive layer;

d) depositing a second transparent electrically conductive layer onto the transparent dielectric layer;

e) forming a second pattern in the second transparent electrically conductive layer to create a second set of discrete electrode structures therein by laser ablation, the second pattern not penetrating or penetrating only part way through the dielectric layer so as not to damage the first set of discrete electrode structures;

f) forming electrical connections or vias between the first and second transparent electrically conductive layers through the dielectric layer; and

g) forming electrical connections between the first and/or second transparent electrically conductive layer and an electrical track or busbar formed at or adjacent the periphery of the panel.

2. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 1, wherein said first pattern is also formed by laser ablation.

3. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 1, wherein said forming of electrical connections or vias comprises the formation of holes though said dielectric layer by laser drilling.

4. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 1, wherein said forming of electrical connections or vias comprises depositing a layer of laser beam absorbing material onto the first electrically conductive layer prior to deposition of the dielectric layer in step (c) and, following step (c), subjecting said material to laser irradiation so that parts thereof are heated, so they expand and become detached from the first electrically conductive layer dielectric layer leaving a hole in said dielectric layer.

5. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 1, wherein said forming of electrical connections or vias comprises depositing a layer of laser beam absorbing material onto the dielectric layer prior to deposition of the second electrically conductive layer in step (d), subjecting said material to laser irradiation so that parts thereof are heated, so they expand and become detached from the dielectric layer leaving a hole in said dielectric layer.

6. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 1, wherein, following steps (a), (c) and (d), said forming of electrical connections or vias comprises subjecting areas of the panel to laser irradiation such that the second electrically conductive layer, the dielectric layer and the first electrically conductive layer are melted whereby melted portions of the first and second electrically conductive layers contact each other through the dielectric layer.

7. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 3 wherein a first layer of opaque material is deposited on the dielectric layer adjacent the edge of the panel and said laser drilling also forms holes through said opaque layer.

8. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 3 wherein, during deposition of the second transparent electrically conductive layer in step (d), material of said second transparent electrically conductive layer is deposited into said holes so as to contact the first transparent electrically conductive layer.

9. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 8 wherein a layer of opaque material is deposited over the second transparent electrically conductive layer in areas where it is deposited into said holes.

10. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 9 wherein holes are formed through said layer of opaque material by laser drilling and an electrical connection formed between said electrical track or busbar and the second transparent electrically conductive layer through said holes.

11. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 10 wherein said electrical connection includes opaque conductive material deposited into said holes.

12. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 10 wherein said electrical connection includes melting a portion of the electrical track or busbar so that it contacts the second transparent electrically conductive layer through the layer of opaque material.

13. The method of fabricating a two-layer capacitive touch sensor panel as claimed in claim 2 wherein the patterning of the first and second transparent electrically conductive lays and the formation of electrical connections or vias through the dielectric layer are carried out using laser writing processes so avoiding the need to use lithographic process involving chemical etching and masks.

14. A two-layer capacitive touch sensor panel comprising:

a transparent cover sheet;

a first transparent electrically conductive layer deposited on the transparent cover sheet;

a first pattern in the first transparent electrically conductive layer providing a first set of discrete electrode structures therein;

a transparent dielectric layer deposited over the first discrete electrode structure of the first transparent electrically conductive layer;

a second transparent electrically conductive layer deposited onto the transparent dielectric layer;

a second pattern in the second transparent electrically conductive layer formed by laser ablation to create a second set of discrete electrode structures therein, the second pattern not penetrating or penetrating only part way through the dielectric layer so as not to damage the first set of discrete electrode structures;

electrical connections or vias between the first and second transparent electrically conductive layers through the dielectric layer; and

electrical connections between the first and/or second transparent electrically conductive layer and an electrical track or busbar formed at or adjacent the periphery of the panel.

15. The two-layer capacitive touch sensor panel as claimed in claim 14 wherein the first and second set of discrete electrode structures in the first and second transparent electrically conductive layers and the electrical connections or vias through the dielectric layer are formed by laser writing processes.

16. The two-layer capacitive touch sensor panel as claimed in claim 14, wherein the materials used to form the first and second transparent electrically conductive layers are selected such, for a given laser wavelength, that the energy density required to ablate the second transparent electrically conductive layer is significantly lower than that required to ablate the first transparent electrically conductive layer.

17. The two-layer capacitive touch sensor panel as claimed in claim 14, wherein the materials used to form the dielectric layer is selected such that it partially absorbs laser radiation passing therethrough such that, during manufacture, the energy density passing through the dielectric layer to the first transparent electrically conductive layer is attenuated to a level below the ablation energy density of the first transparent electrically conductive layer.

18. The two-layer capacitive touch sensor panel as claimed in claim 14, wherein the transparent dielectric layer has a thickness of 10 μ

m or less.

19. The two-layer capacitive touch sensor panel as claimed in claim 14, wherein the first and or second patterns comprise grooves having a width of 10 μ

m or less.