LIGHT-EMITTING DEVICE

• US 20140048825A1
• Filed: 03/18/2013
• Published: 02/20/2014
• Est. Priority Date: 08/15/2012
• Status: Active Grant

• Current Assignee: Epistar Corporation (Ennostar, Inc.)
• Original Assignee: Epistar Corporation (Ennostar, Inc.)
• Inventors: Hsieh, Min Hsun, Liu, Hsin-Mao
• Granted Patent: US 9,356,070 B2
• Time in Patent Office: Days
• US Class Current: 257/88
• CPC Class Codes: G09G 3/32 semiconductive, e.g. using light-emitting diodes [LED]
• CPC Class Codes: H01L 2224/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 27/15 including semiconductor components having potential barriers, specially adapted for light emission
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0041 relating to wavelength conversion elements
• CPC Class Codes: H01L 2933/005 relating to encapsulations
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/385 the electrode extending at least partially onto a side surface of the semiconductor body
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

This disclosure discloses a light-emitting display module display. The light-emitting display module comprises: a board; and a plurality of light-emitting diode modules arranged in an array configuration on the board; wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other; and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting, and a fence; and wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.

Claims

1. A light-emitting display module, comprising:

a board; and

a plurality of light-emitting diode modules arranged in an array configuration on the board;

wherein one of the light-emitting diode modules comprises a plurality of encapsulated light-emitting units spaced apart from each other and one of the encapsulated light-emitting units comprises a plurality of optoelectronic units, a first supporting structure, and a fence; and

wherein the plurality of optoelectronic units are covered by the first supporting structure, and the fence surrounds the first supporting structure and the plurality of optoelectronic units.

2. The light-emitting display module of claim 1, wherein the light-emitting display module has a length of m*x and a width of n*y, wherein x is the length of the light-emitting diode module, y is the width of the light-emitting module, m and n are any positive integers.

3. The light-emitting display module of claim 2, wherein the light-emitting display module or the encapsulated light-emitting unit has an aspect ratio of 16:

9 or 4;

3.

4. The light-emitting display module of claim 1, wherein the optoelectronic units have a top side and a bottom side so that the first supporting structure covers the top side and the fence surrounds the optoelectronic units without covering the bottom side.

5. The light-emitting display module of claim 1, wherein the plurality of encapsulated light-emitting units are spaced apart from each other by a distance not greater than 0.6 mm.

6. The light-emitting display module of claim 1, wherein the one of the light-emitting diode modules comprises a first submount having a plurality of metal lines formed therein for electrically connected to the one of the encapsulated light-emitting units, and a second submount on which the first submount is disposed.

7. The light-emitting display module of claim 6, wherein the first submount comprises epoxy, bismaleimide triazine, polyimide resin, polytetrafluorethylene, Al₂O₃, MN, or AlSiC.

8. The light-emitting display module of claim 6, wherein the second submount comprises epoxy, bismaleimide triazine, polyimide resin, polytetrafluorethylene, Al₂O₃, AlN, or AlSiC.

9. The light-emitting display module of claim 6, wherein the first and second submount comprise the same material.

10. The light-emitting display module of claim 6, wherein the one of the light-emitting diode modules further comprises an integral circuit embedded within the second submount for electrically controlling the one of the encapsulated light-emitting units.

11. The light-emitting display module of claim 10, wherein the integral circuit is in a flip-chip form.

12. The light-emitting display module of claim 1, wherein the plurality of light-emitting diode modules is closely adjacent to one another.

13. The light-emitting display module of claim 1, wherein the one of the encapsulated light-emitting units further comprises a second supporting structure formed on the first supporting structure and the fence.

14. The light-emitting display module of claim 1, wherein the fence comprises a non-transparent material.

15. The light-emitting pixel unit of claim 1, wherein the one of the encapsulated light-emitting units has a size not greater than 0.1 mm³.

16. A encapsulated light-emitting unit, comprising:

a plurality of optoelectronic units, each of which having a bottom side and comprising a first pad and a second pad which are formed on the bottom side;

a first supporting structure enclosing the plurality of the optoelectronic units to expose the first pads and the second pads; and

a fence surrounding the first supporting structure and the plurality of the optoelectronic units without covering the bottom sides.

17. The encapsulated light-emitting unit of claim 16, wherein the fence comprises a non-transparent material.

18. The encapsulated light-emitting unit of claim 16, further comprising a second supporting structure formed on the transparent structure and the fence.