PACKAGE SUBSTRATE, MANUFACTURING METHOD THEREOF, AND MOLD THEREFOR

• US 20140048960A1
• Filed: 03/14/2013
• Published: 02/20/2014
• Est. Priority Date: 08/20/2012
• Status: Active Grant

• Current Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: YOO, Zin O
• Granted Patent: US 9,064,882 B2
• Time in Patent Office: Days
• US Class Current: 257/787
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81 using a bump connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 23/3107 the device being completely enclosed
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate

Abstract

There are provided a package substrate, a manufacturing method thereof, and a mold therefor. The method of manufacturing a package substrate includes: preparing a chip component and a substrate; mounting the chip component on a main surface of the substrate; preparing a mold having a cavity and protrusions formed on a ceiling surface thereof; disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity.

Claims

1. A method of manufacturing a package substrate, the method comprising:

preparing a chip component and a substrate;

mounting the chip component on a main surface of the substrate;

preparing a mold having a cavity and protrusions formed on a ceiling surface thereof;

disposing the substrate on a bottom surface of the mold such that the chip component is positioned within the cavity; and

forming a resin sealing body that collectively hermetically seals the chip component and the main surface of the substrate by injecting a pressurized liquid resin into the cavity.

2. The method of claim 1, wherein an opposite surface of the main surface of the substrate is in contact with the bottom surface of the mold.

3. The method of claim 1, wherein the protrusions are continuously formed on the ceiling surface.

4. The method of claim 1, wherein the protrusions are formed to be spaced apart from each other at a certain interval in a repetitive manner.

5. The method of claim 4, wherein the substrate with the chip component mounted thereon is disposed on the bottom surface of the mold such that the protrusions correspond to cutting lines of the substrate.

6. The method of claim 4, wherein the protrusions are formed to be longer than a space between the ceiling surface of the mold and the chip component disposed in the cavity and shorter than a space between the ceiling surface of the mold and the substrate disposed in the cavity.

7. The method of claim 1, further comprising cutting the resin sealing body and the substrate, after the forming of the resin sealing body.

8. The method of claim 1, wherein the mold has two opposing lateral surfaces and includes a gate formed on one of the two lateral surfaces and an air vent formed on the other of the two lateral surfaces, and

the resin is injected from the gate toward the air vent.

9. The method of claim 1, wherein a fixing unit of the substrate is provided on the bottom surface of the mold.

10. The method of claim 9, wherein the fixing unit is a mounting recess provided on the bottom surface of the mold, and

the substrate is disposed on the bottom surface of the mold so as to be mounted on the mounting recess.

11. A mold for manufacturing a package substrate, the mold comprising:

an upper mold; and

a lower mold combined to the upper mold to provide a cavity,

wherein the upper mold has protrusions formed on a ceiling surface thereof within the cavity.

12. The mold of claim 11, wherein the protrusions are continuously formed on the ceiling surface.

13. The mold of claim 11, wherein the protrusions are formed to be spaced apart from each other at a certain interval in a repetitive manner.

14. The mold of claim 13, wherein the protrusions are formed to be longer than a space between the ceiling surface of the upper mold and a chip component disposed in the cavity and shorter than a space between the ceiling surface of the upper mold and the substrate disposed in the cavity.

15. The mold of claim 11, wherein at least one of the upper mold and the lower mold has two opposing lateral surfaces and includes a gate formed on one of the two lateral surfaces and an air vent formed on the other of the two lateral surfaces.

16. The mold of claim 11, wherein a fixing unit of the substrate is provided on a bottom surface of the lower mold in the cavity.

17. The mold of claim 16, wherein the fixing unit is a mounting recess provided on the bottom surface of the lower mold.

18. A package substrate comprising:

a substrate;

a chip component mounted on one surface of the substrate; and

a resin sealing body hermetically sealing both the chip component and one surface of the substrate,

wherein formation protrusions or formation recesses are formed on a main surface of the resin sealing body.

19. The package substrate of claim 18, wherein the formation protrusions are continuously formed on the main surface of the resin sealing body.

20. The package substrate of claim 18, wherein the formation recesses are formed to be spaced apart from each other at a certain interval in a repetitive manner on the main surface of the resin sealing body.

21. The package substrate of claim 20, wherein portions of the resin sealing body where the formation recesses are formed correspond to cutting lines of the substrate.

22. The package substrate of claim 20, wherein the formation recesses are deeper than a space between an upper surface of the resin sealing body and an upper surface of the chip component sealed in the resin sealing body, and shallower than a space between the upper surface of the resin sealing body and an upper surface of the substrate.