DEVICE MODULE AND METHOD OF MANUFACTURING THE SAME
First Claim
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1. A device module comprising:
- a base;
a plastic part provided on the base;
a device provided on the base and embedded in the plastic part, the device being a sensor, an electronic device, or a circuit board; and
an external connection, the external connection including;
an embedded portion being connected to the device, extending along the base, and being embedded in the plastic part, anda lead-out portion being contiguous with the embedded portion and led out of the plastic part.
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Abstract
The invention provides a device module including a base, a plastic part, and an external connection. The plastic part is provided on the base. The device is provided on the base and embedded in the plastic part. The device is a sensor, an electronic device, or a circuit board. The external connection includes an embedded portion and a lead-out portion. The embedded portion is connected to the device, extends along the base, and is embedded in the plastic part. The lead-out portion is contiguous with the embedded portion and led out of the plastic part.
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Citations
16 Claims
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1. A device module comprising:
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a base; a plastic part provided on the base; a device provided on the base and embedded in the plastic part, the device being a sensor, an electronic device, or a circuit board; and an external connection, the external connection including; an embedded portion being connected to the device, extending along the base, and being embedded in the plastic part, and a lead-out portion being contiguous with the embedded portion and led out of the plastic part. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacturing a device module, the method comprising:
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preparing a device, an external connection, and a base, the device being a sensor, an electronic device, or a circuit board, the external connection including a lead-out portion and an embedded portion, and the embedded portion being connected to the device; affixing the device and the embedded portion of the external connection onto the base; followed by placing the base, the device, and the embedded portion of the external connection in a cavity of first and second dies, and holding the lead-out portion of the external connection between the first and second dies or between the first die and the base; and in this state, injecting a plastic material onto the base in the cavity to insert-mold the device and the embedded portion of the external connection in the plastic material. - View Dependent Claims (10, 11, 12, 13, 14)
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15. A method of manufacturing a device module, the method comprising:
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preparing an external connection, a device, a protecting part, and a base, the external connection including an embedded portion and a lead-out portion, and the device being a sensor, an electronic device, or a circuit board and connected to the embedded portion, and the protecting part partially covering the lead-out portion; affixing the device and the embedded portion of the external connection onto the base; placing the base, the device, and the embedded portion of the external connection into a cavity of first and second dies, and holding the protecting part between the first and second dies or between the first die and the base; and in this state, injecting a plastic material onto the base in the cavity to insert-mold the device and the embedded portion of the external connection in the plastic material. - View Dependent Claims (16)
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Specification