LIGHT-EMITTING DEVICE

• US 20140048824A1
• Filed: 01/16/2013
• Published: 02/20/2014
• Est. Priority Date: 08/15/2012
• Status: Abandoned Application

• Current Assignee: Epistar Corporation
• Original Assignee: Epistar Corporation
• Inventors: Hsieh, Min Hsun
• Application Number:
  US13/743,030
• Publication Number:
  US 20140048824A1
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: F21K 9/232 specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
• CPC Class Codes: F21V 3/00 Globes; Bowls; Cover glasses with refracting properties F21V5/00; with reflecting properties F21V7/00; characterised by cooling arrangements F21V29/506
• CPC Class Codes: F21W 2121/00 Use or application of lighting devices or systems for decorative purposes, not provided for in codes F21W2102/00 – F21W2107/00
• CPC Class Codes: F21Y 2107/00 Light sources with three-dimensionally disposed light-generating elements
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 2224/24137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/50 Wavelength conversion elements
• CPC Class Codes: H01L 33/504 Elements with two or more wavelength conversion materials
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A light-emitting device of an embodiment of the present application comprises optoelectronic units; a transparent structure having cavities configured to accommodate at least one of the optoelectronic units; and a conductive element connecting at least two of the optoelectronic units.

Claims

1. A light-emitting device, comprising:

optoelectronic units;

a transparent structure having cavities configured to accommodate at least one of the optoelectronic units; and

a conductive element connecting at least two of the optoelectronic units.

2. The light-emitting device of claim 1, wherein the conductive element has a portion arranged on the transparent structure between two of the cavities.

3. The light-emitting device of claim 1, wherein the transparent structure comprises an organic material, an inorganic material, or both thereof.

4. The light-emitting device of claim 1, wherein the transparent structure is flexible.

5. The light-emitting device of claim 1, wherein a melting point of the transparent structure is higher than an operation temperature of the light-emitting device.

6. The light-emitting device of claim 1, wherein the transparent structure comprises a rough surface having a protrusion corresponding to one of the optoelectronic units.

7. The light-emitting device of claim 1, further comprising a supporting structure formed on the transparent structure.

8. The light-emitting device of claim 7, wherein the supporting structure comprises one or more transparent materials.

9. The light-emitting device of claim 7, wherein the supporting structure has hardness greater than that of the transparent structure.

10. The light-emitting device of claim 7, wherein the supporting structure has a thickness between 100 μ

m and 700 μ

m.

11. The light-emitting device of claim 7, wherein the supporting structure has a rough surface.

12. The light-emitting device of claim 7, wherein the supporting structure comprises a protrusion corresponding to one of the optoelectronic units.

13. The light-emitting device of claim 1, further comprising a reflective layer formed on the transparent structure between two of the cavities.

14. The light-emitting device of claim 1, further comprising a first terminal and a second terminal which are arranged on one end of the transparent structure.

15. The light-emitting device of claim 1, further comprising a first wavelength converting material formed on one surface of the optoelectronic unit.

16. The light-emitting device of claim 15, wherein the first wavelength converting material comprises a yellow phosphor.

17. The light-emitting device of claim 15, further comprising a second wavelength converting material formed on another surface of the optoelectronic unit, wherein the second wavelength converting material is different from the first wavelength converting material.

18. The light-emitting device of claim 1, further comprising:

a tube inside which the transparent structure and the optoelectronic units are arranged.

19. The light-emitting device of claim 18, wherein an emanating side of the optoelectronic unit is parallel to a central axis of the tube.

20. The light-emitting device of claim 18, wherein an emanating side of the optoelectronic unit is perpendicular to a central axis of the tube.

21. The light-emitting device of claim 18, wherein the tube comprises a rough surface.

22. The light-emitting device of claim 18, wherein the tube is filled with air, a transparent material, or both thereof.

23. The light-emitting device of claim 18, further comprising a wavelength converting material formed between the tube and the optoelectronic units or formed on the tube.

24. The light-emitting device of claim 18, wherein the shape of the tube comprises blade-like shape, flower-like shape, branch-like shape, vein-like shape, cylinder shape, U-shape, or arc shape.

25. The light-emitting device of claim 18, further comprising a cover covering one or more tubes, wherein the cover comprises glass or plastic.

26. The light-emitting device of claim 24, wherein the tubes are arranged in a cone shape viewed from perspective.

27. The light-emitting device of claim 24, further comprising a circuit board and a plurality of sockets, wherein the socket comprises a tilted top surface.

28. The light-emitting device of claim 27, wherein the plurality of sockets is arranged in a polygon pattern.