ELECTROSTATIC CHUCK DEVICE

• US 20140042716A1
• Filed: 04/27/2012
• Published: 02/13/2014
• Est. Priority Date: 04/27/2011
• Status: Active Grant

• Current Assignee: Sumitomo Osaka Cement Company Limited
• Original Assignee: Sumitomo Osaka Cement Company Limited
• Inventors: Miura, Yukio, Ishimura, Kazunori, Kosakai, Mamoru
• Granted Patent: US 9,269,600 B2
• Time in Patent Office: Days
• US Class Current: 279/128
• CPC Class Codes: H01L 21/67103 mainly by conduction
• CPC Class Codes: H01L 21/6831 using electrostatic chucks
• CPC Class Codes: H01L 21/6833 Details of electrostatic chucks
• CPC Class Codes: Y10T 279/23 with magnetic or electrostatic means

Abstract

An electrostatic chuck device includes an electrostatic chuck section (2), which has a principal surface that is a mounting surface on which a plate-like sample (W) is placed, and has an internal electrode for electrostatic adsorption (13) incorporated in the section, and a temperature adjustment base section (3) which adjusts the temperature of the electrostatic chuck section (2); wherein a part or all of a surface of the temperature adjustment base section (3) is covered by a sheet-like or film-like insulating material (4) wherein the surface faces the side where the electrostatic chuck section is located; a thin plate-like heater element (5) is bonded on the insulating material (4); and the electrostatic chuck section (2) and the temperature adjustment base section (3) are integrated with each other via an organic insulating adhesive layer (6) formed by curing a liquid adhesive.

Claims

1. An electrostatic chuck device comprising:

an electrostatic chuck section which has a principal surface that is amounting surface on which a plate-like sample is placed, wherein the electrostatic chuck section comprises an internal electrode for electrostatic adsorption which is incorporated in the section, and

a temperature adjustment base section which adjusts the temperature of the electrostatic chuck section;

wherein

a part or all of a surface of the temperature adjustment base section is covered by a sheet-like or film-like insulating material, wherein the surface faces to the side where the electrostatic chuck section is located;

a thin plate-like heating member is bonded to a surface of the insulating material, wherein the surface faces to the side where the mounting surface exists; and

the electrostatic chuck section and the temperature adjustment base section are integrated with each other via an organic insulating adhesive layer formed by curing a liquid adhesive.

2. The electrostatic chuck device according to claim 1, wherein the heating member is a thin plate-like heater element made of nonmagnetic metal and having a thickness of 0.2 mm or less.

3. The electrostatic chuck device according to claim 1, wherein variation in the thickness of the insulating material is 10 μ

m or less.

4. The electrostatic chuck device according to claim 1, wherein the Shore hardness of the organic adhesive layer is A90 or less, and the thermal conductivity of the organic adhesive layer is 0.15 W/mk or more.

5. The electrostatic chuck device according to claim 1, wherein the thickness of the organic adhesive layer is 50 μ

m or more, and the Young'"'"'s modulus of a spacer which is disposed between the electrostatic chuck section and the heating member is 10 GPa or less.

6. The electrostatic chuck device according to claim 1, wherein the heat transfer coefficient between the heating member and the temperature adjustment base section is smaller than the heat transfer coefficient between the heating member and the electrostatic chuck section.