DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME

• US 20140043772A1
• Filed: 08/05/2013
• Published: 02/13/2014
• Est. Priority Date: 08/07/2012
• Status: Active Grant

• Current Assignee: Hosiden Corporation
• Original Assignee: Hosiden Corporation
• Inventors: ISODA, Takeshi, SHINODA, Koji
• Granted Patent: US 9,872,409 B2
• Time in Patent Office: Days
• US Class Current: 361/728
• CPC Class Codes: B29C 45/14467 Joining articles or parts of a single article B29C45/14377, B29C45/14385, B29C45/14581, B29C45/14614 and B29C45/006 take precedence
• CPC Class Codes: B29C 45/14639 for obtaining an insulating effect, e.g. for electrical components
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/49861 Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 13/04 Mounting of components , e.g. of leadless components
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.

Claims

1. A device module comprising:

a base;

a plastic part provided on the base;

a device provided on the base and embedded in the plastic part, the device being a sensor, an electronic device, or a circuit board; and

an external connection, the external connection including;

an embedded portion being connected to the device, extending along the base, and being embedded in the plastic part, and

a lead-out portion being contiguous with the embedded portion and led out of the plastic part.

2. The device module according to claim 1, wherein

the base includes a base body and an affixed portion, the base body being fixed to the plastic part, and the affixed portion being contiguous with the base body and not fixed to the plastic part, and

the lead-out portion is affixed to and extends along the affixed portion.

3. The device module according to claim 1, wherein

the plastic part includes a plastic body and a protruding portion contiguous with the plastic body, the plastic body being affixed to the base, and

the lead-out portion includes a fixed portion and a free portion contiguous with the fixed portion, the fixed portion being affixed to and extending along the protruding portion.

4. The device module according to claim 1, further comprising a protecting part configured to partially cover the lead-out portion.

5. The device module according to claim 4, wherein

the protecting part is contiguous with or affixed to the plastic part.

6. The device module according to claim 1, wherein

the lead-out portion is partially affixed to an outer face of the plastic part.

7. The device module according to claim 1, wherein

the base comprises at least one of a film and a plastic material.

8. The device module according to claim 1, wherein

the sensor is a film sensor, and

the external connection is of film shape to be provided integrally with the sensor.

9. A method of manufacturing a device module, the method comprising:

preparing a device, an external connection, and a base, the device being a sensor, an electronic device, or a circuit board, the external connection including a lead-out portion and an embedded portion, and the embedded portion being connected to the device;

affixing the device and the embedded portion of the external connection onto the base;

followed by placing the base, the device, and the embedded portion of the external connection in a cavity of first and second dies, and holding the lead-out portion of the external connection between the first and second dies or between the first die and the base; and

in this state, injecting a plastic material onto the base in the cavity to insert-mold the device and the embedded portion of the external connection in the plastic material.

10. The device module manufacturing method according to claim 9, wherein

the affixing of the embedded portion includes affixing the embedded portion in such a manner as to extend from the device on the base to an end of the base.

11. The device module manufacturing method according to claim 9, wherein

the base includes a base body and an affixed portion, the affixed portion being contiguous with the base body,

the affixing onto the base includes affixing the device and the embedded portion of the external connection onto the base body of the base and affixing the lead-out portion of the external connection onto the affixed portion of the base,

the placing in the cavity includes placing the base body of the base, the device, and the embedded portion of the external connection in the cavity,

the holding between the first and second dies includes holding the lead-out portion of the external connection and the affixed portion of the base between the first and second dies, and

the injection of the plastic material includes injecting the plastic material onto the base body of the base and thereby insert molding the device and the embedded portion of the external connection in the plastic material.

12. The device module manufacturing method according to claim 9, wherein

the lead-out portion includes a fixed portion contiguous with the embedded portion and a free portion contiguous with the fixed portion,

the placing in the cavity includes disposing the fixed portion of the lead-out portion along a wall of the cavity,

the holding between the first and second dies includes holding the free portion of the lead-out portion between the first and second dies, and

the injection of the plastic material includes injecting the plastic material onto the base in the cavity to insert-mold the device, the embedded portion of the external connection, and the fixed portion of the lead-out portion of the external connection in the plastic material.

13. The device module manufacturing method according to claim 9, wherein

the lead-out portion includes a fixed portion contiguous with the embedded portion and a free portion contiguous with the fixed portion,

the placing in the cavity includes disposing the fixed portion of the lead-out portion in midair in the cavity,

the holding between the first and second dies includes holding the free portion of the lead-out portion between the first and second dies, and

the injection of the plastic material includes injecting the plastic material onto the base in the cavity to insert-mold the device, the embedded portion of the external connection, and the fixed portion of the lead-out portion of the external connection in the plastic material.

14. The device module manufacturing method according to claim 9, wherein

the holding of the lead-out portion of the external connection between the first and second dies includes holding the lead-out portion also between the first die and the base.

15. A method of manufacturing a device module, the method comprising:

preparing an external connection, a device, a protecting part, and a base, the external connection including an embedded portion and a lead-out portion, and the device being a sensor, an electronic device, or a circuit board and connected to the embedded portion, and the protecting part partially covering the lead-out portion;

affixing the device and the embedded portion of the external connection onto the base;

placing the base, the device, and the embedded portion of the external connection into a cavity of first and second dies, and holding the protecting part between the first and second dies or between the first die and the base; and

in this state, injecting a plastic material onto the base in the cavity to insert-mold the device and the embedded portion of the external connection in the plastic material.

16. The device module manufacturing method according to claim 15, wherein

the holding of the protecting part includes disposing a part of the protecting part in the cavity, and

the injection of the plastic material includes affixing the part of the protecting part to the plastic material injected in the cavity.